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Produits Xilinx Inc.

Dossiers 7 167
Page  33/256
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XCMECH-FF324
Xilinx Inc.

FF324 MECH SAMPLE OPEN O/E

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 456
hot XC1736EVOG8C
Xilinx Inc.

IC PROM SERIAL 36K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock19 920
XC17S10XLVO8C
Xilinx Inc.

IC 3V PROM SER 10K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 100kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock2 800
XCZU7EG-3FFVC1156E
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 504
hot XC7Z035-1FBG676C
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock5 056
XC2V80-5CSG144C
Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

  • Number of LABs/CLBs: 128
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 147456
  • Number of I/O: 92
  • Number of Gates: 80000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock3 024
hot XCS05XL-5VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock5 488
XC4036XL-2HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 256
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
paquet: 304-BFQFP Exposed Pad
Stock2 496
XC4010XL-09BG256C
Xilinx Inc.

IC FPGA 160 I/O 256BGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
paquet: 256-BBGA
Stock7 280
hot XC4010E-3BG225C
Xilinx Inc.

IC FPGA 160 I/O 225BGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-BBGA
  • Supplier Device Package: 225-PBGA (27x27)
paquet: 225-BBGA
Stock5 168
XC5VFX200T-1FFG1738C
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock5 136
hot XC5VFX100T-1FFG1738I
Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 102400
  • Total RAM Bits: 8404992
  • Number of I/O: 680
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock16 116
XC7K410T-2FBG900I
Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 120
XC6VCX75T-1FFG484I
Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock7 152
XC2VP4-7FG256C
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 752
  • Number of Logic Elements/Cells: 6768
  • Total RAM Bits: 516096
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock3 232
hot XC2VP2-6FG456C
Xilinx Inc.

IC FPGA 156 I/O 456FBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock6 432
hot XC3S1400A-4FGG676I
Xilinx Inc.

IC FPGA 502 I/O 676FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 502
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock3 376
hot XC3S2000-5FG676C
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 5120
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 737280
  • Number of I/O: 489
  • Number of Gates: 2000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 288
XA6SLX25-2FGG484I
Xilinx Inc.

IC FPGA 266 I/O 484FGGBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 266
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock3 888
XA3S400A-4FTG256I
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 195
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock2 400
hot XC6SLX25-N3CSG324I
Xilinx Inc.

IC FPGA 226 I/O 324CSBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 226
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock5 920
XC2S150-6FGG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 150000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock2 992
hot XC2S50-6TQ144C
Xilinx Inc.

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 92
  • Number of Gates: 50000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock8 004
hot XC6SLX45-2FGG484I
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 316
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock24 564
XC2C384-7TQ144C
Xilinx Inc.

IC CPLD 384MC 7.1NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.1ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 118
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock2 544
hot XC95144XL-7TQ100I
Xilinx Inc.

IC CPLD 144MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 144
  • Number of Gates: 3200
  • Number of I/O: 81
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-LQFP
Stock5 584
hot XC9572XL-7VQG44I
Xilinx Inc.

IC CPLD 72MC 7.5NS 44VQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
paquet: 44-TQFP
Stock8 700
XC7S15-1CSGA225C
Xilinx Inc.

XC7S15-1CSGA225C

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 368640
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock7 760