Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Voltages Monitored | Output | Reset | Reset Timeout | Voltage - Threshold | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC RESET GEN 4.00V VTH SC70
|
paquet: SC-70, SOT-323 |
Stock16 920 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.00V VTH SOT23-3
|
paquet: TO-236-3, SC-59, SOT-23-3 |
Stock180 000 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH SC70
|
paquet: SC-70, SOT-323 |
Stock224 400 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH SOT23-3
|
paquet: TO-236-3, SC-59, SOT-23-3 |
Stock3 296 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 736 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock459 300 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 824 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 384 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock607 920 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 272 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 096 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock545 352 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 4.4V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 384 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.4V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 4.4V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 488 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.4V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 4.4V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock481 908 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.4V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 4.65V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 320 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.65V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 4.65V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 768 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.65V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 4.65V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock14 664 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.65V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 904 |
|
1 | - | Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 560 |
|
1 | - | Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 312 |
|
1 | - | Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 056 |
|
1 | - | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 808 |
|
1 | - | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 872 |
|
1 | - | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 272 |
|
1 | - | Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 704 |
|
1 | - | Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 096 |
|
1 | - | Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 704 |
|
1 | - | Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |