Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC DDR TERM W/STANDBY 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock4 032 |
|
14mA | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 8-HSO |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
paquet: 206-LFBGA |
Stock2 000 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (13x13) |
||
NXP |
IC REG MULTIPLE VOLTAGE DBS23P
|
paquet: 23-SIP Formed Leads |
Stock7 392 |
|
300µA | 9 V ~ 18 V | -40°C ~ 85°C | Through Hole | 23-SIP Formed Leads | DBS23P |
||
NXP |
IC SBC W/PWR SUPPLY 64LQFP
|
paquet: 64-LQFP Exposed Pad |
Stock7 840 |
|
- | 5.2 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
NXP |
IC SBC W/PWR SUPPLY 64LQFP
|
paquet: 64-LQFP Exposed Pad |
Stock4 224 |
|
- | 5.2 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock4 256 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
paquet: 206-LFBGA |
Stock15 000 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (8x8) |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
paquet: 206-LFBGA |
Stock3 632 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (8x8) |
||
NXP |
IC MULTI COIL 5W 5V 32QFN
|
paquet: - |
Stock5 712 |
|
- | - | - | - | - | - |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock5 248 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC RECEIVER 16KB FLASH 32QFN
|
paquet: 36-UFBGA, WLCSP |
Stock4 640 |
|
120mA | 3.5 V ~ 20 V | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (3.07x2.98) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6 064 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock5 248 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3 408 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
paquet: 139-TFBGA |
Stock2 112 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
paquet: 139-TFBGA |
Stock17 964 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 186BGA
|
paquet: 186-LFBGA |
Stock6 224 |
|
- | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
paquet: 139-TFBGA |
Stock3 824 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 186BGA
|
paquet: 186-LFBGA |
Stock3 360 |
|
- | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
paquet: 139-TFBGA |
Stock14 856 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3 792 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SWITCH HIGH SIDE 32SOIC
|
paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6 224 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock2 016 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC PWR MGMT IMX50/53 130MAPBGA
|
paquet: 130-LFBGA |
Stock3 792 |
|
370µA | 3 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 130-LFBGA | 130-MAPBGA (8x8) |
||
NXP |
IC ENGINE CTRL SW/DVR 54-SOIC
|
paquet: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3 152 |
|
10mA | 5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOICW-EP |
||
NXP |
IC CTRL SMALL ENG 2CYL 48LQFP
|
paquet: 48-LQFP Exposed Pad |
Stock4 992 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock7 616 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC REG MULTIPLE VOLTAGE 20HSOP
|
paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock5 456 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |