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Produits NXP

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BUK6240-75C,118
NXP

MOSFET N-CH 75V 22A DPAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 75V
  • Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2.8V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 21.4nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 1280pF @ 25V
  • Vgs (Max): ±16V
  • FET Feature: -
  • Power Dissipation (Max): 60W (Tc)
  • Rds On (Max) @ Id, Vgs: 46 mOhm @ 10A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: DPAK
  • Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
paquet: TO-252-3, DPak (2 Leads + Tab), SC-63
Stock2 896
MRF7S18125AHSR3
NXP

FET RF 65V 1.88GHZ NI780S

  • Transistor Type: LDMOS
  • Frequency: 1.88GHz
  • Gain: 17dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.1A
  • Power - Output: 125W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
paquet: NI-780S
Stock4 512
PZM9.1NB2,115
NXP

DIODE ZENER 9.1V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 9.1V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 10 Ohms
  • Current - Reverse Leakage @ Vr: 500nA @ 6V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
paquet: TO-236-3, SC-59, SOT-23-3
Stock2 560
BUK127-50GT,115
NXP

TOPFET LOGIC LVL 50V SOT-223

  • Switch Type: General Purpose
  • Number of Outputs: 1
  • Ratio - Input:Output: 1:1
  • Output Configuration: Low Side
  • Output Type: N-Channel
  • Interface: On/Off
  • Voltage - Load: 50V (Max)
  • Voltage - Supply (Vcc/Vdd): Not Required
  • Current - Output (Max): 2.1A
  • Rds On (Typ): 150 mOhm
  • Input Type: Non-Inverting
  • Features: -
  • Fault Protection: Over Temperature, Over Voltage
  • Operating Temperature: 150°C (TJ)
  • Package / Case: TO-261-4, TO-261AA
  • Supplier Device Package: SOT-223
paquet: TO-261-4, TO-261AA
Stock3 040
SSTU32864EC,551
NXP

IC BUFFER 1.8V 25BIT SOT536-1

  • Logic Type: 1:1, 1:2 Configurable Registered Buffer
  • Supply Voltage: 1.7 V ~ 1.9 V
  • Number of Bits: 25, 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
paquet: 96-LFBGA
Stock4 784
74HCT688PW,112
NXP

IC COMPARATOR MAGNITUDE 20TSSOP

  • Type: Identity Comparator
  • Number of Bits: 8
  • Output: Active Low
  • Output Function: A=B
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Output High, Low: 4mA, 4mA
  • Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
  • Current - Quiescent (Iq): 8µA
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type: Surface Mount
paquet: 20-TSSOP (0.173", 4.40mm Width)
Stock6 288
74ABT652APW,112
NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock2 304
SC28L202A1DGG,118
NXP

IC UART DUAL W/FIFO 56-TSSOP

  • Features: Configurable GPIO, Internal Oscillator, Timer/Counter
  • Number of Channels: 1, UART
  • FIFO's: 256 Byte
  • Protocol: RS485
  • Data Rate (Max): 3.125Mbps
  • Voltage - Supply: 3.3V, 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
paquet: 56-TFSOP (0.240", 6.10mm Width)
Stock6 656
MC34978EK
NXP

IC INTERFACE SW DETECT 32-SOIC

  • Applications: Multiple Switch Detection
  • Interface: -
  • Voltage - Supply: 4.5 V ~ 36 V
  • Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
  • Mounting Type: Surface Mount
paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Stock5 168
UDA1355H/N2,518
NXP

IC CODEC STER/SUDIO SPDIF 44QFP

  • Type: Stereo Audio
  • Data Interface: I2C, Serial
  • Resolution (Bits): 24 b
  • Number of ADCs / DACs: 2 / 2
  • Sigma Delta: No
  • S/N Ratio, ADCs / DACs (db) Typ: 97 / 98
  • Dynamic Range, ADCs / DACs (db) Typ: -
  • Voltage - Supply, Analog: 2.7 V ~ 5.5 V
  • Voltage - Supply, Digital: 2.7 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 44-QFP
  • Supplier Device Package: 44-PQFP (10x10)
paquet: 44-QFP
Stock7 088
MPC8536EBVTAULA
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock6 400
MPC8358CZUAGDG
NXP

IC MPU MPC83XX 400MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
paquet: 740-LBGA
Stock4 896
hot KMPC8241LVR266D
NXP

IC MPU MPC82XX 266MHZ 357BGA

  • Core Processor: PowerPC 603e
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock3 664
MPC8308ZQAGDA
NXP

IC MPU MPC83XX 400MHZ 473MAPBGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock5 120
P87C51RA2BA,512
NXP

IC MCU 8BIT 8KB OTP 44PLCC

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 33MHz
  • Connectivity: EBI/EMI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
paquet: 44-LCC (J-Lead)
Stock3 712
P89LPC913FDH,129
NXP

IC MCU 8BIT 1KB FLASH 14TSSOP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 18MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 1KB (1K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 14-TSSOP
paquet: 14-TSSOP (0.173", 4.40mm Width)
Stock2 576
hot MC9S08RG60CFG
NXP

IC MCU 8BIT 60KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
paquet: 44-LQFP
Stock4 720
S912XEP100J5VAGR
NXP

IC MCU 16BIT 1MB FLASH 144LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 119
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock5 440
hot MC9S08SH4MTG
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
paquet: 16-TSSOP (0.173", 4.40mm Width)
Stock18 516
MC33771BTB1AE
NXP

BCC14

  • Function: Battery Cell Controller
  • Battery Chemistry: Lithium-Ion
  • Number of Cells: 7 ~ 14
  • Fault Protection: Over/Under Voltage
  • Interface: SPI
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP Exposed Pad
Stock4 096
S9S08RN8W2MLC
NXP

8-BIT MCU S08 CORE 8KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock5 680
TFA9894DUK/N2Z
NXP

DSP AUDIO AMP CLASS D

  • Type: Class D
  • Output Type: 1-Channel (Mono)
  • Max Output Power x Channels @ Load: 9.5mW x 1 @ 4Ohm, 5.6mW x 1 @ 8Ohm
  • Voltage - Supply: 2.7V ~ 5.5V
  • Features: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 48-WLCSP (2.51x3.55)
  • Package / Case: 48-UFBGA, WLCSP
paquet: 48-UFBGA, WLCSP
Stock32 490
FS32R294HAK0MJDR
NXP

IC MCU 32BIT 2MB CRAM 269LFBGA

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 269-LFBGA
  • Supplier Device Package: 269-LFBGA (14x14)
paquet: -
Request a Quote
LPC1765FET100K
NXP

IC MCU 32BIT 256KB FLSH 100TFBGA

  • Core Processor: ARM® Cortex®-M3
  • Core Size: 32-Bit Single-Core
  • Speed: 100MHz
  • Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
  • Data Converters: A/D 8x12b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
paquet: -
Stock5 853
MC32PF1550A8EP
NXP

POWER MANAGEMENT IC 3 BUCK REGS

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 4.1V ~ 6V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (5x5)
paquet: -
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AFM906NT1
NXP

RF MOSFET LDMOS 10.8V 16DFN

  • Transistor Type: LDMOS
  • Frequency: 136MHz ~ 941MHz
  • Gain: -
  • Voltage - Test: 10.8 V
  • Current Rating: 2µA
  • Noise Figure: -
  • Current - Test: 100 mA
  • Power - Output: 6.8W
  • Voltage - Rated: 30 V
  • Package / Case: 16-VDFN Exposed Pad
  • Supplier Device Package: 16-DFN (4x6)
paquet: -
Stock2 826
MC07XSG517DEKR2
NXP

HIGH-SIDE SWITCH, 32V, TRIPLE 7M

  • Switch Type: General Purpose
  • Number of Outputs: 6
  • Ratio - Input:Output: 2:3
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 7V ~ 30V
  • Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
  • Current - Output (Max): -
  • Rds On (Typ): 7mOhm
  • Input Type: Non-Inverting
  • Features: Internal PWM, Slew Rate Controlled, Status Flag
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 54-HSOP
paquet: -
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PCF8576DT-S400-2Y
NXP

UNIVERSAL LCD DRIVER FOR LOW MUL

  • Display Type: LCD
  • Configuration: 40 Segment
  • Interface: I2C
  • Digits or Characters: 10 Characters, 20 Characters, 160 Elements
  • Current - Supply: 3.5 µA
  • Voltage - Supply: 1.8V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
paquet: -
Request a Quote