Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 856 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 120 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock7 360 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock6 384 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock3 392 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock6 400 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 584 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock12 912 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock9 108 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock2 112 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock4 384 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock6 784 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC EEPROM 64KBIT 200NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock4 048 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 392 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock18 696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock4 144 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock7 760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock7 472 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock2 176 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock5 872 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock17 004 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock198 144 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock667 596 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock25 836 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock45 384 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 128 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 104 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |