Page 228 - Produits NXP | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559-836
Language Translation

* Please refer to the English Version as our Official Version.

Produits NXP

Dossiers 26 590
Page  228/950
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
BB202,135
NXP

DIODE VAR CAP 6V 10MA SOD523

  • Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
  • Capacitance Ratio: 2.5
  • Capacitance Ratio Condition: C0.2/C2.3
  • Voltage - Peak Reverse (Max): 6V
  • Diode Type: Single
  • Q @ Vr, F: -
  • Operating Temperature: -55°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-79, SOD-523
  • Supplier Device Package: SOD-523
paquet: SC-79, SOD-523
Stock3 424
hot MPC17533EVEL
NXP

IC MOTOR DRIVER PAR 16VMFP

  • Motor Type - Stepper: Bipolar
  • Motor Type - AC, DC: Brushed DC
  • Function: Driver - Fully Integrated, Control and Power Stage
  • Output Configuration: Half Bridge (4)
  • Interface: Parallel
  • Technology: CMOS
  • Step Resolution: -
  • Applications: Battery Powered
  • Current - Output: 700mA
  • Voltage - Supply: 2.7 V ~ 5.7 V
  • Voltage - Load: 2 V ~ 6.8 V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 16-VMFP
paquet: 16-SSOP (0.209", 5.30mm Width)
Stock35 628
NTS0102GU8,125
NXP

IC TXRX 2BIT TRANSLATING 8XQFN

  • Translator Type: Voltage Level
  • Channel Type: Bidirectional
  • Number of Circuits: 1
  • Channels per Circuit: 2
  • Voltage - VCCA: 1.65V ~ 3.6V
  • Voltage - VCCB: 2.3V ~ 5.5V
  • Input Signal: -
  • Output Signal: -
  • Output Type: Open Drain, Tri-State
  • Data Rate: 50Mbps
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Features: Auto-Direction Sensing
  • Mounting Type: Surface Mount
  • Package / Case: 8-XFQFN
  • Supplier Device Package: 8-XQFN (1.4x1.2)
paquet: 8-XFQFN
Stock2 448
74ABT841DB,112
NXP

IC 10BIT BUS INTRFC LATCH 24SSOP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 10:10
  • Output Type: Tri-State
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 4ns
  • Current - Output High, Low: 32mA, 64mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
paquet: 24-SSOP (0.209", 5.30mm Width)
Stock4 512
UJA1078TW/3V3,118
NXP

IC SBC CAN/DUAL LIN 3.3 32HTSSOP

  • Applications: Automotive
  • Interface: CAN, LIN
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Stock4 496
hot MCZ33989EG
NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

  • Applications: System Basis Chip
  • Interface: CAN, SPI
  • Voltage - Supply: 5.5 V ~ 18 V
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
  • Mounting Type: Surface Mount
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock12 144
hot TJA1042T/3/1J
NXP

IC TRANSCEIVER CAN HS 8SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 120mV
  • Data Rate: 5Mbps
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock631 800
MPC8347VRAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
paquet: 620-BBGA Exposed Pad
Stock5 728
KMPC885ZP80
NXP

IC MPU MPC8XX 80MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM, Security; SEC
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (3), 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: Cryptography
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock7 232
MC7447AVS1000LB
NXP

IC MPU MPC74XX 1.0GHZ 360FCCLGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-CLGA, FCCLGA
  • Supplier Device Package: 360-FCCLGA (25x25)
paquet: 360-CLGA, FCCLGA
Stock3 248
hot MC7447AHX1167NB
NXP

IC MPU MPC74XX 1.167GHZ 360BGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.167GHZ
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
paquet: 360-BCBGA, FCCBGA
Stock5 728
P2020NXN2KFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock7 344
hot MPC5554MVR132R2
NXP

IC MCU 32BIT 2MB FLASH 416BGA

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 132MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock11 196
KMSC7118VF1200
NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

  • Type: Fixed Point
  • Interface: Host Interface, I2C, UART
  • Clock Rate: 300MHz
  • Non-Volatile Memory: ROM (8 kB)
  • On-Chip RAM: 464kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.20V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock2 128
MMA6271QR2
NXP

ACCELEROMETER 2.5-10G ANAL 16QFN

  • Type: Analog
  • Axis: X, Y
  • Acceleration Range: ±2.5g, 3.3g, 6.7g, 10g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 480 (±2.5g) ~ 120 (±10g)
  • Bandwidth: 350Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Features: Selectable Scale
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-LQFN Exposed Pad
  • Supplier Device Package: 16-QFN (6x6)
paquet: 16-LQFN Exposed Pad
Stock7 938
PCF7961ATT/C00V1,5
NXP

