Page 338 - Produits NXP - Embarqués - Microcontrôleurs

S912ZVML12F2WKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock6 288

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F2WKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock7 040

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F2MKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock3 520

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F2MKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock5 328

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F1WKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock7 584

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F1VKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock5 728

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 105°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F1VKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock2 432

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 105°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVML12F1MKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock6 416

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC64F1WKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock3 328

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

512 x 8

4K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC64F1VKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock4 896

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

512 x 8

4K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 105°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC64F1MKHR

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock4 432

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

512 x 8

4K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC64F1MKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock7 728

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

64KB (64K x 8)

FLASH

512 x 8

4K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC12F2WKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock2 208

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC12F2WKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock3 728

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 150°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

S912ZVMC12F1MKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock6 176

16-Bit

50MHz

CAN, LIN, SCI, SPI

DMA, POR, PWM, WDT

42

128KB (128K x 8)

FLASH

512 x 8

8K x 8

4.5 V ~ 5.5 V

A/D 9x12b

Internal

-40°C ~ 125°C (TA)

-

64-LQFP Exposed Pad

64-LQFP EP (10x10)

SPC5777CK2MMO3R

NXP

IC MCU 32BIT 8MB FLASH 516BGA

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

paquet: 516-BGA

Stock5 008

32-Bit Tri-Core

264MHz

CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CK2MME3R

NXP

IC MCU 32BIT 8MB FLASH 416BGA

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

paquet: 416-BGA

Stock3 536

32-Bit Tri-Core

264MHz

CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SC8568EVTANGG

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock6 496

-

SC8568ECVTATGG

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock7 136

-

SC34671AEPR2

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock540 000

-

SC34671AEP

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock3 920

-

SVF532R2K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

paquet: 364-LFBGA

Stock3 376

32-Bit Dual-Core

400MHz

CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG

LCD, SAI

136

-

ROMless

-

1MB

3 V ~ 3.6 V

A/D 10x12b

Internal

-40°C ~ 85°C (TA)

-

364-LFBGA

364-MAPBGA (17x17)

SVF531R3K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

paquet: 364-LFBGA

Stock5 648

32-Bit Dual-Core

400MHz

CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG

LCD, SAI

136

-

ROMless

-

1.5MB

3 V ~ 3.6 V

A/D 10x12b

Internal

-40°C ~ 85°C (TA)

-

364-LFBGA

364-MAPBGA (17x17)

SVF332R3K1CKU2

NXP

IC MCU 32BIT ROMLESS 176LQFP

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 266MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 115
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

Stock4 640

32-Bit Dual-Core

266MHz

CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG

LCD, SAI

115

-

ROMless

-

1.5MB

3 V ~ 3.6 V

A/D 10x12b

Internal

-40°C ~ 85°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SVF331R3K1CKU2

NXP

IC MCU 32BIT ROMLESS 176LQFP

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 266MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 115
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

Stock3 904

32-Bit Dual-Core

266MHz

CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG

LCD, SAI

115

-

ROMless

-

1.5MB

3 V ~ 3.6 V

A/D 10x12b

Internal

-40°C ~ 85°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

MVF62NN151CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

paquet: 364-LFBGA

Stock2 160

32-Bit Dual-Core

400MHz

CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG

DMA, LVD, WDT

-

ROMless

-

1.5MB

3 V ~ 3.6 V

A/D Dual x 12b, D/A Dual x 12b

Internal

-40°C ~ 85°C (TA)

-

364-LFBGA

364-MAPBGA (17x17)

P89LPC925FDHY

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 4x8b; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

Stock6 720

8-Bit

18MHz

I2C, UART/USART

Brown-out Detect/Reset, LED, POR, PWM, WDT

18

8KB (8K x 8)

FLASH

-

256 x 8

2.4 V ~ 3.6 V

A/D 4x8b; D/A 1x8b

Internal

-40°C ~ 85°C (TA)

-

20-TSSOP (0.173", 4.40mm Width)

20-TSSOP

SPC5777CK2MME3

NXP

IC MCU 32BIT 8MB FLASH 416BGA

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

paquet: 416-BGA

Stock5 696

32-Bit Tri-Core

264MHz

CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

Référence	Fabricant	Description	paquet	Stock	Core Size	Speed	Connectivity	Peripherals	Number of I/O	Program Memory Size	Program Memory Type	EEPROM Size	RAM Size	Voltage - Supply (Vcc/Vdd)	Data Converters	Oscillator Type	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
S912ZVML12F2WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock6 288	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2WKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock7 040	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock3 520	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2MKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock5 328	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock7 584	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1VKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock5 728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1VKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock2 432	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock6 416	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1WKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock3 328	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1VKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock4 896	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1MKHR	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock4 432	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1MKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock7 728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F2WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock2 208	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F2WKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock3 728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F1MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock6 176	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
SPC5777CK2MMO3R	NXP	IC MCU 32BIT 8MB FLASH 516BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	paquet: 516-BGA	Stock5 008	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CK2MME3R	NXP	IC MCU 32BIT 8MB FLASH 416BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	paquet: 416-BGA	Stock3 536	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SC8568EVTANGG	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock6 496	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC8568ECVTATGG	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock7 136	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC34671AEPR2	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock540 000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC34671AEP	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock3 920	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SVF532R2K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	paquet: 364-LFBGA	Stock3 376	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	136	-	ROMless	-	1MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
SVF531R3K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	paquet: 364-LFBGA	Stock5 648	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	136	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
SVF332R3K1CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	paquet: 176-LQFP Exposed Pad	Stock4 640	32-Bit Dual-Core	266MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	115	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
SVF331R3K1CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	paquet: 176-LQFP Exposed Pad	Stock3 904	32-Bit Dual-Core	266MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	115	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
MVF62NN151CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	paquet: 364-LFBGA	Stock2 160	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG	DMA, LVD, WDT	-	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D Dual x 12b, D/A Dual x 12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
P89LPC925FDHY	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	paquet: 20-TSSOP (0.173", 4.40mm Width)	Stock6 720	8-Bit	18MHz	I2C, UART/USART	Brown-out Detect/Reset, LED, POR, PWM, WDT	18	8KB (8K x 8)	FLASH	-	256 x 8	2.4 V ~ 3.6 V	A/D 4x8b; D/A 1x8b	Internal	-40°C ~ 85°C (TA)	-	20-TSSOP (0.173", 4.40mm Width)	20-TSSOP
SPC5777CK2MME3	NXP	IC MCU 32BIT 8MB FLASH 416BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	paquet: 416-BGA	Stock5 696	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)