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Produits NXP

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MRF7S27130HSR5
NXP

FET RF 65V 2.7GHZ NI-780S

  • Transistor Type: LDMOS
  • Frequency: 2.7GHz
  • Gain: 16.5dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.5A
  • Power - Output: 23W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
paquet: NI-780S
Stock7 152
BB145B,115
NXP

DIODE VAR CAP 6V SOD-523

  • Capacitance @ Vr, F: 2.95pF @ 4V, 1MHz
  • Capacitance Ratio: 2.2
  • Capacitance Ratio Condition: C1/C4
  • Voltage - Peak Reverse (Max): 6V
  • Diode Type: Single
  • Q @ Vr, F: -
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-79, SOD-523
  • Supplier Device Package: SOD-523
paquet: SC-79, SOD-523
Stock22 104
TDA3681ATH/N1C,512
NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

  • Applications: Ignition Buffer, Regulator
  • Current - Supply: 110µA
  • Voltage - Supply: 9.5 V ~ 18 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Stock2 256
hot MCZ33742EG
NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

  • Applications: Automotive
  • Current - Supply: 42mA
  • Voltage - Supply: 5.5 V ~ 18 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock21 444
TEA1713T/N1,518
NXP

IC CTLR RESONANT PFC 24SOIC

  • Mode: Discontinuous Conduction (DCM)
  • Frequency - Switching: 125kHz
  • Current - Startup: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
paquet: 24-SOIC (0.295", 7.50mm Width)
Stock2 400
TEA1750T/N1,518
NXP

IC PFC CONTROLLER DCM16SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): No
  • Voltage - Breakdown: 650V
  • Topology: Flyback
  • Voltage - Start Up: 22V
  • Voltage - Supply (Vcc/Vdd): 15 V ~ 38 V
  • Duty Cycle: -
  • Frequency - Switching: 125kHz
  • Power (Watts): 250W
  • Fault Protection: Current Limiting, Over Temperature, Over Voltage
  • Control Features: -
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
  • Mounting Type: Surface Mount
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock3 328
74HC670D,652
NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

  • Logic Type: Register File
  • Output Type: Tri-State
  • Number of Elements: 1
  • Number of Bits per Element: 4
  • Function: Universal
  • Voltage - Supply: 2 V ~ 6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock7 424
74HCT163N,652
NXP

IC SYNC 4BIT BINARY COUNT 16-DIP

  • Logic Type: Binary Counter
  • Direction: Up
  • Number of Elements: 1
  • Number of Bits per Element: 4
  • Reset: Synchronous
  • Timing: Synchronous
  • Count Rate: 45MHz
  • Trigger Type: Positive Edge
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock3 760
TDA18250BHN/C1K
NXP

IC TUNER CABLE/STB 32HVQFN

  • Type: Tuner
  • Applications: Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
paquet: 32-VFQFN Exposed Pad
Stock269 106
TDA8566TH1/N2S,118
NXP

IC AMP AUDIO BTL CAR 55W 24HSOP

  • Type: Class B
  • Output Type: 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 24-HSOP
  • Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
paquet: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Stock3 296
UJA1069TW24/3V3:51
NXP

IC LIN FAIL-SAFE 24-HTSSOP

  • Applications: Automotive
  • Interface: LIN (Local Interconnect Network)
  • Voltage - Supply: 3.3V
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Supplier Device Package: 24-HTSSOP
  • Mounting Type: Surface Mount
paquet: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Stock4 784
MPC8535BVTANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock2 608
KMPC8270CVRMIBA
NXP

IC MPU MPC82XX 266MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock2 800
MCIMX6U7CVM08AB
NXP

IC MPU I.MX6DL 800MHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
paquet: 624-LFBGA
Stock6 800
hot MCIMX353DJQ5C
NXP

IC MPU I.MX35 532MHZ 400MAPBGA

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 532MHz
  • Co-Processors/DSP: Multimedia; GPU, IPU, VFP
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, KPP, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock28 728
hot MCHC908QY1MDWE
NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock6 480
MC68HC908QY1CP
NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock7 168
LPC1768FET100,551
NXP

IC MCU 32BIT 512KB FLASH 100BGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 8x12b, D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
paquet: 100-TFBGA
Stock16 506
KMC8113TMP4800V
NXP

IC DSP 300/400MHZ 431FCBGA

  • Type: SC140 Core
  • Interface: Ethernet, I2C, TDM, UART
  • Clock Rate: 400MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 1.436MB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.10V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 431-BFBGA, FCBGA
  • Supplier Device Package: 431-FCPBGA (20x20)
paquet: 431-BFBGA, FCBGA
Stock7 104
TDA8763AM/3/C5,118
NXP

IC ADC 10BIT HS 28SSOP

  • Number of Bits: 10
  • Sampling Rate (Per Second): 30M
  • Number of Inputs: 1
  • Input Type: Single Ended
  • Data Interface: Parallel
  • Configuration: ADC
  • Ratio - S/H:ADC: -
  • Number of A/D Converters: 1
  • Architecture: Sigma-Delta
  • Reference Type: External
  • Voltage - Supply, Analog: 5V
  • Voltage - Supply, Digital: 5V
  • Features: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 28-SSOP
  • Mounting Type: -
paquet: 28-SSOP (0.209", 5.30mm Width)
Stock3 088
IP4357CX17,135
NXP

IC ESD PROTECT HS MMC 17CSP

  • Type: -
  • Unidirectional Channels: -
  • Bidirectional Channels: -
  • Voltage - Reverse Standoff (Typ): -
  • Voltage - Breakdown (Min): -
  • Voltage - Clamping (Max) @ Ipp: -
  • Current - Peak Pulse (10/1000µs): -
  • Power - Peak Pulse: -
  • Power Line Protection: -
  • Applications: -
  • Capacitance @ Frequency: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock8 946
MFRC63102HN,551
NXP

IC CONTACTLESS READER 32HVQFN

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: I2C, SPI, UART
  • Voltage - Supply: 3 V ~ 5.5 V
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
paquet: 32-VFQFN Exposed Pad
Stock4 698
TDA9899HL/V2,118
NXP

IC IF PROCESSOR MULTISTD 48-LQFP

  • Function: IF Processor
  • Frequency: -
  • RF Type: ATV, DVB, FM
  • Secondary Attributes: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock6 084
MC33FS4505KAE
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
paquet: -
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SAF7772EL-200Z100K
NXP

SAF7772EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-LFBGA (15x15)
paquet: -
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MVR5510AMBA4ESR2
NXP

IC PMIC VR5510 ASIL-B

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
paquet: -
Request a Quote
SAF4000EL-103Q23AK
NXP

IC

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
MCIMX7U5DVK08SC
NXP

IC

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote