Produits NXP

MRF7S16150HSR5

NXP

FET RF 65V 1.66GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.6GHz ~ 1.66GHz
• Gain: 19.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 32W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

paquet: NI-780S

BZX284-B18,115

NXP

DIODE ZENER 18V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 18V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 12.6V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

paquet: SOD-110

MC22XS4200BEK

NXP

IC SWITCH HISD 24V DUAL 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:2
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8 V ~ 36 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): 3A
• Rds On (Typ): -
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

74HCT4075PW-Q100J

NXP

IC GATE OR 3CH 3-INP 14-TSSOP

• Logic Type: OR Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: 4mA, -
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

paquet: 14-TSSOP (0.173", 4.40mm Width)

TJA1041T/CM,118

NXP

IC TRANSCEIVER CAN 14SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

MPC8544CVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC68360ZQ25VLR2

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

P3041NSN7NNC

NXP

IC MPU Q OR IQ 1.333GHZ 1295BGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

paquet: 1295-BBGA, FCBGA

MCIMX6S1AVM08ACR

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

paquet: 624-LFBGA

MCIMX6DP6AVT8AA

NXP

IC MPU I.MX6DP 852MHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 852MHZ
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

paquet: 624-FBGA, FCBGA

MC9S12C128MPBE

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

paquet: 52-LQFP

MC908JL3ECDWER

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 23
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

S9S12GN32F0MLFR

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MC9S08PT32AVLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MKL25Z128VFM4

NXP

IC MCU 32BIT 128KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 7x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

PCF2123U/12HA/1,00

NXP

IC RTC CLK/CALENDAR SPI DIE

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: SPI
• Voltage - Supply: 1.6 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

TJF1052IT/1Y

NXP

DGTL ISOLATOR 1KV 2CH CAN 16SO

• Technology: Capacitive Coupling
• Type: CAN
• Isolated Power: No
• Number of Channels: 2
• Inputs - Side 1/Side 2: 1/1
• Channel Type: Unidirectional
• Voltage - Isolation: 1000Vrms
• Common Mode Transient Immunity (Min): 20kV/µs
• Data Rate: 2Mbps
• Propagation Delay tpLH / tpHL (Max): -
• Pulse Width Distortion (Max): -
• Rise / Fall Time (Typ): -
• Voltage - Supply: 3 V ~ 5.25 V
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.295", 7.50mm Width)

MCIMX6DP5EVT2AA

NXP

I.MX 6DUALPLUS MPU 2X ARM CORTE

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

paquet: 624-FBGA, FCBGA

LS1020ASN7HNB

NXP

LS1 32BIT ARM SOC 800MHZ DDR3/

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C
• Security Features: -
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: 525-FBGA, FCBGA

SPC5605BF1MLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

SPC5602BF2VLQ4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

SPC5777CSK3MME4

NXP

POWER ARCH CORES, 8MB FLASH, 300

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 300MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 10x16b Sigma-Delta, eQADC
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

paquet: -

Request a Quote

FS32K146HAT0VLLT

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: -

Request a Quote

MPF5300AMBA0ESR2

NXP

IC REG BUCK ADJ 12A 24HWQFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.5V
• Voltage - Output (Max): 1.2V
• Current - Output: 12A
• Frequency - Switching: 2MHz ~ 3MHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 24-PowerWFQFN
• Supplier Device Package: 24-HWQFN (4.5x3.5)

paquet: -

Request a Quote

TEA2376DT-1Y

NXP

IC

• Mode: Discontinuous (Transition)
• Frequency - Switching: 25kHz ~ 300kHz
• Current - Startup: -
• Voltage - Supply: 0V ~ 22V
• Operating Temperature: -25°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: -

Request a Quote

MCXA143VFT

NXP

IC MCX 48MHZ SGL CR 128KB QFN48

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S32G233AABK0CUCR

NXP

S32G233A ARM CORTEX-M7 AND -A53

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L, LPDDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (4)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

Request a Quote

LPC1115FET48-303EL

NXP

IC MCU 32BIT 64KB FLASH 48TFBGA

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFBGA
• Supplier Device Package: 48-TFBGA (4.5x4.5)

paquet: -