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Produits Xilinx Inc.

Dossiers 7 167
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XC17S30XLVOG8C
Xilinx Inc.

IC PROM SERIAL 3.3V 300K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 300kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock6 496
hot XC17S10XLPD8C
Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 100kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock10 332
XCZU19EG-3FFVC1760E
Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock3 120
XCZU4EG-2FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock4 960
XCZU2EG-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock5 760
XC6SLX45T-4FGG484C
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock6 832
XC2V1500-5FGG676I
Xilinx Inc.

IC FPGA 392 I/O 676FBGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 884736
  • Number of I/O: 392
  • Number of Gates: 1500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock2 240
hot XC2S200E-6PQG208C
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 146
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock14 352
XCV150-5FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock3 968
XC4010E-2PQ208I
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 608
XC3090L-8PC84I
Xilinx Inc.

IC FPGA 70 I/O 84PLCC

  • Number of LABs/CLBs: 320
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 64160
  • Number of I/O: 70
  • Number of Gates: 6000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: 84-LCC (J-Lead)
Stock5 184
XC7VX690T-2FF1157I
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 696
XCKU115-1FLVA2104I
Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Total RAM Bits: 77721600
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock3 088
XC6VLX550T-2FF1760C
Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 1200
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock7 616
XC4VLX100-11FFG1513C
Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

  • Number of LABs/CLBs: 12288
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4423680
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1513-BBGA, FCBGA
  • Supplier Device Package: 1513-FCBGA (40x40)
paquet: 1513-BBGA, FCBGA
Stock3 552
hot XC4VFX60-11FF1152I
Xilinx Inc.

IC FPGA 576 I/O 1152FCBGA

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock6 592
XC7K325T-3FBG676E
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 928
XC7A200T-2FFV1156I
Xilinx Inc.

XC7A200T-2FFV1156I

  • Number of LABs/CLBs: 16825
  • Number of Logic Elements/Cells: 215360
  • Total RAM Bits: 13455360
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 984
XQ4VSX35-DIE4058
Xilinx Inc.

IC FPGA VIRTEX-4 35K DIE

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 34560
  • Total RAM Bits: 3538944
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock3 536
hot XC4VLX25-11SFG363C
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
paquet: 363-FBGA, FCBGA
Stock14 148
XC7K70T-2FBG484C
Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

  • Number of LABs/CLBs: 5125
  • Number of Logic Elements/Cells: 65600
  • Total RAM Bits: 4976640
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
paquet: 484-BBGA, FCBGA
Stock6 352
hot XC6SLX100-2FGG676C
Xilinx Inc.

IC FPGA 480 I/O 676FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock15 312
XC7A35T-2CSG324C
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33208
  • Total RAM Bits: 1843200
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock6 048
hot XC2S150-5FGG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 150000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock5 248
hot XC2S30-5TQG144I
Xilinx Inc.

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 972
  • Total RAM Bits: 24576
  • Number of I/O: 92
  • Number of Gates: 30000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock21 660
XC3S50-4TQ144I
Xilinx Inc.

IC FPGA 97 I/O 144TQFP

  • Number of LABs/CLBs: 192
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 73728
  • Number of I/O: 97
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock3 584
hot XC2C128-7CPG132I
Xilinx Inc.

IC CPLD 128MC 7NS 132CSBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 100
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
paquet: 132-TFBGA, CSPBGA
Stock72 696
XC7A12T-L2CPG238E
Xilinx Inc.

XC7A12T-L2CPG238E

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 737280
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
paquet: 238-LFBGA, CSPBGA
Stock4 032