Page 220 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
2N5401,412	NXP	TRANS PNP 150V 0.3A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 300mA Voltage - Collector Emitter Breakdown (Max): 150V Vce Saturation (Max) @ Ib, Ic: 500mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V Power - Max: 630mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	paquet: TO-226-3, TO-92-3 (TO-226AA)	Stock4 448
PDTC143ZE,115	NXP	TRANS PREBIAS NPN 150MW SC75 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	paquet: SC-75, SOT-416	Stock5 776
BZX84-B4V7/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 4.7V Tolerance: ±2% Power - Max: 250mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 3µA @ 2V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	paquet: TO-236-3, SC-59, SOT-23-3	Stock4 080
LD6806TD/33H,125	NXP	IC REG LINEAR 3.3V 200MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	paquet: SC-74A, SOT-753	Stock5 664
SC26C92A1A,518	NXP	IC DUART 44PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: 8 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	paquet: 44-LCC (J-Lead)	Stock7 936
MC33689DPEWR2	NXP	IC SYSTEM BASIS W/LIN 32SOIC Applications: Automotive Mirror Control Interface: SPI Serial Voltage - Supply: 5.5 V ~ 18 V Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC Mounting Type: Surface Mount	paquet: 32-SOIC (0.295", 7.50mm Width)	Stock5 008
MPC8379VRAGDA	NXP	IC MPU MPC83XX 400MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock2 384
MPC8378VRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock3 008
KMC7448VS1267ND	NXP	IC MPU MPC74XX 1.267GHZ 360LGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	paquet: 360-CLGA, FCCLGA	Stock3 248
KMPC857TZQ100B	NXP	IC MPU MPC8XX 100MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock2 928
MPC866PCVR100A	NXP	IC MPU MPC8XX 100MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock5 872
P87LPC762FD,512	NXP	IC MCU 8BIT 2KB OTP 20SO Core Processor: 8051 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Number of I/O: 18 Program Memory Size: 2KB (2K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	paquet: 20-SOIC (0.295", 7.50mm Width)	Stock2 016
MC9S12C32MPB25	NXP	IC MCU 16BIT 32KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	paquet: 52-LQFP	Stock6 816
MC68332ACFC20B1	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	paquet: 132-BQFP Bumpered	Stock4 960
MC68HC908KX8CDW	NXP	IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	paquet: 16-SOIC (0.295", 7.50mm Width)	Stock45 624
S9S08EL32F1MTL	NXP	IC MCU 8BIT 32KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	paquet: 28-TSSOP (0.173", 4.40mm Width)	Stock3 728
MC9S12GC32CFAE	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock21 960
SAF7741HV/N125YY	NXP	IC HD RADIO PROCESSOR 144HLQFP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock2 784
MC100ES6039DW	NXP	IC CLOCK GENERATION CHIP 20-SOIC Type: Clock Generator PLL: Yes Input: ECL, HSTL, LVDS, PECL Output: ECL Number of Circuits: 1 Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Frequency - Max: 1GHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.8 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	paquet: 20-SOIC (0.295", 7.50mm Width)	Stock7 152
SX5148P1KWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock5 220
TEF6659HN/V102K	NXP	IC TUNER 1CHIP RADIO DSP 32HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: - Current - Receiving: 37mA Data Interface: - Memory Size: - Antenna Connector: - Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	paquet: 32-VFQFN Exposed Pad	Stock5 256
PCAL6524EVJ	NXP	ULTRA LOW-VOLTAGE TRANSLATING 24 Number of I/O: 24 Interface: I²C Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: - Clock Frequency: 1MHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 36-VFBGA Supplier Device Package: 36-VFBGA (2.6x2.6)	paquet: 36-VFBGA	Stock36 384
S912ZVHL64F1VLL	NXP	MAGNIV 16-BIT MCU S12Z CORE 64 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 73 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	paquet: 100-LQFP	Stock7 472
MC33FS8500A0KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	paquet: -	Request a Quote
S9S12G128J0VLHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	paquet: -	Request a Quote
FB32K146HFT0VLHR	NXP	S32K146, M4F, FLASH 1M, RAM 128K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
SAF7771EL-200Z10AY	NXP	SAF7771EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	paquet: -	Request a Quote
S32K324EHT1VPBST	NXP	S32K344, 4MB FLASH, ARM M7 LOCKS Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 160MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Number of I/O: 218 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	paquet: -	Request a Quote

2N5401,412

NXP

TRANS PNP 150V 0.3A TO-92

Transistor Type: PNP
Current - Collector (Ic) (Max): 300mA
Voltage - Collector Emitter Breakdown (Max): 150V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V
Power - Max: 630mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA)

Stock4 448

PDTC143ZE,115

NXP

TRANS PREBIAS NPN 150MW SC75

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 4.7k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

paquet: SC-75, SOT-416

Stock5 776

BZX84-B4V7/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 4.7V
Tolerance: ±2%
Power - Max: 250mW
Impedance (Max) (Zzt): 80 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 2V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

Stock4 080

LD6806TD/33H,125

NXP

IC REG LINEAR 3.3V 200MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 3.3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

paquet: SC-74A, SOT-753

Stock5 664

SC26C92A1A,518

NXP

IC DUART 44PLCC

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: 8 Byte
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

paquet: 44-LCC (J-Lead)

Stock7 936

MC33689DPEWR2

NXP

IC SYSTEM BASIS W/LIN 32SOIC

Applications: Automotive Mirror Control
Interface: SPI Serial
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC
Mounting Type: Surface Mount

paquet: 32-SOIC (0.295", 7.50mm Width)

Stock5 008

MPC8379VRAGDA

NXP

IC MPU MPC83XX 400MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock2 384

MPC8378VRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock3 008

KMC7448VS1267ND

NXP

IC MPU MPC74XX 1.267GHZ 360LGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.267GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

paquet: 360-CLGA, FCCLGA

Stock3 248

KMPC857TZQ100B

NXP

IC MPU MPC8XX 100MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock2 928

MPC866PCVR100A

NXP

IC MPU MPC8XX 100MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock5 872

P87LPC762FD,512

NXP

IC MCU 8BIT 2KB OTP 20SO

Core Processor: 8051
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Number of I/O: 18
Program Memory Size: 2KB (2K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

paquet: 20-SOIC (0.295", 7.50mm Width)

Stock2 016

MC9S12C32MPB25

NXP

IC MCU 16BIT 32KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

paquet: 52-LQFP

Stock6 816

MC68332ACFC20B1

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

paquet: 132-BQFP Bumpered

Stock4 960

MC68HC908KX8CDW

NXP

IC MCU 8BIT 8KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

Stock45 624

S9S08EL32F1MTL

NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

paquet: 28-TSSOP (0.173", 4.40mm Width)

Stock3 728

MC9S12GC32CFAE

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock21 960

SAF7741HV/N125YY

NXP

IC HD RADIO PROCESSOR 144HLQFP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock2 784

MC100ES6039DW

NXP

IC CLOCK GENERATION CHIP 20-SOIC

Type: Clock Generator
PLL: Yes
Input: ECL, HSTL, LVDS, PECL
Output: ECL
Number of Circuits: 1
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Frequency - Max: 1GHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.8 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

Stock7 152

SX5148P1KWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock5 220

TEF6659HN/V102K

NXP

IC TUNER 1CHIP RADIO DSP 32HVQFN

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: -
Current - Receiving: 37mA
Data Interface: -
Memory Size: -
Antenna Connector: -
Features: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

Stock5 256

PCAL6524EVJ

NXP

ULTRA LOW-VOLTAGE TRANSLATING 24

Number of I/O: 24
Interface: I²C
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: -
Clock Frequency: 1MHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 36-VFBGA
Supplier Device Package: 36-VFBGA (2.6x2.6)

paquet: 36-VFBGA

Stock36 384

S912ZVHL64F1VLL

NXP

MAGNIV 16-BIT MCU S12Z CORE 64

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 73
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

Stock7 472

MC33FS8500A0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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S9S12G128J0VLHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

paquet: -

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FB32K146HFT0VLHR

NXP

S32K146, M4F, FLASH 1M, RAM 128K

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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SAF7771EL-200Z10AY

NXP

SAF7771EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

paquet: -

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S32K324EHT1VPBST

NXP

S32K344, 4MB FLASH, ARM M7 LOCKS

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

paquet: -

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