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Produits NXP

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BT149B,126
NXP

THYRISTOR 200V 0.8A SOT54

  • Voltage - Off State: 200V
  • Voltage - Gate Trigger (Vgt) (Max): 800mV
  • Current - Gate Trigger (Igt) (Max): 200µA
  • Voltage - On State (Vtm) (Max): 1.7V
  • Current - On State (It (AV)) (Max): 500mA
  • Current - On State (It (RMS)) (Max): 800mA
  • Current - Hold (Ih) (Max): 5mA
  • Current - Off State (Max): 100µA
  • Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 9A
  • SCR Type: Sensitive Gate
  • Operating Temperature: -
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Stock3 312
BZX284-B6V8,115
NXP

DIODE ZENER 6.8V 400MW SOD2

  • Voltage - Zener (Nom) (Vz): 6.8V
  • Tolerance: ±2%
  • Power - Max: 400mW
  • Impedance (Max) (Zzt): 15 Ohms
  • Current - Reverse Leakage @ Vr: 2µA @ 4V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SOD-110
  • Supplier Device Package: SOD110
paquet: SOD-110
Stock5 680
TEA1703TS/N1,115
NXP

IC CTLR SMPS STANDBY 6TSOP

  • Applications: Secondary-Side Controller
  • Voltage - Input: 5 V ~ 30 V
  • Voltage - Supply: 5 V ~ 30 V
  • Current - Supply: 30µA
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SC-74, SOT-457
  • Supplier Device Package: 6-TSOP
paquet: SC-74, SOT-457
Stock6 656
hot PCA9624PW,118
NXP

IC LED DRIVER LINEAR DIM 24TSSOP

  • Type: Linear
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 8
  • Voltage - Supply (Min): 2.3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: 40V
  • Current - Output / Channel: 100mA
  • Frequency: 100kHz ~ 1MHz
  • Dimming: PWM
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock30 000
74LVC38AD,112
NXP

IC GATE NAND 4CH 2-INP 14-SO

  • Logic Type: NAND Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: Open Drain
  • Voltage - Supply: 1.2 V ~ 5.5 V
  • Current - Quiescent (Max): 40µA
  • Current - Output High, Low: -, 32mA
  • Logic Level - Low: 0.7 V ~ 0.8 V
  • Logic Level - High: 1.7 V ~ 2 V
  • Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-SO
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
paquet: 14-SOIC (0.154", 3.90mm Width)
Stock4 928
74LVCH16244AEV,118
NXP

IC BUFF DVR TRI-ST 16BIT 56VFBGA

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.65 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFBGA
  • Supplier Device Package: 56-VFBGA (4.5x7)
paquet: 56-VFBGA
Stock7 568
74LVC623ADB,112
NXP

IC TRANSCVR 8BIT N-INV 20SSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
paquet: 20-SSOP (0.209", 5.30mm Width)
Stock4 448
74ABT240PW,112
NXP

IC BUFF INVERT 5.5V 20TSSOP

  • Logic Type: Buffer, Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
paquet: 20-TSSOP (0.173", 4.40mm Width)
Stock3 984
MC34017A-2P
NXP

IC PHONE TONE RINGER 2KHZ 8-DIP

  • Function: Tone Ringer
  • Interface: -
  • Number of Circuits: 1
  • Voltage - Supply: 5V
  • Current - Supply: 20mA
  • Power (Watts): 1W
  • Operating Temperature: -20°C ~ 60°C
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock4 144
PCA9541BS/01,118
NXP

IC I2C 2:1 SELECTOR 16-HVQFN

  • Applications: 2-Channel I2C Multiplexer
  • Interface: I2C
  • Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Package / Case: 16-VQFN Exposed Pad
  • Supplier Device Package: 16-HVQFN (4x4)
  • Mounting Type: Surface Mount
paquet: 16-VQFN Exposed Pad
Stock3 808
PCA9511AD,118
NXP

IC BUFFER I2C/SMBUS HOTSWAP 8SO

  • Type: Buffer, Accelerator
  • Applications: I2C - Hotswap
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 400kHz
  • Number of Channels: 1
  • Delay Time: -
  • Signal Conditioning: -
  • Capacitance - Input: 5pF
  • Voltage - Supply: 2.7 V ~ 5.5 V
  • Current - Supply: 6mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock4 256
hot MC33990DR2
NXP

IC TRANSCEIVER J-1850 BUS 8-SOIC

  • Type: Transceiver
  • Protocol: -
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 200mV
  • Data Rate: 10.4Kbps
  • Voltage - Supply: 9 V ~ 16 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock36 252
MC68HC000CEI16
NXP

IC MPU M680X0 16MHZ 68PLCC

  • Core Processor: EC000
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 68-LCC (J-Lead)
  • Supplier Device Package: 68-PLCC (25x25)
paquet: 68-LCC (J-Lead)
Stock4 176
MC68EC020AA16
NXP

IC MPU M680X0 16MHZ 100QFP

  • Core Processor: 68020
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-QFP (14x20)
paquet: 100-BQFP
Stock5 952
hot MPC850CZQ50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
paquet: 256-BBGA
Stock5 568
PK50N512CLQ100
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 96
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 25x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock3 808
P87C51RB2BN,112
NXP

IC MCU 8BIT 16KB OTP 40DIP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 33MHz
  • Connectivity: EBI/EMI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 40-DIP (0.600", 15.24mm)
  • Supplier Device Package: 40-DIP
paquet: 40-DIP (0.600", 15.24mm)
Stock5 536
hot MC908QB4CDWE
NXP

IC MCU 8BIT 4KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock22 404
SPC5748GTK1MMJ6
NXP

IC MCU 32BIT 6MB FLASH 256MAPBGA

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock4 240
hot MC68HC98LJ12CFUE
NXP

IC MCU 8BIT 12KB FLASH 64QFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: IRSCI, SPI
  • Peripherals: LCD, LVD, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 12KB (12K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
paquet: 64-QFP
Stock4 448
M53017MOD
NXP

MODULE MCF5301 32-BIT VOIP

  • Module/Board Type: MCU, VOIP Core
  • Core Processor: ColdFire V3, MCF53017
  • Co-Processor: -
  • Speed: 80MHz
  • Flash Size: 32MB
  • RAM Size: 64MB
  • Connector Type: Edge Connector
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock6 080
JN5139/Z01,515
NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

  • Type: TxRx + MCU
  • RF Family/Standard: 802.15.4
  • Protocol: Zigbee?
  • Modulation: -
  • Frequency: 2.4GHz
  • Data Rate (Max): 1Mbps
  • Power - Output: 3dBm
  • Sensitivity: -97dBm
  • Memory Size: 192kB ROM, 96kB RAM
  • Serial Interfaces: SPI, UART
  • GPIO: 21
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Current - Receiving: 37mA
  • Current - Transmitting: 38mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 56-VFQFN
paquet: 56-VFQFN
Stock5 184
MC35FS6500NAER2
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock4 160
MC34PF1510A2EP
NXP

PF1510

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 3.8 V ~ 7 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-QFN (5x5)
paquet: 40-VFQFN Exposed Pad
Stock3 472
SPC5745BBK1AMMH6
NXP

32 BIT,SINGLE CORE,2M FL

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
paquet: 100-LBGA
Stock7 584
S912XET256W1MALR
NXP

16-BIT MCU S12X CORE 256KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
paquet: 112-LQFP
Stock3 792
S912ZVMBA6F0WLFR
NXP

VMB64 64K FLASH 4K RAM 48LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
  • Data Converters: A/D 5x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock4 496
KC9S08AW32CFGE
NXP

NO DESCRIPTION

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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