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Produits NXP

Dossiers 26 590
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MRF7S21080HR5
NXP

FET RF 65V 2.17GHZ NI-780

  • Transistor Type: LDMOS
  • Frequency: 2.17GHz
  • Gain: 18dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 800mA
  • Power - Output: 22W
  • Voltage - Rated: 65V
  • Package / Case: NI-780
  • Supplier Device Package: NI-780
paquet: NI-780
Stock3 440
MRF5S19100HSR5
NXP

FET RF 65V 1.99GHZ NI-780S

  • Transistor Type: LDMOS
  • Frequency: 1.93GHz ~ 1.99GHz
  • Gain: 13.9dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1A
  • Power - Output: 22W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
paquet: NI-780S
Stock6 048
MRF18085BLR3
NXP

FET RF 65V 1.99GHZ NI-78O

  • Transistor Type: LDMOS
  • Frequency: 1.93GHz ~ 1.99GHz
  • Gain: 12.5dB
  • Voltage - Test: 26V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 800mA
  • Power - Output: 90W
  • Voltage - Rated: 65V
  • Package / Case: NI-780
  • Supplier Device Package: NI-780
paquet: NI-780
Stock2 160
MC33999EKR2
NXP

IC SWITCH LOW SIDE 16OUT 54-SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 16
  • Ratio - Input:Output: 1:16
  • Output Configuration: Low Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 5 V ~ 27 V
  • Voltage - Supply (Vcc/Vdd): 1.5 V ~ 3 V
  • Current - Output (Max): 900mA
  • Rds On (Typ): 550 mOhm
  • Input Type: -
  • Features: PWM Input
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 54-SOICW-EP
paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Stock5 424
74LV139N,112
NXP

IC DUAL 2-4 DECODER/DEMUX 16-DIP

  • Type: Decoder/Demultiplexer
  • Circuit: 1 x 2:4
  • Independent Circuits: 2
  • Current - Output High, Low: 12mA, 12mA
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 1 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock4 208
74LVC841ADB,112
NXP

IC 10BIT TRANSP LATCH 24SSOP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 10:10
  • Output Type: Tri-State
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 1.5ns
  • Current - Output High, Low: 24mA, 24mA
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
paquet: 24-SSOP (0.209", 5.30mm Width)
Stock2 176
hot MC145028P
NXP

IC DECODER 9 ADDR LINES 16-DIP

  • Type: Encoder, Decoder
  • Applications: Remote Control
  • Voltage - Supply, Analog: 4.5 V ~ 18 V
  • Voltage - Supply, Digital: 4.5 V ~ 18 V
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock56 868
MPC8535BVTATLA
NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.25GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock6 432
P2010NXE2HHC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock4 752
KMC68EN360ZQ25VL
NXP

IC MPU M683XX 25MHZ 357BGA

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock2 256
KMPC8543HXAQG
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock5 280
hot MPC823VR66B2T
NXP

IC MPU MPC8XX 66MHZ 256BGA

  • Core Processor: PowerPC
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, Video
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
paquet: 256-BBGA
Stock6 560
MCIMX6D4AVT08ADR
NXP

IC MPU I.MX6D 852MHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 852MHZ
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
paquet: 624-FBGA, FCBGA
Stock6 304
S9S08RNA32W0MLCR
NXP

IC MCU 8BIT 32KB FLASH 32LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock2 864
MVF61NS151CMK50
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 500MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, WDT
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D Dual x 12b, D/A Dual x 12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
paquet: 364-LFBGA
Stock7 408
MC68HC908JB12JDW
NXP

IC MCU 8BIT 12KB FLASH 20SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 6MHz
  • Connectivity: SCI, USB
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 12KB (12K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 384 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock7 248
S9S12XS128J1CAER
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 40MHz
  • Connectivity: CAN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 44
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock6 912
hot MK20DX256VLL7
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 33x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock15 888
MK24FN1M0VLQ12
NXP

IC MCU 32BIT 1MB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 41x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock7 984
LPC11E14FBD48/401,
NXP

IC MCU 32BIT 32KB FLASH 48LQFP

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 40
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 10K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock22 776
MPC962309D-1
NXP

IC CLOCK BUFFER 1:9 16-SOIC

  • Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer
  • PLL: Yes
  • Input: LVCMOS
  • Output: LVCMOS
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:9
  • Differential - Input:Output: No/No
  • Frequency - Max: 133.33MHz
  • Divider/Multiplier: No/No
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock4 528
SA615D/01,118
NXP

IC MIXER 500MHZ UP CONVRT 20SO

  • RF Type: Cellular, ASK, FSK, UHF, VHF
  • Frequency: 500MHz
  • Number of Mixers: 3
  • Gain: 13dB
  • Noise Figure: 5dB
  • Secondary Attributes: Up Converter
  • Current - Supply: 7.4mA
  • Voltage - Supply: 4.5 V ~ 8 V
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock8 730
T1022NSE7PQPB
NXP

QORIQ 2X E5500 1400MHZ DDR3L/

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 632
MK11DN512AVLK5R
NXP

KINETIS K 32-BIT MCU ARM CORTEX

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I²C, IrDA, SPI, UART/USART
  • Peripherals: DMA, I²S, LVD, POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 24x16b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-FQFP (12x12)
paquet: 80-LQFP
Stock6 144
S9S12G96ACLHR
NXP

16BIT 96K FLASH

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 3K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock6 160
MCZ33800EK
NXP

IC ENGINE CTRL SW/DVR 54-SOIC

  • Applications: Automotive
  • Current - Supply: 10mA
  • Voltage - Supply: 5V ~ 36V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 54-SOIC-EP
paquet: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Stock5 728
FS32K148HET0VLQT
NXP

IC MCU 32BIT 2MB FLASH 144LQFP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 80MHz
  • Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: I2S, POR, PWM, WDT
  • Number of I/O: 128
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 32x12b SAR; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: -
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A3T18H360W23SR6
NXP

RF MOSFET LDMOS 28V ACP1230S-4

  • Transistor Type: LDMOS
  • Frequency: 1.8GHz ~ 1.88GHz
  • Gain: 16.6dB
  • Voltage - Test: 28 V
  • Current Rating: 10µA
  • Noise Figure: -
  • Current - Test: 700 mA
  • Power - Output: 63W
  • Voltage - Rated: 65 V
  • Package / Case: ACP-1230S-4L2S
  • Supplier Device Package: ACP-1230S-4L2S
paquet: -
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