Produits NXP

A2T09VD250NR1

NXP

IC TRANS RF LDMOS

• Transistor Type: LDMOS (Dual)
• Frequency: 920MHz
• Gain: 22.5dB
• Voltage - Test: 48V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1A
• Power - Output: 65W
• Voltage - Rated: 105V
• Package / Case: TO-270-6 Variant, Flat Leads
• Supplier Device Package: TO-270WB-6A

paquet: TO-270-6 Variant, Flat Leads

BAW156/ZLVL

NXP

DIODE ARRAY GEN PURP 75V SOT23

• Diode Configuration: 1 Pair Common Anode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75V
• Current - Average Rectified (Io) (per Diode): 160mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 3µs
• Current - Reverse Leakage @ Vr: 5nA @ 75V
• Operating Temperature - Junction: 150°C (Max)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

TLVH431DQDBVR,115

NXP

IC VREF SHUNT ADJ SC74A

• Reference Type: Shunt
• Output Type: Adjustable
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 18V
• Current - Output: 70mA
• Tolerance: ±0.75%
• Temperature Coefficient: -
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: -
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 80µA
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

paquet: SC-74A, SOT-753

MC33879EKR2

NXP

IC SERIAL SWITCH OCTAL 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:4
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 26.5 V
• Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
• Current - Output (Max): 600mA
• Rds On (Typ): 750 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

SSTUG32868ET/S,518

NXP

IC BUFFER 1.8V 25BIT 176-LFBGA

• Logic Type: 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 176-TFBGA
• Supplier Device Package: 176-TFBGA (6x15)

paquet: 176-TFBGA

N74F543DB,112

NXP

IC TRANSCVR TRI-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

paquet: 24-SSOP (0.209", 5.30mm Width)

TDA9885TS/V3/S1:11

NXP

IC IF-PLL I2C-BUS DEMOD 24-SSOP

• Type: Demodulator
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

paquet: 24-SSOP (0.209", 5.30mm Width)

UJA1078ATW/3V3/WDJ

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

• Applications: Automotive
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

TJA1050T/N1,518

NXP

IC CAN TRANSCEIVER HS 8-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

MCIMX31VMN5C

NXP

IC MPU I.MX31 532MHZ 473MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 532MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keyboard, Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
• Package / Case: 473-LFBGA
• Supplier Device Package: -

paquet: 473-LFBGA

MC908LJ12CPBE

NXP

IC MCU 8BIT 12KB FLASH 64LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MC908GZ32CFJE

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MC9S08DZ128CLF

NXP

IC MCU 8BIT 128KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MK22FN512VFX12

NXP

IC MCU 32BIT 512KB FLASH 88QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 88-VFQFN Exposed Pad
• Supplier Device Package: 88-QFN (10x10)

paquet: 88-VFQFN Exposed Pad

S9S08SG32E1MTJR

NXP

IC MCU 8BIT 32KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

MC9S08QE32CFM

NXP

IC MCU 8BIT 32KB FLASH 32QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

paquet: 32-VFQFN Exposed Pad

PESD3V3V4UG,115

NXP

TVS DIODE 3.3VWM 11VC SOT353

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 3.3V (Max)
• Voltage - Breakdown (Min): 5.3V
• Voltage - Clamping (Max) @ Ipp: 11V
• Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
• Power - Peak Pulse: 16W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 15pF @ 1MHz
• Operating Temperature: -65°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: 5-TSSOP

paquet: 5-TSSOP, SC-70-5, SOT-353

MMA6255AEGR2

NXP

ACCELEROMETER 50G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±50g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 9.37mV/V/g
• Bandwidth: 3kHz
• Output Type: Analog Voltage
• Voltage - Supply: 3.15 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

NCF2954XHN/0500IJ

NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MFRC52202HN1,151

NXP

IC READER 32-HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.3 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

HTMS1201FTK/AF,115

NXP

RFID HTAG SOT899-1

• Style: Encapsulated
• Technology: Passive
• Frequency: 100kHz ~ 150kHz
• Memory Type: Read/Write
• Writable Memory: 1.76kb (User)
• Standards: ISO 11784, ISO 11785
• Operating Temperature: -
• Size / Dimension: 1.45mm x 1.00mm x 0.50mm

paquet: -

PNEV533D,699

NXP

BOARD EVAL NFC PN533

• Type: Near Field Communication
• Frequency: 13.56MHz
• For Use With/Related Products: PN533
• Supplied Contents: Board

paquet: -

QN9080-DK

NXP

QN9080-DK

• Type: -
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: -

paquet: -

MC34PF3001A5EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

• Applications: Processor
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

paquet: 48-VFQFN Exposed Pad

G4860NSE7QUMD

NXP

QORIQ QONVERGE SOC 6X1.2GHZ STA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S9S12G96J0CLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: -

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MIMXRT1172AVM8AR

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

paquet: -

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PDZ6-8B-ZLX

NXP

DIODE ZENER SOD323

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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