Page 914 - Produits NXP | Heisener Electronics
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Produits NXP

Dossiers 26 590
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LD6816CX4/20H,315
NXP

IC REG LINEAR 2V 150MA 4WLCSP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 2V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.075V @ 150mA
  • Current - Output: 150mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature, Transient Voltage
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, WLCSP
  • Supplier Device Package: 4-WLCSP (0.76x0.76)
paquet: 4-XFBGA, WLCSP
Stock4 480
TEA1892ATS/1H
NXP

IC SECONDARY SIDE CTRLR 6TSOP

  • Applications: Secondary-Side Controller, Synchronous Rectifier
  • Voltage - Input: -
  • Voltage - Supply: 8.5 V ~ 38 V
  • Current - Supply: 1mA
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SC-74, SOT-457
  • Supplier Device Package: 6-TSOP
paquet: SC-74, SOT-457
Stock4 032
MC33909L3AD
NXP

SBC 3V 1CAN 0LIN 6SG HLQFP48

  • Applications: System Basis Chip
  • Current - Supply: 7mA
  • Voltage - Supply: 3.5 V ~ 28 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 904
NX5P3201CUKAZ
NXP

NX5P3201CUK/UNCASED/REEL7 IN Q2/

  • Switch Type: USB Switch
  • Number of Outputs: 2
  • Ratio - Input:Output: 1:1
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: Parallel
  • Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V
  • Voltage - Supply (Vcc/Vdd): Not Required
  • Current - Output (Max): 3A, 6A
  • Rds On (Typ): 8 mOhm, 32 mOhm
  • Input Type: Non-Inverting
  • Features: Slew Rate Controlled, Status Flag
  • Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 30-UFBGA, WLCSP
  • Supplier Device Package: 30-WLCSP (2.26x2.56)
paquet: 30-UFBGA, WLCSP
Stock6 880
HEC4093BT-Q100J
NXP

IC GATE NAND 4CH 2-INP 14-SO

  • Logic Type: NAND Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: Schmitt Trigger
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): 1µA
  • Current - Output High, Low: 3.4mA, 3.4mA
  • Logic Level - Low: 1.5 V ~ 4 V
  • Logic Level - High: 3.5 V ~ 11 V
  • Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-SO
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
paquet: 14-SOIC (0.154", 3.90mm Width)
Stock6 192
HEF4073BP,652
NXP

IC GATE AND 3CH 3-INP 14-DIP

  • Logic Type: AND Gate
  • Number of Circuits: 3
  • Number of Inputs: 3
  • Features: -
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): 4µA
  • Current - Output High, Low: 3mA, 3mA
  • Logic Level - Low: 1.5 V ~ 4 V
  • Logic Level - High: 3.5 V ~ 11 V
  • Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
paquet: 14-DIP (0.300", 7.62mm)
Stock7 408
SA58631TK,157
NXP

IC AMP AUDIO 3W MONO AB 8HVSON

  • Type: Class AB
  • Output Type: 1-Channel (Mono)
  • Max Output Power x Channels @ Load: 3W x 1 @ 8 Ohm
  • Voltage - Supply: 2.2 V ~ 18 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 8-HVSON (4x4)
  • Package / Case: 8-VDFN Exposed Pad
paquet: 8-VDFN Exposed Pad
Stock3 712
PCA9673D,118
NXP

IC I/O EXPANDER I2C 16B 24SOIC

  • Number of I/O: 16
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 1MHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
paquet: 24-SOIC (0.295", 7.50mm Width)
Stock20 676
hot MC145026DR2
NXP

IC ENCODER 9 LINE SMPLX 16-SOIC

  • Type: Encoder, Decoder
  • Applications: Remote Control
  • Voltage - Supply, Analog: 2.5 V ~ 18 V
  • Voltage - Supply, Digital: 2.5 V ~ 18 V
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOG
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock5 648
MCIMX251AJM4
NXP

