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Produits Xilinx Inc.

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XCZU11EG-2FFVC1156E
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 344
XCZU6EG-L1FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock2 960
XCZU3EG-L1SBVA484I
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
paquet: 484-BBGA, FCBGA
Stock5 248
XCZU2CG-2SBVA484I
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
paquet: 484-BBGA, FCBGA
Stock5 888
hot XC7Z020-1CLG484I
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
paquet: 484-LFBGA, CSPBGA
Stock9 228
XC2V8000-4FFG1517C
Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 3096576
  • Number of I/O: 1108
  • Number of Gates: 8000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock2 528
XCV600E-7FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 444
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 480
hot XCV600-4FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 98304
  • Number of I/O: 444
  • Number of Gates: 661111
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 208
hot XCV400-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 81920
  • Number of I/O: 404
  • Number of Gates: 468252
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock6 384
hot XCV1000E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock5 680
XCVU7P-1FLVC2104E
Xilinx Inc.

XCVU7P-1FLVC2104E

  • Number of LABs/CLBs: 98520
  • Number of Logic Elements/Cells: 1724100
  • Total RAM Bits: 236134400
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 792
XC7VX690T-3FFG1926E
Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1926-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 784
XC7VX485T-2FFG1930I
Xilinx Inc.

IC FPGA 700 I/O 1930FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 700
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1930-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 448
XC6VSX315T-L1FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock6 528
XC6VHX250T-1FFG1154I
Xilinx Inc.

IC FPGA 320 I/O 1156FCBGA

  • Number of LABs/CLBs: 19680
  • Number of Logic Elements/Cells: 251904
  • Total RAM Bits: 18579456
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 168
hot XC2VP70-5FFG1517C
Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

  • Number of LABs/CLBs: 8272
  • Number of Logic Elements/Cells: 74448
  • Total RAM Bits: 6045696
  • Number of I/O: 964
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock11 364
XC7K410T-3FBG676E
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock5 920
hot XC2VP40-5FG676C
Xilinx Inc.

IC FPGA 416 I/O 676FBGA

  • Number of LABs/CLBs: 4848
  • Number of Logic Elements/Cells: 43632
  • Total RAM Bits: 3538944
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock13 944
XC4VLX25-12SF363C
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
paquet: 363-FBGA, FCBGA
Stock4 768
XC2VP7-6FG456C
Xilinx Inc.

IC FPGA 248 I/O 456FBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 248
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock6 912
XA7A15T-2CSG324I
Xilinx Inc.

IC FPGA 210 I/O 324BGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock4 720
hot XC3S200-4TQ144C
Xilinx Inc.

IC FPGA 97 I/O 144TQFP

  • Number of LABs/CLBs: 480
  • Number of Logic Elements/Cells: 4320
  • Total RAM Bits: 221184
  • Number of I/O: 97
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock12 348
XC7VX485T-1FFG1157I
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock6 544
XCR3064XL-7PC44C
Xilinx Inc.

IC CPLD 64MC 7NS 44PLCC

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
paquet: 44-LCC (J-Lead)
Stock6 640
XC95144-7PQ160C
Xilinx Inc.

IC CPLD 144MC 7.5NS 160QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 144
  • Number of Gates: 3200
  • Number of I/O: 133
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
paquet: 160-BQFP
Stock5 760
hot XC95108-20PQ100C
Xilinx Inc.

IC CPLD 108MC 20NS 100QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 6
  • Number of Macrocells: 108
  • Number of Gates: 2400
  • Number of I/O: 81
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
paquet: 100-BQFP
Stock4 880
hot XCR3128XL-6TQG144C
Xilinx Inc.

IC CPLD 128MC 144TQFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 5.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 108
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock3 680
XC7S50-1FGGA484Q
Xilinx Inc.

XC7S50-1FGGA484Q

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
paquet: 484-BBGA, FCBGA
Stock7 888