Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FFC VERT 24POS 0.50MM SMD
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paquet: - |
Stock4 050 |
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Surface Mount | Contacts, Vertical, 1 Sided | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC/FPC 64POS .5MM SMD R/A
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paquet: - |
Stock2 556 |
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Surface Mount, Right Angle | Contacts, Bottom | 64 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY24CKTEMB
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paquet: - |
Stock7 146 |
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Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 37POS 0.50MM SMD
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paquet: - |
Stock6 930 |
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Surface Mount | Contacts, Vertical, 1 Sided | 37 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 37POS 0.50MM SMD
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paquet: - |
Stock5 310 |
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Surface Mount | Contacts, Vertical, 1 Sided | 37 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 23POS 0.50MM SMD
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paquet: - |
Stock8 532 |
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Surface Mount | Contacts, Vertical, 1 Sided | 23 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 19POS 1.25MM R/A
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paquet: - |
Stock6 678 |
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Through Hole, Right Angle | Contacts, Top | 19 | 0.049" (1.25mm) | Solder | 0.30mm | 0.197" (5.00mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FPC VERT 13POS 1.00MM SMD
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paquet: - |
Stock6 552 |
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Surface Mount | Contacts, Vertical, 1 Sided | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | - | - | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 21POS 1.25MM PCB
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paquet: - |
Stock2 142 |
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Through Hole | Contacts, Vertical, 1 Sided | 21 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 29POS 0.30MM R/A
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paquet: - |
Stock2 232 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 29 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FFC BOTTOM 18POS 0.5MM R/A
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paquet: - |
Stock3 780 |
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Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 34POS 0.50MM SMD
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paquet: - |
Stock6 246 |
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Surface Mount | Contacts, Vertical, 1 Sided | 34 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 34POS 0.50MM SMD
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paquet: - |
Stock5 004 |
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Surface Mount | Contacts, Vertical, 1 Sided | 34 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY22CKTEMB
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paquet: - |
Stock3 024 |
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Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 22POS 0.50MM R/A
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paquet: - |
Stock5 670 |
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Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 36POS 0.50MM SMD
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paquet: - |
Stock3 400 |
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Surface Mount | Contacts, Vertical, 1 Sided | 36 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 22POS 0.50MM SMD
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paquet: - |
Stock2 898 |
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Surface Mount | Contacts, Vertical, 1 Sided | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 19POS 0.50MM R/A
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paquet: - |
Stock7 884 |
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Surface Mount, Right Angle | Contacts, Top | 19 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC VERT 17POS 1.00MM PCB
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paquet: - |
Stock3 474 |
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Through Hole | Contacts, Vertical, 1 Sided | 17 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.205" (5.20mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA66), Nylon 6/6 | Polyester | Zero Insertion Force (ZIF) | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
05 FPC CONN VERTICAL SMT NONZIF
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paquet: - |
Stock4 518 |
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Surface Mount | Contacts, Vertical, 1 Sided | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 17POS 0.5MM R/A
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paquet: - |
Stock6 174 |
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Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 21POS 0.50MM SMD
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paquet: - |
Stock8 280 |
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Surface Mount | Contacts, Vertical, 1 Sided | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 17POS 0.50MM SMD
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paquet: - |
Stock4 050 |
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Surface Mount | Contacts, Vertical, 1 Sided | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Straight, Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 20POS 0.50MM R/A
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paquet: - |
Stock5 886 |
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Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Rotary Lock | Tabbed | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | Dust Cap | 100V | -10°C ~ 100°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 35POS 0.50MM SMD
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paquet: - |
Stock7 236 |
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Surface Mount | Contacts, Vertical, 1 Sided | 35 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 35POS 0.50MM SMD
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paquet: - |
Stock3 114 |
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Surface Mount | Contacts, Vertical, 1 Sided | 35 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
1.0MM FFC B/F CONN. HSG ASSY 16P
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paquet: - |
Stock3 600 |
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Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.039" (1.00mm) | Solder | 0.30mm | 0.110" (2.80mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Solder Retention | 125V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 35POS 0.30MM R/A
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paquet: - |
Stock3 816 |
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Surface Mount, Right Angle | Contacts, Bottom | 35 | 0.012" (0.30mm) | Solder | 0.20mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |