Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC OTP 1MBIT 150NS 40VSOP
|
paquet: 40-TFSOP (0.488", 12.40mm Width) |
Stock3 360 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
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Microchip Technology |
IC OTP 1MBIT 150NS 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock5 360 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
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Microchip Technology |
IC OTP 1MBIT 150NS 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock46 200 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
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Microchip Technology |
IC OTP 1MBIT 150NS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 944 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
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Microchip Technology |
IC OTP 1MBIT 150NS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock105 564 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40VSOP
|
paquet: 40-TFSOP (0.488", 12.40mm Width) |
Stock4 896 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40VSOP
|
paquet: 40-TFSOP (0.488", 12.40mm Width) |
Stock3 552 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock4 896 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
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Microchip Technology |
IC OTP 1MBIT 120NS 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock15 600 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock7 488 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 1MBIT 120NS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 816 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 568 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC OTP 8MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 632 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock4 384 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
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Microchip Technology |
IC OTP 8MBIT 90NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock4 368 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock5 328 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 296 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock4 208 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock6 064 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock3 552 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock2 960 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock7 952 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock3 424 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 616 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 160 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock4 272 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock18 192 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock4 144 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |