Page 741 - Produits NXP | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 807
Language Translation

* Please refer to the English Version as our Official Version.

Produits NXP

Dossiers 26 590
Page  741/950
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
MMRF1006HR5
NXP

FET RF 2CH 120V 450MHZ NI-1230

  • Transistor Type: LDMOS
  • Frequency: 450MHz
  • Gain: 20dB
  • Voltage - Test: 50V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 150mA
  • Power - Output: 1000W
  • Voltage - Rated: 120V
  • Package / Case: SOT-979A
  • Supplier Device Package: NI-1230-4H
paquet: SOT-979A
Stock7 072
PN2222A,412
NXP

TRANS NPN 40V 0.6A TO92

  • Transistor Type: NPN
  • Current - Collector (Ic) (Max): 600mA
  • Voltage - Collector Emitter Breakdown (Max): 40V
  • Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
  • Current - Collector Cutoff (Max): 10nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
  • Power - Max: 500mW
  • Frequency - Transition: 300MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA)
Stock6 256
BAW56T,115
NXP

DIODE ARRAY GP 90V 150MA SC75

  • Diode Configuration: 1 Pair Common Anode
  • Diode Type: Standard
  • Voltage - DC Reverse (Vr) (Max): 90V
  • Current - Average Rectified (Io) (per Diode): 150mA (DC)
  • Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
  • Speed: Small Signal =< 200mA (Io), Any Speed
  • Reverse Recovery Time (trr): 4ns
  • Current - Reverse Leakage @ Vr: 500nA @ 80V
  • Operating Temperature - Junction: 150°C (Max)
  • Mounting Type: Surface Mount
  • Package / Case: SC-75, SOT-416
  • Supplier Device Package: SC-75
paquet: SC-75, SOT-416
Stock7 456
74LVC543APW,112
NXP

IC REGISTERED TXRX 8BIT 24TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock4 656
hot SA5212AD/01,118
NXP

IC OPAMP TRANSIMP 140MHZ 8SO

  • Amplifier Type: Transimpedance
  • Number of Circuits: 1
  • Output Type: Differential
  • Slew Rate: -
  • Gain Bandwidth Product: -
  • -3db Bandwidth: 140MHz
  • Current - Input Bias: -
  • Voltage - Input Offset: -
  • Current - Supply: 26mA
  • Current - Output / Channel: 4mA
  • Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock4 496
PCA9504ADGG,118
NXP

IC GLUE CHIP 4 DUAL 56TSSOP

  • Applications: PC's, PDA's
  • Interface: I2C
  • Voltage - Supply: 3 V ~ 5.25 V
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
  • Mounting Type: Surface Mount
paquet: 56-TFSOP (0.240", 6.10mm Width)
Stock4 800
PCA9556PW,118
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Open Drain, Push-Pull
  • Current - Output Source/Sink: 10mA, 20mA
  • Clock Frequency: 100kHz
  • Voltage - Supply: 3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
paquet: 16-TSSOP (0.173", 4.40mm Width)
Stock6 560
hot MPC8548ECVTAUJD
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock5 536
MPC8315ECVRAFDA
NXP

IC MPU MPC83XX 333MHZ 620BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
paquet: 620-BBGA Exposed Pad
Stock4 144
MPC8343CZQAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
paquet: 620-BBGA Exposed Pad
Stock4 160
hot MPC8349CVVAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
paquet: 672-LBGA
Stock4 880
hot PK60X256VMD100
NXP

IC MCU 32BIT 256KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 27x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
paquet: 144-LBGA
Stock5 680
MCHLC908QT4CPE
NXP

IC MCU 8BIT 4KB FLASH 8DIP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 2MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 5
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock2 656
MC912D60CCPVE
NXP

IC MCU 16BIT 60KB FLASH 112LQFP

  • Core Processor: CPU12
  • Core Size: 16-Bit
  • Speed: 8MHz
  • Connectivity: CAN, MI Bus, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 68
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 16x8/10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
paquet: 112-LQFP
Stock3 440
MC9S12XA512CAL
NXP

IC MCU 16BIT 512KB FLASH 112LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
paquet: 112-LQFP
Stock6 416
hot MK10DN64VFT5
NXP

IC MCU 32BIT 64KB FLASH 48QFN

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 33
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 16x16b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
paquet: 48-VFQFN Exposed Pad
Stock6 256
TEF6892H/V2,557
NXP

IC RADIO SIGNAL PROC 44-QFP

  • Function: Audio Tone Processor
  • Applications: Automotive Audio
  • Number of Channels: 6
  • Interface: I2C
  • Voltage - Supply: 8 V ~ 9 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Specifications: AM, FM
  • Package / Case: 44-QFP
  • Supplier Device Package: 44-PQFP (10x10)
paquet: 44-QFP
Stock5 152
SX5100P1KT1
NXP

ACCELEROMETER

  • Type: -
  • Axis: -
  • Acceleration Range: -
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: -
  • Voltage - Supply: -
  • Features: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 812
MFRC63102HN,157
NXP

IC CONTACTLESS READER 32HVQFN

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: I2C, SPI, UART
  • Voltage - Supply: 3 V ~ 5.5 V
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
paquet: 32-VFQFN Exposed Pad
Stock4 230
HTMS8201FTK/AF,115
NXP

RFID HTAG SOT899-1

  • Style: Encapsulated
  • Technology: Passive
  • Frequency: 100kHz ~ 150kHz
  • Memory Type: Read/Write
  • Writable Memory: 1.76kb (User)
  • Standards: ISO 11784, ISO 11785
  • Operating Temperature: -
  • Size / Dimension: 3.00mm x 2.00mm x 0.85mm
paquet: -
Stock4 608
MC35FS6512CAER2
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock4 496
T1023NXE7PQA
NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 680
LS1023AXN8KQB
NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 936
SPC5746CSK1MKU6R
NXP

32 BITDUAL CORE3M FLASH384 RA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock6 432
S9S12GN32AVLFR
NXP

16-BIT32K FLASH2K RAM

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock7 632
TJA1128DTK/0Z
NXP

IC TRANSCEIVER FULL 1/1 14HVSON

  • Type: Transceiver
  • Protocol: LIN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Full
  • Receiver Hysteresis: -
  • Data Rate: 20kBd
  • Voltage - Supply: 5V ~ 28V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VDFN Exposed Pad
  • Supplier Device Package: 14-HVSON (3x4.5)
paquet: 14-VDFN Exposed Pad
Stock43 674
MIMXRT1165DVM6A
NXP

IC MCU 32BIT EXT MEM 289LFBGA

  • Core Processor: ARM® Cortex®-M4/M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 240MHz, 600MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: External Program Memory
  • EEPROM Size: -
  • RAM Size: 1M x 8
  • Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
  • Data Converters: A/D 2x12b; D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-LFBGA (14x14)
paquet: -
Request a Quote
MFS8621BMBA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
paquet: -
Request a Quote