Produits NXP

BUK9609-55A,118

NXP

MOSFET N-CH 55V 75A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 4633pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 211W (Tc)
• Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

paquet: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

PSMN5R8-30LL,115

NXP

MOSFET N-CH 30V QFN3333

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.15V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 24nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1316pF @ 15V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 55W (Tc)
• Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-DFN3333 (3.3x3.3)
• Package / Case: 8-VDFN Exposed Pad

paquet: 8-VDFN Exposed Pad

MRF8S26120HSR3

NXP

FET RF 65V 2.69GHZ NI780S

• Transistor Type: LDMOS
• Frequency: 2.69GHz
• Gain: 15.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 900mA
• Power - Output: 28W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

paquet: NI-780S

MRF6S27015GNR1

NXP

FET RF 68V 2.6GHZ TO270-2 GW

• Transistor Type: LDMOS
• Frequency: 2.6GHz
• Gain: 14dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 160mA
• Power - Output: 3W
• Voltage - Rated: 68V
• Package / Case: TO-270-2 Gull Wing
• Supplier Device Package: TO-270-2 GULL

paquet: TO-270-2 Gull Wing

MC34912G5AC

NXP

IC SYSTEM BASIS CHIP LIN 32-LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MC34845BEPR2

NXP

IC LED DRVR RGLTR DIM 2.6A 24QFN

• Type: DC DC Regulator
• Topology: Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 6
• Voltage - Supply (Min): 5V
• Voltage - Supply (Max): 21V
• Voltage - Output: 8 V ~ 60 V
• Current - Output / Channel: 2.6A (Switch)
• Frequency: 300kHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-UFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

paquet: 24-UFQFN Exposed Pad

MPC8569EVJAQLJB

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR2, DDR3, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (8), 1 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

LS1024ASN7MLA

NXP

IC PROCESSOR DUAL CORE

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Secure Boot, TrustZone?
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

paquet: 625-BFBGA, FCBGA

MPC8313CZQAGDC

NXP

IC MPU MPC83XX 400MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

LS1024ASE7MLA

NXP

IC PROCESSOR DUAL CORE 625BGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Secure Boot, TrustZone?
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

paquet: 625-BFBGA, FCBGA

PC9S08QE64CLH

NXP

IC MCU 8BIT 64KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 22x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

P89C662HBA/00,512

NXP

IC MCU 8BIT 32KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: I2C, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

paquet: 44-LCC (J-Lead)

S908AB32AE2CFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

MC9S08AW32MFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

MC9S08QG4CFFER

NXP

IC MCU 8BIT 4KB FLASH 16QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (5x5)

paquet: 16-VQFN Exposed Pad

DSPB56364AF100

NXP

IC DSP 24BIT AUD 100MHZ 100-LQFP

• Type: Audio Processor
• Interface: Host Interface, I2C, SAI, SPI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (24 kB)
• On-Chip RAM: 11.25kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

PCK942CBD,151

NXP

IC CLK BUFFER 1:18 250MHZ 32LQFP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:18
• Differential - Input:Output: No/No
• Input: LVCMOS, LVTTL
• Output: LVCMOS
• Frequency - Max: 250MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MF3D4201DUD/00V

NXP

MIFARE DESFIRE EV2

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

JN5148/Z01,515

NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 667kbps
• Power - Output: 2.75dBm
• Sensitivity: -96.5dBm
• Memory Size: 128kB ROM, 128kB RAM
• Serial Interfaces: I2C, JTAG, SPI, UART
• GPIO: 21
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17.5mA
• Current - Transmitting: 15mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN Exposed Pad

paquet: 56-VFQFN Exposed Pad

BGU8004X

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -
• Gain: 19dB
• Noise Figure: 0.6dB
• RF Type: Galileo, GLONASS, GPS
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 7.5mA
• Test Frequency: -
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.65x0.44)

paquet: 6-XFBGA, WLCSP

MCIMX6Y1DVK05AA

NXP

528MHZETHERNET X1 USB OTG X1

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 272-LFBGA
• Supplier Device Package: 272-MAPBGA (9x9)

paquet: 272-LFBGA

SPC5604BK0VLQ4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

NX30P6093AUKAZ

NXP

HIGH-VOLTAGE I2C CONTROLLED OVER

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: -
• Output Type: P-Channel
• Interface: I2C
• Voltage - Load: 2.8V ~ 20V
• Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
• Current - Output (Max): 5.6A
• Rds On (Typ): 16mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled
• Fault Protection: Over Temperature, Over Voltage, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 20-UFBGA, WLCSP
• Supplier Device Package: 20-WLCSP (2.16x1.7)

paquet: -

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MKM35Z512VLL7

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 75MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LCD, RNG, WDT
• Number of I/O: 72
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x16b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: -

MIMXRT1062DVL6B

NXP

IC MCU 32BIT EXT MEM 196LFBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 600MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-LFBGA (10x10)

paquet: -

LPC11E68JBD64K

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 10x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: -

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LPC54016JET100E

NXP

IC MCU 32BIT ROMLESS 100TFBGA

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit Single-Core
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 360K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

paquet: -

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FC32K118LFT0VLHR

NXP

S32K118, M0+, FLASH 256K, RAM 25

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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