Produits NXP

2PA1774Q,115

NXP

TRANS PNP 50V 0.15A SC-75

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 150mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
• Power - Max: 150mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

paquet: SC-75, SOT-416

2N5064,112

NXP

THYRISTOR 8A 200V TO-92

• Voltage - Off State: 200V
• Voltage - Gate Trigger (Vgt) (Max): 800mV
• Current - Gate Trigger (Igt) (Max): 200µA
• Voltage - On State (Vtm) (Max): 1.71V
• Current - On State (It (AV)) (Max): 510mA
• Current - On State (It (RMS)) (Max): 800mA
• Current - Hold (Ih) (Max): 5mA
• Current - Off State (Max): 10µA
• Current - Non Rep. Surge 50, 60Hz (Itsm): 10A @ 60Hz
• SCR Type: Sensitive Gate
• Operating Temperature: -65°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA)

NE57810S/N1,518

NXP

IC DDR TERMINATION SPAK-5

• Applications: Converter, DDR
• Voltage - Input: 1.6 V ~ 3.6 V
• Number of Outputs: 1
• Voltage - Output: -
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: SPak-5 (5 leads + Tab)
• Supplier Device Package: 5-SPAK

paquet: SPak-5 (5 leads + Tab)

PCF1252-2T/F4,118

NXP

IC VOLT DETECT W/RESET 8SOIC

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High
• Reset Timeout: 400 µs Minimum
• Voltage - Threshold: 4.25V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

MC33143DW

NXP

IC SWITCH DUAL H-SIDE 24-SOIC

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 9 V ~ 17 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 140 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC

paquet: 24-SOIC (0.295", 7.50mm Width)

74ABT540DB,112

NXP

IC BUFF INVERT 5.5V 20SSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.209", 5.30mm Width)

TDA8950J/N1,112

NXP

IC AMP AUDIO PWR 340W STER 23SIL

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 340W x 1 @ 8 Ohm; 170W x 2 @ 4 Ohm
• Voltage - Supply: ±12.5 V ~ 40 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

paquet: 23-SIP Formed Leads

PCA9537DP,118

NXP

IC I/O EXPANDER I2C 4B 10TSSOP

• Number of I/O: 4
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

SC16IS760IBS,157

NXP

IC UART 64BYTE 24HVQFN

• Protocol: RS232, RS485
• Function: Controller
• Interface: I2C, SPI, UART
• Standards: -
• Voltage - Supply: 2.5V, 3.3V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 95°C
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

paquet: 24-VFQFN Exposed Pad

NX3L2267GU,115

NXP

IC ANALOG SWITCH SPDT 10-XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 90 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 37pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.4x1.8)

paquet: 10-XFQFN

MPC8572EVTAVNE

NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

MC8641DVU1000GC

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

paquet: 1023-BCBGA, FCCBGA

P2041NXN7MMC

NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

paquet: 780-BBGA, FCBGA

MCIMX6L3DVN10AB

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

paquet: 432-TFBGA

P89LPC9221FN,112

NXP

IC MCU 8BIT 8KB FLASH 20DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

paquet: 20-DIP (0.300", 7.62mm)

MMC2114CFCPU33

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

TDA8754HL/11/C1,55

NXP

IC TRPL 8BIT VIDEO ADC 144LQFP

• Type: ADC, Video
• Number of Channels: -
• Resolution (Bits): 8 b
• Sampling Rate (Per Second): 110M
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -10°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

PESD5V0V4UG,115

NXP

TVS DIODE 5VWM 13VC SOT353

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 5V (Max)
• Voltage - Breakdown (Min): 6.4V
• Voltage - Clamping (Max) @ Ipp: 13V
• Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
• Power - Peak Pulse: 16W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 12pF @ 1MHz
• Operating Temperature: -65°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: SOT-353

paquet: 5-TSSOP, SC-70-5, SOT-353

OM7606/BGA2712

NXP

EVAL BOARD FOR BGA2712

• Type: Amplifier
• Frequency: 1GHz ~ 3.2GHz
• For Use With/Related Products: BGA2712
• Supplied Contents: Board

paquet: -

A7101CHUK/T0BC2HAZ

NXP

SECURITY IC STD TEMP WLCSP

• Applications: Authentication
• Core Processor: MX51
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: I²C
• Number of I/O: -
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -25°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 12-UFBGA, WLCSP
• Supplier Device Package: 12-WLCSP (2.06x2.02)

paquet: 12-UFBGA, WLCSP

MMPF0100FCAEPR2

NXP

POWER MANAGEMENT IC I.MX6 NO-P

• Applications: -
• Voltage - Input: -
• Number of Outputs: -
• Voltage - Output: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

LS1012ASE7HKB

NXP

LS1012A ST WE 800MHZ RV2

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 211-VFLGA
• Supplier Device Package: 211-FCLGA (9.6x9.6)

paquet: 211-VFLGA

SAF4000EL-101Z23BY

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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S32G398AACK1VUCT

NXP

IC MPU S32G3 1.3GZ/400MHZ 525BGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
• Speed: 400MHz, 1.3GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

LPC1114FHN33-301K

NXP

IC MCU 32BIT 32KB FLASH 32HVQFN

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

paquet: -

MC20XS4200DFKR2

NXP

HIGH-SIDE SWITCH, 24V, DUAL 20MO

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8V ~ 36V
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Current - Output (Max): 4.4A
• Rds On (Typ): 20mOhm (Max)
• Input Type: Non-Inverting
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

paquet: -

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S912ZVML32AMKHR

NXP

S12Z CORE, 32K FLASH, LIN, 64LQF

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 9x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-HLQFP (10x10)

paquet: -

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MPC880CVR133-NXP

NXP

POWERQUICC 32 BIT POWER ARCHITEC

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10Mbps (2), 10/100Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: Cryptography
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: -

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