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Produits Xilinx Inc.

Dossiers 7 167
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XC17S05PD8C
Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 50kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock5 232
XCZU17EG-3FFVD1760E
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 816
XC7Z035-2FFG900E
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock7 680
XC7Z010-2CLG225E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 225BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 766MHz
  • Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock5 856
XQ4VLX25-10FF668I
Xilinx Inc.

IC FPGA VIRTEX-4 24K 668-FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
paquet: 668-BBGA, FCBGA
Stock5 856
XA3S500E-4PQG208Q
Xilinx Inc.

IC FPGA 158 I/O 208QFP

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 158
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock5 088
XA3S400-4PQG208I
Xilinx Inc.

IC FPGA 141 I/O 208QFP

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 141
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock2 704
hot XCV400E-7PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 163840
  • Number of I/O: 158
  • Number of Gates: 569952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock5 888
XCV100-4TQ144C
Xilinx Inc.

IC FPGA 98 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 98
  • Number of Gates: 108904
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock6 128
hot XCS20XL-4VQ100I
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 77
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock6 752
XC4028XL-2HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
paquet: 304-BFQFP Exposed Pad
Stock5 088
hot XC4028XL-1HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 193
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock3 760
XC4005E-2PQ208I
Xilinx Inc.

IC FPGA 112 I/O 208QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 192
XCVU7P-1FLVB2104I
Xilinx Inc.

XCVU7P-1FLVB2104I

  • Number of LABs/CLBs: 98520
  • Number of Logic Elements/Cells: 1724100
  • Total RAM Bits: 236134400
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 384
XCKU115-3FLVB1760E
Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Total RAM Bits: 77721600
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock3 328
XC6VLX550T-2FF1759E
Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock3 392
XCKU9P-L2FFVE900E
Xilinx Inc.

XCKU9P-L2FFVE900E

  • Number of LABs/CLBs: 34260
  • Number of Logic Elements/Cells: 599550
  • Total RAM Bits: 32870400
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 616
XQL4VFX60-9FF672I4095
Xilinx Inc.

IC FPGA VIRTEX-4FX 60K 672BGA

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: 352
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
paquet: 672-BBGA, FCBGA
Stock6 336
hot XC4VLX40-10FFG1148I
Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

  • Number of LABs/CLBs: 4608
  • Number of Logic Elements/Cells: 41472
  • Total RAM Bits: 1769472
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
paquet: 1148-BBGA, FCBGA
Stock8 196
XC6SLX100-L1FGG676I
Xilinx Inc.

IC FPGA 480 I/O 676FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock5 392
XC6SLX25-N3FT256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock4 496
hot XC3S200-5PQ208C
Xilinx Inc.

IC FPGA 141 I/O 208QFP

  • Number of LABs/CLBs: 480
  • Number of Logic Elements/Cells: 4320
  • Total RAM Bits: 221184
  • Number of I/O: 141
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock4 352
hot XC3S200A-4VQG100C
Xilinx Inc.

IC FPGA 68 I/O 100VQFP

  • Number of LABs/CLBs: 448
  • Number of Logic Elements/Cells: 4032
  • Total RAM Bits: 294912
  • Number of I/O: 68
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock38 904
hot XC95144XL-5TQG144C
Xilinx Inc.

IC CPLD 144MC 5NS 144TQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 144
  • Number of Gates: 3200
  • Number of I/O: 117
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock5 936
hot XC2C256-7VQG100C
Xilinx Inc.

IC CPLD 256MC 6.7NS 100VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 80
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock52 740
XCKU15P-2FFVE1760I
Xilinx Inc.

XCKU15P-2FFVE1760I

  • Number of LABs/CLBs: 65340
  • Number of Logic Elements/Cells: 1143450
  • Total RAM Bits: 82329600
  • Number of I/O: 668
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock7 600
XCKU3P-L1FFVD900I
Xilinx Inc.

XCKU3P-L1FFVD900I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock7 952
XCKU3P-L1FFVA676I
Xilinx Inc.

XCKU3P-L1FFVA676I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 048