Page 714 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
BB135,115	NXP	DIODE UHF VAR CAP 30V SOD323 Capacitance @ Vr, F: 2.1pF @ 28V, 1MHz Capacitance Ratio: 12 Capacitance Ratio Condition: C0.5/C28 Voltage - Peak Reverse (Max): 30V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	paquet: SC-76, SOD-323	Stock49 242
LD6836TD/30P,125	NXP	IC REG LINEAR 3V 300MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3V Voltage - Output (Max): - Voltage Dropout (Max): 0.2V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	paquet: SC-74A, SOT-753	Stock5 808
SSTU32866EC,557	NXP	IC BUFFER 1.8V 25BIT SOT536-1 Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	paquet: 96-LFBGA	Stock2 912
HEF4528BT/AUJ	NXP	IC MULTIVIBRATOR DUAL 16SOIC Logic Type: Monostable Independent Circuits: 2 Schmitt Trigger Input: No Propagation Delay: 35ns Current - Output High, Low: 3mA, 3mA Voltage - Supply: 3 V ~ 15 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	paquet: 16-SOIC (0.154", 3.90mm Width)	Stock2 016
PC34901SNEF	NXP	CANHS 8SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	paquet: -	Stock3 488
PCA9540BD,112	NXP	IC I2C MUX 2CH BI-DIR 8-SOIC Applications: 2-Channel I2C Multiplexer Interface: I2C Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Mounting Type: Surface Mount	paquet: 8-SOIC (0.154", 3.90mm Width)	Stock6 336
PPC8536EAVTAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 783-BBGA, FCBGA	Stock2 640
MC9328MX21SVMR2	NXP	IC MPU I.MX21 266MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: - SATA: - USB: USB 1.x (2) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 289-LFBGA Supplier Device Package: -	paquet: 289-LFBGA	Stock2 880
XPC850VR66BU	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	paquet: 256-BBGA	Stock4 016
MPC8536ECVJAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 783-BBGA, FCBGA	Stock7 216
MPC8270CVRMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	paquet: 516-BBGA	Stock10 716
MC908QC8CDXER	NXP	IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	paquet: 16-SOIC (0.295", 7.50mm Width)	Stock36 000
S912XET512J3VALR	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock4 752
MCF52232AF50	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 50MHz Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	paquet: 80-LQFP	Stock6 096
MC9S08AW48CFDE	NXP	IC MCU 8BIT 48KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-VFQFN Exposed Pad	Stock5 936
FXTH8715116T1	NXP	IC TPMS 1500KPA XZ AXIS 24QFN Sensor Type: Tire Pressure Monitoring (TPMS) Output Type: RF Operating Temperature: -	paquet: -	Stock30 468
MC44CC375AVEFEVK	NXP	CCEVK NEJA EVAL KIT Type: Modulator Frequency: - For Use With/Related Products: MC44CC375AV Supplied Contents: -	paquet: -	Stock7 794
MC13821FCR2	NXP	IC AMP LNA BYPASS SWITCH 12-QFN Frequency: 1GHz ~ 2.4GHz P1dB: -10dBm (0.1mW) Gain: 16.5dB Noise Figure: 1.45dB RF Type: ISM, GPS Voltage - Supply: 2.75V Current - Supply: 2.8mA Test Frequency: 1.575GHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	paquet: 12-VFQFN Exposed Pad	Stock162 000
MCIMX6DP4AVT8AAR	NXP	I.MX 6 SERIES 32-BIT MPU DUAL A Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	paquet: 624-FBGA, FCBGA	Stock5 120
S9S12GN32F0VFT	NXP	16-BIT32K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-TFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-TFQFN Exposed Pad	Stock6 864
MC33879TEKR2	NXP	IC SW SERIAL OCTAL 32SOIC Output Configuration: - Applications: - Interface: - Load Type: - Technology: - Rds On (Typ): 750mOhm Current - Output / Channel: - Current - Peak Output: 1.2A Voltage - Supply: 5.5V ~ 26.5V Voltage - Load: - Operating Temperature: -40°C ~ 125°C Features: - Fault Protection: - Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC-EP	paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7 120
MC912DT128AVPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 67 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock4 048
A2G26H280-04SR3	NXP	RF MOSFET Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
MFS8602BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	paquet: -	Request a Quote
MWCT2D17SHT1VPB	NXP	MWCT2D17S,MAXQFP172 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
FS32R294HBK0MJDR	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 269-LFBGA Supplier Device Package: 269-LFBGA (14x14)	paquet: -	Request a Quote
MIMXRT1042DFP6B	NXP	IC MCU 32BIT 128KB ROM 169LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 600MHz Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, PWM, WDT Number of I/O: - Program Memory Size: 128KB (128K x 8) Program Memory Type: ROM EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: External, Internal Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-LFBGA (9x9)	paquet: -	Request a Quote
LPC55S26JBD64Y	NXP	IC MCU 32BIT 256KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	paquet: -	Request a Quote

BB135,115

NXP

DIODE UHF VAR CAP 30V SOD323

Capacitance @ Vr, F: 2.1pF @ 28V, 1MHz
Capacitance Ratio: 12
Capacitance Ratio Condition: C0.5/C28
Voltage - Peak Reverse (Max): 30V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323

paquet: SC-76, SOD-323

Stock49 242

LD6836TD/30P,125

NXP

IC REG LINEAR 3V 300MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.2V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

paquet: SC-74A, SOT-753

Stock5 808

SSTU32866EC,557

NXP

IC BUFFER 1.8V 25BIT SOT536-1

Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 1.9 V
Number of Bits: 25, 14
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

paquet: 96-LFBGA

Stock2 912

HEF4528BT/AUJ

NXP

IC MULTIVIBRATOR DUAL 16SOIC

Logic Type: Monostable
Independent Circuits: 2
Schmitt Trigger Input: No
Propagation Delay: 35ns
Current - Output High, Low: 3mA, 3mA
Voltage - Supply: 3 V ~ 15 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

Stock2 016

PC34901SNEF

NXP

CANHS 8SOIC

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

paquet: -

Stock3 488

PCA9540BD,112

NXP

IC I2C MUX 2CH BI-DIR 8-SOIC

Applications: 2-Channel I2C Multiplexer
Interface: I2C
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Mounting Type: Surface Mount

paquet: 8-SOIC (0.154", 3.90mm Width)

Stock6 336

PPC8536EAVTAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

Stock2 640

MC9328MX21SVMR2

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: -
SATA: -
USB: USB 1.x (2)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 289-LFBGA
Supplier Device Package: -

paquet: 289-LFBGA

Stock2 880

XPC850VR66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

Stock4 016

MPC8536ECVJAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

Stock7 216

MPC8270CVRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

Stock10 716

MC908QC8CDXER

NXP

IC MCU 8BIT 8KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

Stock36 000

S912XET512J3VALR

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock4 752

MCF52232AF50

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 50MHz
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

paquet: 80-LQFP

Stock6 096

MC9S08AW48CFDE

NXP

IC MCU 8BIT 48KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

Stock5 936

FXTH8715116T1

NXP

IC TPMS 1500KPA XZ AXIS 24QFN

Sensor Type: Tire Pressure Monitoring (TPMS)
Output Type: RF
Operating Temperature: -

paquet: -

Stock30 468

MC44CC375AVEFEVK

NXP

CCEVK NEJA EVAL KIT

Type: Modulator
Frequency: -
For Use With/Related Products: MC44CC375AV
Supplied Contents: -

paquet: -

Stock7 794

MC13821FCR2

NXP

IC AMP LNA BYPASS SWITCH 12-QFN

Frequency: 1GHz ~ 2.4GHz
P1dB: -10dBm (0.1mW)
Gain: 16.5dB
Noise Figure: 1.45dB
RF Type: ISM, GPS
Voltage - Supply: 2.75V
Current - Supply: 2.8mA
Test Frequency: 1.575GHz
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

paquet: 12-VFQFN Exposed Pad

Stock162 000

MCIMX6DP4AVT8AAR

NXP

I.MX 6 SERIES 32-BIT MPU DUAL A

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

paquet: 624-FBGA, FCBGA

Stock5 120

S9S12GN32F0VFT

NXP

16-BIT32K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-TFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-TFQFN Exposed Pad

Stock6 864

MC33879TEKR2

NXP

IC SW SERIAL OCTAL 32SOIC

Output Configuration: -
Applications: -
Interface: -
Load Type: -
Technology: -
Rds On (Typ): 750mOhm
Current - Output / Channel: -
Current - Peak Output: 1.2A
Voltage - Supply: 5.5V ~ 26.5V
Voltage - Load: -
Operating Temperature: -40°C ~ 125°C
Features: -
Fault Protection: -
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC-EP

paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7 120

MC912DT128AVPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 67
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Data Converters: A/D 16x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock4 048

A2G26H280-04SR3

NXP

RF MOSFET

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: -
Supplier Device Package: -

paquet: -

Request a Quote

MFS8602BMDA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

paquet: -

Request a Quote

MWCT2D17SHT1VPB

NXP

MWCT2D17S,MAXQFP172

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Request a Quote

FS32R294HBK0MJDR

NXP

S32R29 MULTICORE POWER ARCHITECT

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 269-LFBGA
Supplier Device Package: 269-LFBGA (14x14)

paquet: -

Request a Quote

MIMXRT1042DFP6B

NXP

IC MCU 32BIT 128KB ROM 169LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 600MHz
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, PWM, WDT
Number of I/O: -
Program Memory Size: 128KB (128K x 8)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Supplier Device Package: 169-LFBGA (9x9)

paquet: -

Request a Quote

LPC55S26JBD64Y

NXP

IC MCU 32BIT 256KB FLASH 64TQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

paquet: -

Request a Quote