Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 8KBIT 4MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 189 652 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 4KBIT 4MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 440 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 1KBIT 4MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock31 500 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 32MBIT 80NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock20 388 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 70ns | 80ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Microchip Technology |
IC FLASH 32MBIT 80NS 48CBGA
|
paquet: 48-VFBGA, CSBGA |
Stock4 304 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 70ns | 80ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 48-VFBGA, CSBGA | 48-CBGA (7x10) |
||
Microchip Technology |
IC FLASH 32MBIT 80NS 48CBGA
|
paquet: 48-VFBGA, CSBGA |
Stock6 000 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 70ns | 80ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 48-VFBGA, CSBGA | 48-CBGA (7x10) |
||
Microchip Technology |
IC FLASH 32MBIT 70NS 64CBGA
|
paquet: 64-VBGA, CSPBGA |
Stock5 536 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | - | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 64-VBGA, CSPBGA | 64-CBGA (9x10) |
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Microchip Technology |
IC FLASH 32MBIT 70NS 47CBGA
|
paquet: 47-VFBGA, CSBGA |
Stock6 224 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 120µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 47-VFBGA, CSBGA | 47-CBGA (7x10) |
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Microchip Technology |
IC FLASH 32MBIT 66MHZ 8VDFN
|
paquet: 8-VDFN Exposed Pad |
Stock84 108 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (8x6) |
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Microchip Technology |
IC FLASH 1MBIT 66MHZ 8UDFN
|
paquet: 8-UDFN Exposed Pad |
Stock4 272 |
|
FLASH | FLASH | 1Mb (264 Bytes x 512 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
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Microchip Technology |
IC FLASH 2MBIT 120NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock15 036 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 1MBIT 200NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock3 168 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Microchip Technology |
IC EEPROM 64KBIT 90NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock6 064 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64KBIT 90NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock3 840 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC EEPROM 64KBIT 90NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock5 248 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 90NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 024 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock4 016 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64KBIT 70NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock5 616 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 176 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 824 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock6 096 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock7 680 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock6 224 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock7 664 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock4 896 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 512KBIT 45NS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock7 200 |
|
EPROM | EPROM - OTP | 512Kb (32K x 16) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 512KBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 136 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 55NS 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock5 952 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |