Produits NXP

BA278,115

NXP

DIODE BAND-SWITCHING 35V SOD523

• Diode Type: Standard - Single
• Voltage - Peak Reverse (Max): 35V
• Current - Max: 100mA
• Capacitance @ Vr, F: 1.2pF @ 6V, 1MHz
• Resistance @ If, F: 700 mOhm @ 2mA, 100MHz
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

paquet: SC-79, SOD-523

MMPF0100F2AEP

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

paquet: 56-VFQFN Exposed Pad

MC34827A2EPR2

NXP

IC USB POWER MANAGER 20-QFN

• Applications: OR Controller, UART/USB Data, Audio Management
• Current - Supply: 9µA
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-QFN-EP (3x4)

paquet: 20-UFQFN Exposed Pad

PIP3107-D,118

NXP

TOPFET LOGIC LVL 50V DPAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 16A
• Rds On (Typ): 36 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: -
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
• Supplier Device Package: DPAK

paquet: TO-252-3, DPak (2 Leads + Tab), SC-63

74HC7731D,118

NXP

IC STATIC SHIFT REG 64BIT 16SOIC

• Logic Type: Register, Multiplexed
• Output Type: Push-Pull
• Number of Elements: 4
• Number of Bits per Element: 64
• Function: Universal
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

NE5232D/01,118

NXP

IC OPAMP GP 2.5MHZ RRO 8SO

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 200µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

MCZ33905CS5EKR2

NXP

IC SBC CAN HS 5.0V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

SC18IM700IPW,112

NXP

IC CTRL I2C W/UART 16-TSSOP

• Protocol: I2C
• Function: Controller
• Interface: UART
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 9mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

74HC4051N,652

NXP

IC MUX/DEMUX 8X1 16DIP

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 120 Ohm
• Channel-to-Channel Matching (ΔRon): 6 Ohm
• Voltage - Supply, Single (V+): 2 V ~ 10 V
• Voltage - Supply, Dual (V±): ±1.5 V ~ 5 V
• Switch Time (Ton, Toff) (Max): 51ns, 42ns
• -3db Bandwidth: 180MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 400nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

P1013PSE2EFA

NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

MPC8544AVTARJ

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC68EN360ZP25VL

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BGA

P5020NXE7TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

paquet: 1295-BBGA, FCBGA

MPC8533EVJALFA

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MCIMX535DVV2C2

NXP

IC MPU I.MX53 1.2GHZ 529TEBGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-TEPBGA-2 (19x19)

paquet: 529-FBGA

MCF51AG96VLH

NXP

IC MCU 32BIT 96KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 19x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

S9S12XS64J1CAE

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

S9S08SG8E2CTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

MC9S08PT8VWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

EM783-TPE

NXP

MCU 32BIT ENERGY METER 32HVQFN

• Applications: Energy Measurement
• Core Processor: ARM? Cortex?-M0
• Program Memory Type: FLASH (32 kB)
• Controller Series: -
• RAM Size: 8K x 8
• Interface: I2C, IrDA, SPI, UART/USART
• Number of I/O: 22
• Voltage - Supply: 2.6 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

paquet: 32-VQFN Exposed Pad

LM75AD,112

NXP

SENSOR TEMPERATURE I2C 8SO

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C
• Voltage - Supply: 2.8 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

MMA6853BKW

NXP

ACCELEROMETER 50G 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

paquet: 16-QFN Exposed Pad

B4420NSN7QQMD

NXP

QORIQ QONVERGE SOC 2X1.2GHZ STA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

T2080NSE8PTB

NXP

QORIQ 64B POWER ARCH 8X 1.5GHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S9S12GN48F1CLC

NXP

16-BIT MCU S12 CORE 48KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MIMXRT1021CAF4B

NXP

IC MCU 32BIT EXT MEM 100LQFP

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 400MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 10x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: -

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S9KEAZN32AVLH

NXP

IC MCU 32BIT 32KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 40MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: -

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A3V07H600-42NR6

NXP

RF MOSFET LDMOS 48V OM1230-6

• Transistor Type: LDMOS
• Frequency: 616MHz ~ 870MHz
• Gain: 16.9dB
• Voltage - Test: 48 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 900 mA
• Power - Output: 112W
• Voltage - Rated: 105 V
• Package / Case: OM-1230-6L
• Supplier Device Package: OM-1230-6L

paquet: -

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