Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SERIAL CONFIG PROM 64K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock149 136 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SERIAL CONFIG PROM 64K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 024 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock12 492 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 256K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock32 124 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 256K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 144 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 128K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock91 452 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 448 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 800 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 032 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 856 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 720 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 16M 8LAP
|
paquet: 8-TDFN |
Stock7 360 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 440 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 616 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FPGA EEPROM 2M 10MHZ 44TQFP
|
paquet: 44-TQFP |
Stock6 624 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 512K LV 8LAP
|
paquet: 8-TDFN |
Stock6 300 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-LAP
|
paquet: 8-TDFN |
Stock6 464 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
paquet: 8-TDFN |
Stock3 056 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FLASH CONFIG 4M 32TQFP
|
paquet: 32-TQFP |
Stock4 352 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8-LAP
|
paquet: 8-TDFN |
Stock2 512 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FLASH CONFIG 2MBIT 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 016 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
paquet: 44-TQFP |
Stock5 136 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FPGA EEPROM 1M ALTERA 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock12 480 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44TQFP
|
paquet: 44-TQFP |
Stock5 344 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 2M LV 44TQFP
|
paquet: 44-TQFP |
Stock3 824 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 16M 44TQFP
|
paquet: 44-TQFP |
Stock7 776 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
paquet: 8-TDFN |
Stock4 992 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 976 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |