Produits NXP

PHU66NQ03LT,127

NXP

MOSFET N-CH 25V 66A SPT533

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 12nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 860pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 93W (Tc)
• Rds On (Max) @ Id, Vgs: 10.5 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: I-Pak
• Package / Case: TO-251-3 Short Leads, IPak, TO-251AA

paquet: TO-251-3 Short Leads, IPak, TO-251AA

BB156,135

NXP

DIODE VAR CAP 10V 20MA SOD323

• Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
• Capacitance Ratio: 3.9
• Capacitance Ratio Condition: C1/C7.5
• Voltage - Peak Reverse (Max): 10V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-76, SOD-323
• Supplier Device Package: SOD-323

paquet: SC-76, SOD-323

74LVT1403DR,112

NXP

IC BUFFER/DRIVER 32TSSOP

• Logic Type: Driver/Receiver
• Supply Voltage: 2.7 V ~ 3.6 V
• Number of Bits: 12
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

HEF4011UBT,652

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Max): 4µA
• Current - Output High, Low: 3mA, 3mA
• Logic Level - Low: 1 V ~ 2.5 V
• Logic Level - High: 4 V ~ 12.5 V
• Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

paquet: 14-SOIC (0.154", 3.90mm Width)

N74F541D,602

NXP

IC BUFF/DVR TRI-ST 8BIT 20SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

paquet: 20-SOIC (0.295", 7.50mm Width)

MCZ33287EG

NXP

IC DRIVER DUAL LOSIDE MON 20SOIC

• Applications: Automotive
• Interface: -
• Voltage - Supply: 5V, 12V
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC
• Mounting Type: Surface Mount

paquet: 20-SOIC (0.295", 7.50mm Width)

PCA9703PW,112

NXP

IC SPI GPI 16-BIT 24TSSOP

• Number of I/O: 16 (Input Only)
• Interface: SPI Serial
• Interrupt Output: Yes
• Features: -
• Output Type: Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 5MHz
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

paquet: 24-TSSOP (0.173", 4.40mm Width)

MCZ33897EFR2

NXP

IC TXRX CAN SGL WIRE 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 500mV
• Data Rate: 83.33Kbps
• Voltage - Supply: 12V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

paquet: 14-SOIC (0.154", 3.90mm Width)

TJA1054T/N,118

NXP

IC TXRX CAN 14BIT 5V 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

SGTL5000XNLA3R2

NXP

IC AUDIO CODEC STEREO 20-QFN

• Type: Stereo Audio
• Data Interface: I2C, Serial, SPI?
• Resolution (Bits): -
• Number of ADCs / DACs: 1 / 1
• Sigma Delta: No
• S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
• Dynamic Range, ADCs / DACs (db) Typ: -
• Voltage - Supply, Analog: 1.62 V ~ 3.6 V
• Voltage - Supply, Digital: 1.1 V ~ 2 V, 1.62 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-QFN Exposed Pad (3x3)

paquet: 20-UFQFN Exposed Pad

MPC8572ECVTARLD

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

MPC8544AVTANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC8544EVJALFA

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MCIMX27LMOP4AR2

NXP

IC MPU I.MX27 400MHZ 473MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SAHARAH2
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
• Package / Case: 473-LFBGA
• Supplier Device Package: -

paquet: 473-LFBGA

LH7A404N0F092B3;55

NXP

IC MCU 32BIT ROMLESS 324LFBGA

• Core Processor: ARM9?
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-LFBGA (17x17)

paquet: 324-LFBGA

MC9S08DV32MLH

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MCHC711KS2MFNE4

NXP

IC MCU 8BIT 32KB OTP 68PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: 640 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

paquet: 68-LCC (J-Lead)

P87C52SBPN,112

NXP

IC MCU 8BIT 8KB OTP 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

paquet: 40-DIP (0.600", 15.24mm)

MC9S08AC60CFGER

NXP

IC MCU 8BIT 60KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

MKL05Z32VFM4R

NXP

IC MCU 32BIT 32KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 14x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

MK20DX256VLQ10

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

DSPB56720AG

NXP

AUDIO PROCESSOR SYMPH 144-LQFP

• Type: Audio Processor
• Interface: Host Interface, I2C, SAI, SPI
• Clock Rate: 200MHz
• Non-Volatile Memory: External
• On-Chip RAM: 744kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

PCK946BD,151

NXP

IC CLK BUFFER 2:10 150MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Divider, Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:10
• Differential - Input:Output: No/No
• Input: LVCMOS, LVTTL
• Output: CMOS
• Frequency - Max: 150MHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

LM75ADP,118

NXP

SENSOR TEMPERATURE I2C 8TSSOP

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C
• Voltage - Supply: 2.8 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

PN5120A0HN1/C1,151

NXP

IC TRANSMISSION MOD 32-HVQFN

• Type: RFID Reader/Transponder
• Frequency: 13.56MHz
• Standards: FeliCa, ISO 14443, MIFARE, NFC
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 90°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

T4081NSE7TTB

NXP

QORIQ 64B POWER 8X 1.8GHZ THRE

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

SAF7751HN-N207W-MP

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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A3T19H455W23SR6

NXP

RF MOSFET LDMOS 30V ACP1230S-4

• Transistor Type: LDMOS
• Frequency: 1.93GHz ~ 1.99GHz
• Gain: 16.4dB
• Voltage - Test: 30 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 540 mA
• Power - Output: 81W
• Voltage - Rated: 65 V
• Package / Case: ACP-1230S-4L2S
• Supplier Device Package: ACP-1230S-4L2S

paquet: -

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