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Produits NXP

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TDA8037T/C1S
NXP

IC SMART CARD 28SOIC

  • Applications: Smart Card
  • Interface: -
  • Voltage - Supply: 3.3V
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SO
  • Mounting Type: Surface Mount
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock6 288
TJA1041T/V,518
NXP

IC TXRX CAN HS 5.25V 14-SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 70mV
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
paquet: 14-SOIC (0.154", 3.90mm Width)
Stock5 472
MPC8540CPX667JC
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock3 856
hot MPC8315ECVRADDA
NXP

IC MPU MPC83XX 266MHZ 620BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
paquet: 620-BBGA Exposed Pad
Stock5 616
MC7457VG867NC
NXP

IC MPU MPC74XX 867MHZ 483FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 867MHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 483-BCBGA, FCCBGA
  • Supplier Device Package: 483-FCCBGA (29x29)
paquet: 483-BCBGA, FCCBGA
Stock4 720
P5040NSN7TMC
NXP

IC SOC 64BIT 4X1.8GHZ 1295FCBGA

  • Core Processor: PowerPC e5500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (10), 10 Gbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.0V, 1.1V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1295-BBGA, FCBGA
  • Supplier Device Package: 1295-FCPBGA (37.5x37.5)
paquet: 1295-BBGA, FCBGA
Stock6 016
MPC8536BVJAVLA
NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock5 200
MC68EN360ZQ33L
NXP

IC MPU M683XX 33MHZ 357BGA

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 33MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock5 280
MC9S08DZ48MLH
NXP

IC MCU 8BIT 48KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 53
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 3K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock5 872
hot MC9S08RE8FJE
NXP

IC MCU 8BIT 8KB FLASH 32LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 25
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock7 552
P80C31SBPN,112
NXP

IC MCU 8BIT ROMLESS 40DIP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: UART/USART
  • Peripherals: POR
  • Number of I/O: 32
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 40-DIP (0.600", 15.24mm)
  • Supplier Device Package: 40-DIP
paquet: 40-DIP (0.600", 15.24mm)
Stock5 136
SC68376BGMAB20R
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock7 920
MC9S08DZ60AMLF
NXP

IC MCU 8BIT 60KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock7 260
DSP56303AG100B1
NXP

IC DSP 24BIT 100MHZ 144-LQFP

  • Type: Fixed Point
  • Interface: Host Interface, SSI, SCI
  • Clock Rate: 100MHz
  • Non-Volatile Memory: ROM (576 B)
  • On-Chip RAM: 24kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock7 216
PCF8523TS/1,112
NXP

IC RTC CLK/CALENDAR I2C 14-TSSOP

  • Type: Clock/Calendar
  • Features: Alarm, Leap Year, Watchdog Timer
  • Memory Size: -
  • Time Format: HH:MM:SS (12/24 hr)
  • Date Format: YY-MM-DD-dd
  • Interface: I2C, 2-Wire Serial
  • Voltage - Supply: 1.6 V ~ 5.5 V
  • Voltage - Supply, Battery: 1.8 V ~ 5.5 V
  • Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 14-TSSOP
paquet: 14-TSSOP (0.173", 4.40mm Width)
Stock29 112
74LV4799DB,118
NXP

IC OSC TIMER CTRL 100KHZ 16SSOP

  • Type: Timer Control
  • Count: -
  • Frequency: 100kHz
  • Voltage - Supply: 0.9 V ~ 6 V
  • Current - Supply: 36µA
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 16-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 16-SSOP
  • Mounting Type: Surface Mount
paquet: 16-SSOP (0.209", 5.30mm Width)
Stock5 568
TFF11092HN/N1X
NXP

IC FREQUENCY GENERATOR 24HVQFN

  • PLL: Yes
  • Main Purpose: Ku band VSAT applications
  • Input: Clock
  • Output: Clock
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:4
  • Differential - Input:Output: Yes/No
  • Frequency - Max: 9.22GHz
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
paquet: 24-VFQFN Exposed Pad
Stock2 848
MFRC53001T/0FE,518
NXP

IC READER 13.56MHZ 32SO

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: SPI
  • Voltage - Supply: 3.3 V ~ 5 V
  • Operating Temperature: -40°C ~ 150°C
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SO
paquet: 32-SOIC (0.295", 7.50mm Width)
Stock8 460
NXQ1TXL5/101J
NXP

LOW-COST ONE-CHIP 5 V QI WIRELES

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 072
LPC54616J512ET100E
NXP

32-BIT ARM CORTEX-M4

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 200K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
paquet: 100-TFBGA
Stock7 296
SPC5646CF0MLT1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock5 040
LPC804M101JDH20J
NXP

32-BIT ARM CORTEX-M0+

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 15MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 17
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
paquet: 20-TSSOP (0.173", 4.40mm Width)
Stock2 736
TJA1128CTK/0Z
NXP

IC TRANSCEIVER FULL 1/1 14HVSON

  • Type: Transceiver
  • Protocol: LIN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Full
  • Receiver Hysteresis: -
  • Data Rate: 20kBd
  • Voltage - Supply: 5V ~ 28V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VDFN Exposed Pad
  • Supplier Device Package: 14-HVSON (3x4.5)
paquet: 14-VDFN Exposed Pad
Stock3 520
PDTC123JU-ZLX
NXP

TRANS PREBIAS NPN SC70

  • Transistor Type: -
  • Current - Collector (Ic) (Max): -
  • Voltage - Collector Emitter Breakdown (Max): -
  • Resistor - Base (R1) (Ohms): -
  • Resistor - Emitter Base (R2) (Ohms): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: -
  • Vce Saturation (Max) @ Ib, Ic: -
  • Current - Collector Cutoff (Max): -
  • Frequency - Transition: -
  • Power - Max: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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MC33FS6507LAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
paquet: -
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LPC1769FBD100K
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M3
  • Core Size: 32-Bit Single-Core
  • Speed: 120MHz
  • Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
  • Data Converters: A/D 8x12b SAR; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: -
Stock8 862
KW45Z41053AFPBT
NXP

K4W1 40HVQFN

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: CANbus, HMI, I2C, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 22
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 14x16b SAR
  • Oscillator Type: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
paquet: -
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MC33FS8420G0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
paquet: -
Request a Quote