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Produits Xilinx Inc.

Dossiers 7 167
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hot XC18V512SO20I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 20-SOIC

  • Programmable Type: In System Programmable
  • Memory Size: 512kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock17 976
hot XCF08PVOG48C
Xilinx Inc.

IC PROM SRL 1.8V 8M GATE 48TSOP

  • Programmable Type: In System Programmable
  • Memory Size: 8Mb
  • Voltage - Supply: 1.65 V ~ 2 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 48-TFSOP (0.724", 18.40mm Width)
  • Supplier Device Package: 48-TSOP
paquet: 48-TFSOP (0.724", 18.40mm Width)
Stock113 772
XCZU7EG-2FFVC1156I
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 920
XCZU5EG-3SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock4 912
XCZU4EV-2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 200
XC7Z015-2CLG485E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 485BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 766MHz
  • Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 485-CSBGA (19x19)
paquet: 484-LFBGA, CSPBGA
Stock3 744
XC7Z015-1CLG485I
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 485BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 485-CSBGA (19x19)
paquet: 484-LFBGA, CSPBGA
Stock2 816
hot XC2V4000-4FF1152I
Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

  • Number of LABs/CLBs: 5760
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 2211840
  • Number of I/O: 824
  • Number of Gates: 4000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock6 464
XC2V40-5CSG144I
Xilinx Inc.

IC FPGA 88 I/O 144CSBGA

  • Number of LABs/CLBs: 64
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 73728
  • Number of I/O: 88
  • Number of Gates: 40000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock2 112
hot XC3S50-4CPG132I
Xilinx Inc.

IC FPGA 89 I/O 132CSBGA

  • Number of LABs/CLBs: 192
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 73728
  • Number of I/O: 89
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
paquet: 132-TFBGA, CSPBGA
Stock6 256
hot XCV600-5FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 98304
  • Number of I/O: 444
  • Number of Gates: 661111
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 384
XCV400-6HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 81920
  • Number of I/O: 166
  • Number of Gates: 468252
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock6 976
XC4062XL-1BG560I
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 384
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock2 416
hot XC4005XL-3PQ208C
Xilinx Inc.

IC FPGA 112 I/O 208QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock4 704
hot XC4008E-4PQ208C
Xilinx Inc.

IC FPGA 144 I/O 208QFP

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 770
  • Total RAM Bits: 10368
  • Number of I/O: 144
  • Number of Gates: 8000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 600
XCVU095-1FFVC1517I
Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

  • Number of LABs/CLBs: 67200
  • Number of Logic Elements/Cells: 1176000
  • Total RAM Bits: 62259200
  • Number of I/O: 520
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock7 664
XC6VHX565T-1FFG1923C
Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

  • Number of LABs/CLBs: 44280
  • Number of Logic Elements/Cells: 566784
  • Total RAM Bits: 33619968
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 656
XQ6VLX240T-1RF784I
Xilinx Inc.

IC FPGA VIRTEX 6 241K 784-BGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: -
paquet: 784-BBGA, FCBGA
Stock4 272
XCKU5P-2SFVB784I
Xilinx Inc.

XCKU5P-2SFVB784I

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 35737600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 024
XC7K325T-1FFV900I
Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock3 296
hot XC4VFX60-10FFG1152I
Xilinx Inc.

IC FPGA 576 I/O 1152FCBGA

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock10 404
hot XC2VP30-6FFG896I
Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 556
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
paquet: 896-BBGA, FCBGA
Stock6 400
XQ6SLX75T-3FGG676I
Xilinx Inc.

IC FPGA SPARTAN 6 75K 676BGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.2 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock4 032
XC2VP2-6FF672I
Xilinx Inc.

IC FPGA 204 I/O 672FCBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 204
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
paquet: 672-BBGA, FCBGA
Stock2 928
XC7A200T-1SBG484C
Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

  • Number of LABs/CLBs: 16825
  • Number of Logic Elements/Cells: 215360
  • Total RAM Bits: 13455360
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
paquet: 484-BBGA, FCBGA
Stock4 288
hot XC9572-15PCG44C
Xilinx Inc.

IC CPLD 72MC 15NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
paquet: 44-LCC (J-Lead)
Stock19 092
hot XC2C256-6FT256C
Xilinx Inc.

IC CPLD 256MC 5.7NS 256BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 184
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock8 220
hot XC2C32A-6CP56C
Xilinx Inc.

IC CPLD 32MC 5.5NS 56BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.5ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 750
  • Number of I/O: 33
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-LFBGA, CSPBGA
  • Supplier Device Package: 56-CSBGA (6x6)
paquet: 56-LFBGA, CSPBGA
Stock8 172