Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC OTP 1MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock2 416 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock7 792 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 872 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 944 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock2 864 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock3 264 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock5 696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock5 088 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock4 848 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 360 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock9 264 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock7 328 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock9 588 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 760 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 90NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock9 840 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock6 944 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock6 224 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock6 544 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock4 784 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock4 992 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock5 456 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 55NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock88 404 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock10 116 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock8 880 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock15 816 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |