Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock7 568 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS4500
|
paquet: 48-LQFP Exposed Pad |
Stock5 136 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock6 080 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
paquet: 48-LQFP Exposed Pad |
Stock5 696 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
15W SINGLE-COIL CONSUMER STAND
|
paquet: - |
Stock4 256 |
|
- | - | - | - | - | - |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock6 336 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock4 656 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock5 856 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock3 904 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock7 328 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
FS6500
|
paquet: 48-LQFP Exposed Pad |
Stock4 400 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock5 616 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
paquet: 48-LQFP Exposed Pad |
Stock4 160 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock5 504 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP CAN 5V 1.5
|
paquet: 48-LQFP Exposed Pad |
Stock5 040 |
|
13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS4500
|
paquet: 48-LQFP Exposed Pad |
Stock7 136 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock4 944 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock6 784 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock6 144 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock5 552 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock6 736 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
paquet: 48-LQFP Exposed Pad |
Stock2 144 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP CAN 5V 0.7
|
paquet: 48-LQFP Exposed Pad |
Stock5 536 |
|
13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock7 616 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
TRANSFORMER PHYSICAL LAYER
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock4 128 |
|
40mA | 4.5 V ~ 7 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock5 056 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock3 232 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
PF1550
|
paquet: 40-VFQFN Exposed Pad |
Stock4 912 |
|
- | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |