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Produits NXP

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PDTA123TE,115
NXP

TRANS PREBIAS PNP 150MW SC75

  • Transistor Type: PNP - Pre-Biased
  • Current - Collector (Ic) (Max): 100mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
  • Current - Collector Cutoff (Max): 1µA
  • Frequency - Transition: -
  • Power - Max: 150mW
  • Mounting Type: Surface Mount
  • Package / Case: SC-75, SOT-416
  • Supplier Device Package: SC-75
paquet: SC-75, SOT-416
Stock4 240
PCF1252-1T/F4,118
NXP

IC VOLT DETECT W/RESET 8SOIC

  • Type: Simple Reset/Power-On Reset
  • Number of Voltages Monitored: 1
  • Output: Push-Pull, Totem Pole
  • Reset: Active High
  • Reset Timeout: 400 µs Minimum
  • Voltage - Threshold: 4.55V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock5 888
MC33880PEWR2
NXP

IC SRL SWITCH OCT W/SPI 32SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 8
  • Ratio - Input:Output: 1:8
  • Output Configuration: High Side or Low Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 5.5 V ~ 24.5 V
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Current - Output (Max): 800mA
  • Rds On (Typ): 550 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
paquet: 32-SOIC (0.295", 7.50mm Width)
Stock7 200
74LV595N,112
NXP

IC 8BIT SHIFT REGISTER 16-DIP

  • Logic Type: Shift Register
  • Output Type: Tri-State
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Function: Serial to Parallel, Serial
  • Voltage - Supply: 1 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock7 360
74ABT841PW,112
NXP

IC 10BIT BUS INTFC LATCH 24TSSOP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 10:10
  • Output Type: Tri-State
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 4ns
  • Current - Output High, Low: 32mA, 64mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock2 640
74LVT32DB,118
NXP

IC GATE OR 4CH 2-INP 14-SSOP

  • Logic Type: OR Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: -
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Current - Quiescent (Max): -
  • Current - Output High, Low: 20mA, 32mA
  • Logic Level - Low: 0.8V
  • Logic Level - High: 2V
  • Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-SSOP
  • Package / Case: 14-SSOP (0.209", 5.30mm Width)
paquet: 14-SSOP (0.209", 5.30mm Width)
Stock3 328
74ABT16273DL,118
NXP

IC D-TYPE POS TRG DUAL 48SSOP

  • Function: Master Reset
  • Type: D-Type
  • Output Type: Non-Inverted
  • Number of Elements: 2
  • Number of Bits per Element: 8
  • Clock Frequency: 240MHz
  • Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Iq): 1mA
  • Input Capacitance: 4pF
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-BSSOP (0.295", 7.50mm Width)
paquet: 48-BSSOP (0.295", 7.50mm Width)
Stock6 992
SA58672UK,027
NXP

IC AMP AUDIO 3W MONO D 9WLCSP

  • Type: Class D
  • Output Type: 1-Channel (Mono)
  • Max Output Power x Channels @ Load: 3W x 1 @ 4 Ohm
  • Voltage - Supply: 2 V ~ 5.5 V
  • Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 9-WLCSP (1.66x1.71)
  • Package / Case: 9-UFBGA, WLCSP
paquet: 9-UFBGA, WLCSP
Stock23 112
PCA9518D,118
NXP

IC I2C BUS HUB 5-CH 20SOIC

  • Applications: Buffer
  • Interface: I2C, SMBus
  • Voltage - Supply: 3 V ~ 3.6 V
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
  • Mounting Type: Surface Mount
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock5 664
PX1011B-EL1/G,557
NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

  • Applications: PCI Express MAX to PCI Express PHY
  • Interface: JTAG
  • Voltage - Supply: 1.2V
  • Package / Case: 81-LFBGA
  • Supplier Device Package: 81-LFBGA (9x9)
  • Mounting Type: Surface Mount
paquet: 81-LFBGA
Stock6 656
UJA1075ATW/3V3,118
NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

