Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 64KBIT 300NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 272 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
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Microchip Technology |
IC EEPROM 64KBIT 300NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
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Microchip Technology |
IC EEPROM 64KBIT 300NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 952 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 300NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 584 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 64KBIT 250NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock2 176 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock5 872 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock7 040 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock9 792 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock5 232 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock6 816 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 080 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 936 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock6 800 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock5 440 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock5 808 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock2 128 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock2 080 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock3 472 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock7 008 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock2 448 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock2 624 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock5 616 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock2 256 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock2 848 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock5 296 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock3 920 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |