Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC TXRX NON-INV 3-ST 8BIT 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock6 656 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC BUFF INVERT 5.5V 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 808 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF INVERT 5.5V 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 512 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUS TXRX TRI-ST 4BIT 14DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock2 256 |
|
1 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
NXP |
IC TRANSCVR TRI-ST 8BIT 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 872 |
|
1 | 8 | - | Push-Pull | 3mA, 24mA; 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC TRANSCVR TRI-ST 8BIT 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 424 |
|
1 | 8 | - | Push-Pull | 3mA, 24mA; 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFFER/LINE DVR 16B 60HXQFN
|
paquet: 60-XFQFN Dual Rows, Exposed Pad |
Stock6 432 |
|
4 | 4 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 60-XFQFN Dual Rows, Exposed Pad | 60-HXQFN (4x6) |
||
NXP |
TXRX 16BIT NON-INV 3ST HUQFN60U
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock2 608 |
|
2 | 8 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
IC BUFFER/LINE DVR 16B 60HXQFN
|
paquet: 60-XFQFN Dual Rows, Exposed Pad |
Stock7 968 |
|
4 | 4 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 60-XFQFN Dual Rows, Exposed Pad | 60-HXQFN (4x6) |
||
NXP |
TXRX 16BIT NON-INV 3ST 60HUQFN
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock3 424 |
|
2 | 8 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
IC BUFFER/DVR 16BIT 3ST 60HUQFN
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock4 160 |
|
4 | 4 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
IC BUFFER/DVR 16BIT 3ST 60HUQFN
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock4 288 |
|
4 | 4 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
TXRX 16BIT 3.3V 3ST 60HUQFN
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock4 848 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
IC BUFFER/DVR 16BIT 3ST 60HUQFN
|
paquet: 60-UFQFN Dual Rows, Exposed Pad |
Stock2 464 |
|
4 | 4 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-UFQFN Dual Rows, Exposed Pad | 60-HUQFN (4x6) |
||
NXP |
IC BUFF TRI-ST QD N-INV 14DIPN
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock4 656 |
|
4 | 1 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
NXP |
IC BUFF/DVR INVERT 8BIT 20DIP
|
paquet: 20-DIP (0.300", 7.62mm) |
Stock6 272 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF NINE SCHMT TRIG 20DIP
|
paquet: 20-DIP (0.300", 7.62mm) |
Stock7 744 |
|
9 | 1 | Schmitt Trigger | Open Drain | -, 5.2mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC TRANSCVR 8BIT N-INV 24SSOP
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock6 560 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
NXP |
IC TRANSCVR 8BIT N-INV 24SSOP
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock3 936 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
NXP |
IC TRANSCVR 3ST 8BIT 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock2 592 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC TRANSCVR 3ST 8BIT 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock7 280 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock2 016 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 488 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC TXRX NON-INV 3-ST 8BIT 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock2 464 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC TXRX NON-INV 3-ST 8BIT 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock6 416 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC BUS TXRX TRI-ST 4BIT 14DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock7 040 |
|
1 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
NXP |
IC TRANSCVR TRI-ST 8BIT 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock7 408 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC TRANSCVR TRI-ST 8BIT 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock3 760 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |