Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock4 624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 456 |
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EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EPROM 4M PARALLEL 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock5 232 |
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EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
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Microchip Technology |
IC EPROM 4M PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 888 |
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EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 90ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 64K PARALLEL 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock3 984 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64K PARALLEL 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock4 576 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC EPROM 2M PARALLEL 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock2 688 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
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Microchip Technology |
IC EEPROM 64K PARALLEL 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock4 800 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64K PARALLEL 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock3 504 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64K PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 712 |
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EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EPROM 2M PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 160 |
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EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 120ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EPROM 1M PARALLEL 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 288 |
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EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
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Microchip Technology |
IC EPROM 2M PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 024 |
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EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EPROM 512K PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 256 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 512K I2C 400KHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock3 520 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 550ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 512K I2C 400KHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 024 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 550ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EPROM 256K PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock17 448 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 128K SPI 20MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 000 |
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EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EEPROM 256K I2C 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EEPROM 64K SPI 20MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 800 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EEPROM 16K I2C 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock57 048 |
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EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
paquet: 4-XFBGA, CSPBGA |
Stock5 760 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, CSPBGA | 4-CSP |
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Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
paquet: 8-UFDFN Exposed Pad |
Stock2 608 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
paquet: SC-74A, SOT-753 |
Stock5 872 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 832 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 160 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EEPROM 64K I2C 1MHZ SOT23-5
|
paquet: SC-74A, SOT-753 |
Stock5 680 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
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Microchip Technology |
IC EEPROM 64K I2C 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 272 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |