Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 250NS 28PIN
|
paquet: 28-BCPGA |
Stock5 984 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
paquet: 28-BCPGA |
Stock2 608 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
paquet: 28-BCPGA |
Stock2 272 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
paquet: 32-CLCC |
Stock5 040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
paquet: - |
Stock3 664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock4 384 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
paquet: 32-CLCC |
Stock4 224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
paquet: 32-CLCC |
Stock3 088 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
paquet: 32-CLCC |
Stock5 760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
paquet: - |
Stock4 240 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock4 960 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock2 480 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock7 584 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock5 168 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28PIN
|
paquet: 28-BCPGA |
Stock4 224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28CPGA
|
paquet: 28-BCPGA |
Stock5 792 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
paquet: - |
Stock3 552 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
paquet: - |
Stock5 040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
paquet: - |
Stock2 880 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock2 256 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock2 624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
paquet: 28-CFlatPack |
Stock3 248 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
paquet: - |
Stock3 136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
paquet: 32-CLCC |
Stock7 664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
paquet: - |
Stock7 152 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
paquet: 32-CLCC |
Stock7 136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
paquet: - |
Stock2 544 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
paquet: 32-CLCC |
Stock3 376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |