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Produits Xilinx Inc.

Dossiers 7 167
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hot XC17S40PD8C
Xilinx Inc.

IC PROM PROG C-TEMP 5V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 400kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock8 304
XC17S15ASO20I
Xilinx Inc.

IC PROM SER 5000 I-TEMP 20-SOIC

  • Programmable Type: OTP
  • Memory Size: 150kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock5 024
hot XC1736EPC20I
Xilinx Inc.

IC PROM SER I-TEMP 36K 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
paquet: 20-LCC (J-Lead)
Stock14 472
XC7Z100-1FFG1156I
Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 1156BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock2 304
XC6SLX75-N3FG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock3 792
hot XCV600E-6HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 158
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock7 344
XCV3200E-6CG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156CBGA

  • Number of LABs/CLBs: 16224
  • Number of Logic Elements/Cells: 73008
  • Total RAM Bits: 851968
  • Number of I/O: 804
  • Number of Gates: 4074387
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BCBGA
  • Supplier Device Package: 1156-CBGA (35x35)
paquet: 1156-BCBGA
Stock6 528
hot XCV300-4PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock8 124
XC4020E-1PG223C
Xilinx Inc.

IC FPGA 192 I/O 223CPGA

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 192
  • Number of Gates: 20000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 223-BCPGA
  • Supplier Device Package: 223-CPGA (47.25x47.25)
paquet: 223-BCPGA
Stock6 944
XC3190A-3PC84C
Xilinx Inc.

IC FPGA 70 I/O 84PLCC

  • Number of LABs/CLBs: 320
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 64160
  • Number of I/O: 70
  • Number of Gates: 6000
  • Voltage - Supply: 4.25 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: 84-LCC (J-Lead)
Stock2 128
XC7VX485T-3FFG1157E
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 008
XCKU085-2FLVF1924E
Xilinx Inc.

IC FPGA 624 I/O 1924FCBGA

  • Number of LABs/CLBs: 62190
  • Number of Logic Elements/Cells: 1088325
  • Total RAM Bits: 58265600
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock7 968
5962-9957201QYC
Xilinx Inc.

IC FPGA 2.5V HIREL VIRTEX 300

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 162
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 228-CQFP
  • Supplier Device Package: 228-CQFP (65.53x65.53)
paquet: 228-CQFP
Stock6 912
XC5VLX50-3FFG676C
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 3600
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 1769472
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock3 648
XC2VP4-6FG256C
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 752
  • Number of Logic Elements/Cells: 6768
  • Total RAM Bits: 516096
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock2 896
XC2VP2-5FGG256I
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock4 096
XC7A50T-L1CPG236I
Xilinx Inc.

IC FPGA ARTIX7 106 I/O 236BGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
paquet: 238-LFBGA, CSPBGA
Stock3 072
hot XC3S500E-5FT256C
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 190
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 448
XC7A15T-2CSG325I
Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 150
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 325-CSBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock7 264
hot XC2S200-5FGG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 200000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 448
hot XC95288XV-7TQ144C
Xilinx Inc.

IC CPLD 288MC 7.5NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 2.37 V ~ 2.62 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 117
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock15 288
XCR3256XL-12CS280I
Xilinx Inc.

IC CPLD 256MC 10.8NS 280CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 10.8ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 280-TFBGA, CSPBGA
  • Supplier Device Package: 280-CSBGA (16x16)
paquet: 280-TFBGA, CSPBGA
Stock7 552
XC2C256-7PQ208I
Xilinx Inc.

IC CPLD 256MC 6.7NS 208QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 173
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 960
hot XCR3128XL-10CS144C
Xilinx Inc.

IC CPLD 128MC 9.1NS 144BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 108
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock16 524
hot XC9572XL-10VQ64C
Xilinx Inc.

IC CPLD 72MC 10NS 64VQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 52
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP
  • Supplier Device Package: 64-VQFP (10x10)
paquet: 64-TQFP
Stock33 468
XCVU5P-3FLVA2104E
Xilinx Inc.

XCVU5P-3FLVA2104E

  • Number of LABs/CLBs: 75072
  • Number of Logic Elements/Cells: 1313763
  • Total RAM Bits: 190976000
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock3 616
XCVU190-H1FLGB2104E
Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

  • Number of LABs/CLBs: 134280
  • Number of Logic Elements/Cells: 2349900
  • Total RAM Bits: 150937600
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock5 728
XCDAISY-FF1924
Xilinx Inc.

XCDAISY-FF1924

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 936