IC RF REMOTE WIRELESS 20-TSSOP

  • Frequency: 315MHz, 434MHz
  • Applications: Remote Keyless Entry
  • Modulation or Protocol: ASK, FSK
  • Data Rate (Max): 20kbps
  • Power - Output: -
  • Current - Transmitting: -
  • Data Interface: PCB, Surface Mount
  • Antenna Connector: PCB, Surface Mount
  • Memory Size: 16KB
  • Features: Programmable
  • Voltage - Supply: 2.1 V ~ 3.6 V
  • Operating Temperature: -
  • Package / Case: -
paquet: -
Stock8 856
TWR-WIFI-GS1500M
NXP

MSG IMM TWR-WIFI-GS1500M PILOT

  • Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN)
  • Frequency: 2.4GHz
  • For Use With/Related Products: Freescale Tower System
  • Supplied Contents: Board
paquet: -
Stock3 636
MMG3012NT1
NXP

IC AMP RF GP 6000MHZ 5V SOT-89

  • Frequency: 0Hz ~ 6GHz
  • P1dB: 18.5dBm (70.8mW)
  • Gain: 19dB
  • Noise Figure: 3.8dB
  • RF Type: Cellular, PCS, PHS, WLL
  • Voltage - Supply: 5V
  • Current - Supply: 82mA
  • Test Frequency: 900MHz
  • Package / Case: TO-243AA
  • Supplier Device Package: SOT-89-4
paquet: TO-243AA
Stock13 962
TEA19381T/1J
NXP

FLYBACK CONVERTER QR/DCM

  • Output Isolation: -
  • Internal Switch(s): -
  • Voltage - Breakdown: -
  • Topology: -
  • Voltage - Start Up: -
  • Voltage - Supply (Vcc/Vdd): -
  • Duty Cycle: -
  • Frequency - Switching: -
  • Power (Watts): -
  • Fault Protection: -
  • Control Features: -
  • Operating Temperature: -
  • Package / Case: 10-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 10-SO
  • Mounting Type: Surface Mount
paquet: 10-SOIC (0.154", 3.90mm Width)
Stock4 240
NX5P3363UKZ
NXP

5V TYPE-C LOAD SWITCH

  • Switch Type: -
  • Number of Outputs: -
  • Ratio - Input:Output: -
  • Output Configuration: -
  • Output Type: -
  • Interface: -
  • Voltage - Load: -
  • Voltage - Supply (Vcc/Vdd): -
  • Current - Output (Max): -
  • Rds On (Typ): -
  • Input Type: -
  • Features: -
  • Fault Protection: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 320
MC9S08PL4CSC
NXP

MCU 8-BIT 4KB 20MHZ SOIC8

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: LINbus, SCI, UART/USART
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 6
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128 x 8
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock10 128
MKV42F128VLF16
NXP

KINETIS V 32-BIT MCU ARM CORTEX

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 168MHz
  • Connectivity: CANbus, I²C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 21x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock5 792
S912ZVLA64AVFMR
NXP

S12Z CPU, 64K FLASH

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
  • Data Converters: A/D 6x10b; D/A 1x8b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-QFN-EP (5x5)
paquet: -
Request a Quote
TDF8531HH-N2K
NXP

CLASS D AMPLIFIER

  • Type: -
  • Output Type: -
  • Max Output Power x Channels @ Load: -
  • Voltage - Supply: -
  • Features: -
  • Mounting Type: -
  • Operating Temperature: -
  • Supplier Device Package: -
  • Package / Case: -
paquet: -
Request a Quote
MIMX8UD5DVK08SC
NXP

I.MX8ULP,DUAL 800MHZ

  • Core Processor: ARM® Cortex®-A35
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
  • RAM Controllers: LPDDR3, LPDDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: MIPI-CSI, MIPI-DSI
  • Ethernet: 10/100Mbps
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
MWCT2016SHT0VPBR
NXP

MWCT2016S,MAXQFP172

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
FS32K118LAT0VLHT
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 58
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 25K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 16x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: -
Request a Quote
A2G22S251-01SR3
NXP

RF MOSFET GAN 48V NI400

  • Transistor Type: GaN
  • Frequency: 1.805GHz ~ 2.2GHz
  • Gain: 17.7dB
  • Voltage - Test: 48 V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 200 mA
  • Power - Output: 52dBm
  • Voltage - Rated: 125 V
  • Package / Case: NI-400S-2S
  • Supplier Device Package: NI-400S-2S
paquet: -
Request a Quote