IC MPU I.MX25 400MHZ 400MAPBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: LPDDR, DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock6 512
MPC8548VTAVHB
NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock5 936
hot MPC8321CVRADDC
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock6 896
hot MC7457RX1267LC
NXP

IC MPU MPC74XX 1.267GHZ 483BGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.267GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 483-BCBGA, FCCBGA
  • Supplier Device Package: 483-FCCBGA (29x29)
paquet: 483-BCBGA, FCCBGA
Stock8 340
MC9S08DN60MLC
NXP

IC MCU 8BIT 60KB FLASH 32LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 25
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock6 784
MCF51QM128VHSR
NXP

IC MCU 32BIT 128KB FLASH 44LGA

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 31
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 2x16b, 12x16b, D/A 1x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 44-VFLGA
  • Supplier Device Package: 44-MAPLGA (5x5)
paquet: 44-VFLGA
Stock6 208
MSC7112VF1000
NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

  • Type: SC1400 Core
  • Interface: Host Interface, I2C, UART
  • Clock Rate: 266MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 208kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.20V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock7 584
hot MPXA4100AC6U
NXP

PRESSURE SENS 16.7PSI MAX 8-SOP

  • Pressure Type: Absolute
  • Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
  • Output Type: Analog Voltage
  • Output: 0.3 V ~ 49 V
  • Accuracy: ±1.8%
  • Voltage - Supply: 4.85 V ~ 5.35 V
  • Port Size: Male - 0.13" (3.17mm) Tube
  • Port Style: Barbless
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 58.02 PSI (400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SMD, Gull Wing, Top Port
  • Supplier Device Package: -
paquet: 8-SMD, Gull Wing, Top Port
Stock15 972
MF3DH4201DUD/00V
NXP

MIFARE DESFIRE EV2

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock5 796
JN5148/J01,518
NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

  • Type: TxRx + MCU
  • RF Family/Standard: 802.15.4
  • Protocol: Zigbee?
  • Modulation: O-QPSK
  • Frequency: 2.4GHz
  • Data Rate (Max): 667kbps
  • Power - Output: 2.75dBm
  • Sensitivity: -96.5dBm
  • Memory Size: 128kB ROM, 128kB RAM
  • Serial Interfaces: I2C, JTAG, SPI, UART
  • GPIO: 21
  • Voltage - Supply: 2 V ~ 3.6 V
  • Current - Receiving: 17.5mA
  • Current - Transmitting: 15mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 56-VFQFN Exposed Pad
paquet: 56-VFQFN Exposed Pad
Stock5 238
1323XNSK-BDM
NXP

1323X_NETWORK_BDM

  • Type: Transceiver; 802.15.4
  • Frequency: 2.4GHz
  • For Use With/Related Products: MC1323x
  • Supplied Contents: 8 Boards, Cables, Power Supply, Accessories
paquet: -
Stock8 730
hot MKS22FN256VLL12
NXP

KINETIS S 32-BIT MCU ARM CORTEX

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 1x16b. D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock40 800
LPC51U68JBD64QL
NXP

32-BIT ARM CORTEX-M0+

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: Flexcomm, I²C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 48
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock20 388
MIMX9302DVVXDAB
NXP

IC

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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FC32K144HAT0MLHT
NXP

S32K144 32-BIT MCU, ARM CORTEX-M

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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S9S12VR64AAMLC
NXP

IC MCU 16BIT 64KB FLASH 32LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
  • Data Converters: A/D 2x10b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: -
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MFS2601AMDA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
paquet: -
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FB32K148HET0MLQR
NXP

S32K148 32-BIT MCU, ARM CORTEX-

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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TDA8596TH-N1S-118
NXP

IC AUDIO AMP BTL 4X45W 36HSOP

  • Type: -
  • Output Type: -
  • Max Output Power x Channels @ Load: -
  • Voltage - Supply: -
  • Features: -
  • Mounting Type: -
  • Operating Temperature: -
  • Supplier Device Package: -
  • Package / Case: -
paquet: -
Request a Quote