  • Applications: Automotive
  • Interface: CAN, LIN
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Stock3 264
P2010NSN2KHC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock2 208
P1010NSE5HHB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC 4.4
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
paquet: 425-FBGA
Stock2 432
hot P1021NXE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock4 112
hot MCR705JP7CDWE
NXP

IC MCU 8BIT 6KB OTP 28SOIC

  • Core Processor: HC05
  • Core Size: 8-Bit
  • Speed: 2.1MHz
  • Connectivity: SIO
  • Peripherals: POR, Temp Sensor, WDT
  • Number of I/O: 22
  • Program Memory Size: 6KB (6K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 224 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock47 484
MC9S12GC96CPBE
NXP

IC MCU 16BIT 96KB FLASH 52LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 35
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 52-LQFP
  • Supplier Device Package: 52-LQFP (10x10)
paquet: 52-LQFP
Stock5 744
MC68HC908QY4MDT
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
paquet: 16-TSSOP (0.173", 4.40mm Width)
Stock3 568
MCF51EM128CLK
NXP

IC MCU 32BIT 128KB FLASH 80LQFP

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LCD, LVD, PWM, WDT
  • Number of I/O: 56
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 12x16b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (14x14)
paquet: 80-LQFP
Stock4 992
PRTR5V0U6S,118
NXP

TVS DIODE 3VWM 8SOIC

  • Type: Steering (Rail to Rail)
  • Unidirectional Channels: 6
  • Bidirectional Channels: -
  • Voltage - Reverse Standoff (Typ): 3V
  • Voltage - Breakdown (Min): -
  • Voltage - Clamping (Max) @ Ipp: -
  • Current - Peak Pulse (10/1000µs): -
  • Power - Peak Pulse: -
  • Power Line Protection: Yes
  • Applications: -
  • Capacitance @ Frequency: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock8 838
MC13226VR2
NXP

IC RF TXRX+MCU 802.15.4 145TFLGA

  • Type: TxRx + MCU
  • RF Family/Standard: 802.15.4
  • Protocol: Zigbee?
  • Modulation: O-QPSK
  • Frequency: 2.4GHz
  • Data Rate (Max): 250kbps
  • Power - Output: 4dBm
  • Sensitivity: -100dBm
  • Memory Size: 128kB Flash, 80kB ROM, 96kB SRAM
  • Serial Interfaces: I2C, I2S, JTAG, SPI, UART
  • GPIO: 64
  • Voltage - Supply: 2 V ~ 3.6 V
  • Current - Receiving: 22mA ~ 24mA
  • Current - Transmitting: 29mA
  • Operating Temperature: -40°C ~ 105°C
  • Package / Case: 145-TFLGA
paquet: 145-TFLGA
Stock6 966
OM7814/BGU7004/FE,598
NXP

RF EVAL FOR BGU7004

  • Type: Amplifier, GPS
  • Frequency: 1575.42MHz
  • For Use With/Related Products: BGU7004
  • Supplied Contents: Board
paquet: -
Stock4 446
MMPF0100F8AZES
NXP

POWER MANAGEMENT IC I.MX6 NO-P

  • Applications: -
  • Voltage - Input: -
  • Number of Outputs: -
  • Voltage - Output: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 848
LS1046ASN8T1A
NXP

QORIQ LAYERSCAPE 4XA72 64BIT ARM

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 496
MCIMX6D5EZK08AD
NXP

I.MX 6 SERIES 32-BIT MPU DUAL A

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 569-LFBGA
  • Supplier Device Package: 569-MAPBGA (12x12)
paquet: 569-LFBGA
Stock3 424
MKV10Z64VLF7P
NXP

KV11 128 RP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 75MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 40
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 2x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock4 992
S9S12GN16AMLFR
NXP

16-BIT16K FLASH2K RAM

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock7 152
MC33PT2001HMAER2
NXP

PROGRAMMABLE SOLENOID CONTROLLER

  • Applications: Solenoid Controller
  • Current - Supply: -
  • Voltage - Supply: 0V ~ 72V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-HLQFP (10x10)
paquet: -
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FG32K146HAT0MLHR
NXP

IC

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote