Produits NXP

BFG97,135

NXP

TRANS NPN 15V 100MA 5GHZ SOT223

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 5.5GHz
• Noise Figure (dB Typ @ f): -
• Gain: -
• Power - Max: 1W
• DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
• Current - Collector (Ic) (Max): 100mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

paquet: TO-261-4, TO-261AA

CBT16210DGG,512

NXP

IC BUS SWITCH 20BIT 48TSSOP

• Type: Bus Switch
• Circuit: 10 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.240", 6.10mm Width)

HEF4514BT,652

NXP

IC 1-16 DECOD/DEMUX 24-SOIC

• Type: Decoder/Demultiplexer
• Circuit: 1 x 4:16
• Independent Circuits: 1
• Current - Output High, Low: 3mA, 3mA
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

paquet: 24-SOIC (0.295", 7.50mm Width)

74ABT16374BDGG,518

NXP

IC D-TYPE POS TRG DUAL 48TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 2
• Number of Bits per Element: 8
• Clock Frequency: 260MHz
• Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 2mA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)

paquet: 48-TFSOP (0.240", 6.10mm Width)

TDA1308AT/N2,115

NXP

IC AMP AUDIO .08W STER AB 8SOIC

• Type: Class AB
• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
• Voltage - Supply: 2.4 V ~ 7 V, ±1.2 V ~ 3.5 V
• Features: Depop, Short-Circuit Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-SO
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

paquet: 8-SOIC (0.154", 3.90mm Width)

SC16C852LIET,115

NXP

IC UART DL 1.8V W/FIFO 36-TFBGA

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 128 Byte
• Protocol: RS485
• Data Rate (Max): 5Mbps
• Voltage - Supply: 1.8V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 36-TFBGA
• Supplier Device Package: 36-TFBGA (3.5x3.5)

paquet: 36-TFBGA

UJA1168TK,118

NXP

IC TRANSCEIVER 14HVSON

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

paquet: 14-VDFN Exposed Pad

PTN5100ABSZ

NXP

IC USB PD PHY TYPE C 20HVQFN

• Protocol: USB
• Function: Controller
• Interface: USB
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (4x4)

paquet: 20-VFQFN Exposed Pad

MPC8572VTARLB

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

MPC8545VTANGB

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC755CVT400LE

NXP

IC MPU MPC7XX 400MHZ 360FCBGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BBGA, FCCBGA
• Supplier Device Package: 360-FCPBGA (25x25)

paquet: 360-BBGA, FCCBGA

PK61FN1M0VMD15

NXP

IC MCU 32BIT 1MB FLASH 144MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 95
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 53x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

paquet: 144-LBGA

MCF5272VF66J

NXP

IC MCU 32BIT 16KB ROM 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 1K x 32
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

MCF51AC128CCFUER

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

MC908QC8MDSE

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

P89LPC9401FBD,551

NXP

IC MCU 8BIT 8KB FLASH 64LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (14x14)

paquet: 64-LQFP

SPC5673FF3MVY2

NXP

IC MCU 32BIT 3MB FLASH 516FBGA

• Core Processor: e200z7
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: 32
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 64x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

MC68HC908QY1VDTE

NXP

IC MCU 8BIT 1.5KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

S9S12G96F0VLH

NXP

IC MCU 16BIT 96KB FLASH 64LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MC9S12A32CFUE

NXP

IC MCU 16BIT 32KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

MSC8256SVT1000B

NXP

IC PROCESSOR 6-CORE 783FCBGA

• Type: SC3850 Six Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

IP4332CX5/LF,135

NXP

TVS DIODE 5WLCSP

• Type: -
• Unidirectional Channels: -
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): -
• Voltage - Breakdown (Min): -
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: -
• Applications: -
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 5-UFBGA, WLCSP
• Supplier Device Package: 5-WLCSP (0.76x1.05)

paquet: 5-UFBGA, WLCSP

OM7925/BGU7051,598

NXP

EVAL BOARD FOR BGU7051

• Type: Amplifier
• Frequency: 500MHz ~ 1.5GHz
• For Use With/Related Products: BGU7051
• Supplied Contents: Board

paquet: -

MC34PF1550A0EP

NXP

POWER MANAGEMENT IC 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

paquet: 40-VFQFN Exposed Pad

S912ZVML32F2MKH

NXP

IC MCU 16BIT FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

paquet: 64-LQFP Exposed Pad

S9S12XS256J0CAER

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

KW45Z41083AFTBT

NXP

K4W1 HVQFN48

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CANbus, HMI, I2C, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 29
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 14x16b SAR
• Oscillator Type: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

paquet: -

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LPC55S16JEV98E

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 98-VFBGA
• Supplier Device Package: 98-VFBGA (7x7)

paquet: -