Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 8KBIT 100KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock19 254 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | Single Wire | 100kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock6 192 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock4 624 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock5 856 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock5 632 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 1ms | 900ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock4 816 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock5 120 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 1ms | 900ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock426 156 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock7 472 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ SOT23-3
|
paquet: TO-236-3, SC-59, SOT-23-3 |
Stock29 244 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23 |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ SOT23-6
|
paquet: SOT-23-6 |
Stock25 410 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC EEPROM 1KBIT 3MHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock38 940 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock150 918 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 920 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock12 522 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock22 170 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128BIT 400KHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock7 136 |
|
EEPROM | EEPROM | 128b (16 x 8) | I2C | 400kHz | 4ms | 3500ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ SOT23-6
|
paquet: SOT-23-6 |
Stock3 920 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock6 672 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock4 432 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock2 000 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock4 784 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock187 656 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock231 360 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock24 408 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ SOT23-5
|
paquet: SC-74A, SOT-753 |
Stock145 704 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock72 000 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock14 820 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |