Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 4KBIT 1MHZ SOT23-5
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock6 496 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 632 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 728 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 752 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 3.6 V | -20°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 20MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock3 488 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 20MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 496 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2MBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 280 |
|
EEPROM | EEPROM | 2Mb (256K x 8) | I2C | 1MHz | 10ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 512 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 424 |
|
EEPROM | EEPROM | 32Kb (2K x 16) | I2C | 1MHz | 9ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock209 400 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 904 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 216 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 4.5µs | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28PIN
|
paquet: 28-BCPGA |
Stock4 352 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 16KBIT 20MHZ 8TSSOP
|
paquet: - |
Stock4 304 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 128KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (ISO) |
Stock5 536 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC EEPROM 2MBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 616 |
|
EEPROM | EEPROM | 2Mb (256K x 8) | SPI | 5MHz | 10ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock7 216 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 64MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock6 112 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (8x10) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock2 128 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 64MBIT 90NS 48TFBGA
|
paquet: 48-TFBGA |
Stock7 856 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 376 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 456 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock3 216 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 320 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ SOT23-5
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock3 344 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 064 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 624 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 168 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |