Produits NXP

PHD82NQ03LT,118

NXP

MOSFET N-CH 30V 75A DPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.5V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 16.7nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 1620pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 136W (Tc)
• Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: DPAK
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

paquet: TO-252-3, DPak (2 Leads + Tab), SC-63

BFR93AW,115

NXP

TRANS NPN 12V 35MA 5GHZ SOT323

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 5GHz
• Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
• Current - Collector (Ic) (Max): 35mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

paquet: SC-70, SOT-323

SE97TP,128

NXP

IC TEMP SENSOR DIMM 3.3V 8-HWSON

• Function: Temp Monitoring System (Sensor), DIMM DDR Memory
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Accuracy: ±3°C
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Output Type: 2-Wire Serial, I2C/SMBUS
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-HWSON (2x3)

paquet: 8-WFDFN Exposed Pad

MC33970DWR2

NXP

IC MOTOR DRIVER SPI 24SOIC

• Motor Type - Stepper: Bipolar
• Motor Type - AC, DC: -
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (8)
• Interface: SPI
• Technology: -
• Step Resolution: -
• Applications: Automotive
• Current - Output: 40mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Voltage - Load: 6.5 V ~ 26 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC

paquet: 24-SOIC (0.295", 7.50mm Width)

SSL21153T/1,118

NXP

IC LED DRIVER RGLTR 1.5A 7SOIC

• Type: DC DC Regulator
• Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 1
• Voltage - Supply (Min): -
• Voltage - Supply (Max): 35V
• Voltage - Output: -
• Current - Output / Channel: 1.5A (Switch)
• Frequency: 50.5kHz
• Dimming: -
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
• Supplier Device Package: 7-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width) 7 leads

PCA9551PW,118

NXP

IC LED DRVR PS DIM 25MA 16TSSOP

• Type: Power Switch
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 8
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 25mA
• Frequency: 400kHz
• Dimming: PWM
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

TEA1733BT/N2,118

NXP

IC CTRL SMPS 8SO

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 20.6V
• Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
• Duty Cycle: 72%
• Frequency - Switching: 123kHz
• Power (Watts): 75W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

paquet: 8-SOIC (0.154", 3.90mm Width)

74HCT10N,652

NXP

IC GATE NAND 3CH 3-INP 14-DIP

• Logic Type: NAND Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: 4mA, 4mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

paquet: 14-DIP (0.300", 7.62mm)

TDA18292HN/C1,118

NXP

IC TV SILICON TUNER 32-HVQFN

• Type: Tuner
• Applications: Mobile Phones, Cellular, Video Displays
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

MC68LC302CAF16CT

NXP

IC MPU M683XX 16MHZ 100LQFP

• Core Processor: M68000
• Number of Cores/Bus Width: 1 Core, 8/16-Bit
• Speed: 16MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

LPC1768UKJ

NXP

IC MCU 32BIT 512KB FLASH 100BGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

paquet: 100-TFBGA

P89LPC920FN,112

NXP

IC MCU 8BIT 2KB FLASH 20DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

paquet: 20-DIP (0.300", 7.62mm)

MC908GR16AVFAE

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MC908QL4MDWE

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

MVF61NS152CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 500MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D Dual x 12b, D/A Dual x 12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

SPC5748GK1MMJ6

NXP

IC MCU 32BIT 6MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

paquet: 256-LBGA

MK20DX128ZVLQ10

NXP

IC MCU 32BIT 128KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

MK40DX128VMD10

NXP

IC MCU 32BIT 128KB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 98
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

paquet: 144-LBGA

MC9S12E128CFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

MC88915TFN160

NXP

IC DRIVER CLK PLL 160MHZ 28-PLCC

• Type: Clock Driver, Fanout Distribution, Multiplexer
• PLL: Yes
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 3:8
• Differential - Input:Output: No/No
• Frequency - Max: 160MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

paquet: 28-LCC (J-Lead)

MPL015A2

NXP

IC BAROMETER I2C DGTL MINI 8-LGA

• Pressure Type: Absolute
• Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
• Output Type: I2C
• Output: 10 b
• Accuracy: ±0.145 PSI (±1 kPa)
• Voltage - Supply: 2.375 V ~ 5.5 V
• Port Size: -
• Port Style: No Port
• Features: Shutdown Mode
• Termination Style: PCB
• Maximum Pressure: 145.04 PSI (1000 kPa)
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-TLGA
• Supplier Device Package: 8-LGA

paquet: 8-TLGA

MW4IC001NR4

NXP

IC RF PWR AMP 26V 900MW 1.5-PLD

• Frequency: 800MHz ~ 2.1GHz
• P1dB: 29.3dBm (850mW)
• Gain: 13dB
• Noise Figure: -
• RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
• Voltage - Supply: 26V
• Current - Supply: 12mA
• Test Frequency: 2.17GHz
• Package / Case: PLD-1.5
• Supplier Device Package: PLD-1.5

paquet: PLD-1.5

SPC5675KFAVMM2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z7d
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
• Data Converters: A/D 22x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

paquet: 257-LFBGA

SP5747CHK0AVMJ6R

NXP

DUAL CORE 4M FLASH 512K RAM F

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

paquet: 256-LBGA

MC33PF8200DFES

NXP

I.MX8QXP WITH DDR3L

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

paquet: 56-VFQFN Exposed Pad

S32G254ASBK1VUCR

NXP

S32G254A ARM CORTEX-M7 AND -A53,

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L, LPDDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1/2.5Gbps (4)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

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LPC1830FET256

NXP

IC MCU 32BIT ROMLESS 256LBGA

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 164
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
• Data Converters: A/D 8x10bSAR; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-LBGA (17x17)

paquet: -

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BAP51-05W

NXP

PIN DIODE, 50V V(BR), SILICON

• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 50 mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 240 mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SC-70

paquet: -

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