Page 13 - Produits Microchip Technology - Interface - Télécommunications | Heisener Electronics
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Produits Microchip Technology - Interface - Télécommunications

Dossiers 898
Page  13/33
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Interface
Number of Circuits
Voltage - Supply
Current - Supply
Power (Watts)
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
PM5397-FGI
Microchip Technology

ARROW 2XGE PB FREE

  • Function: Ethernet, SONET/SDH
  • Interface: GMII, SerDes
  • Number of Circuits: 2
  • Voltage - Supply: 1.8V
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FCBGA
paquet: 896-BGA
Stock6 240
GMII, SerDes
2
1.8V
-
-
-40°C ~ 85°C
Surface Mount
896-BGA
896-FCBGA
PM5397-FEI
Microchip Technology

ARROW 2XGE PB FREE

  • Function: Ethernet, SONET/SDH
  • Interface: GMII, SerDes
  • Number of Circuits: 2
  • Voltage - Supply: 1.8V
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FCBGA
paquet: 896-BGA
Stock5 952
GMII, SerDes
2
1.8V
-
-
-40°C ~ 85°C
Surface Mount
896-BGA
896-FCBGA
PM8320-PI
Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

  • Function: Framer
  • Interface: E1, J1, T1
  • Number of Circuits: -
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 324-FBGA
  • Supplier Device Package: 324-PBGA (23x23)
paquet: 324-FBGA
Stock3 280
E1, J1, T1
-
1.8V, 3.3V
-
-
-40°C ~ 85°C
Surface Mount
324-FBGA
324-PBGA (23x23)
PM8320-PGI
Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

  • Function: Framer
  • Interface: E1, J1, T1
  • Number of Circuits: -
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 324-FBGA
  • Supplier Device Package: 324-PBGA (23x23)
paquet: 324-FBGA
Stock2 576
E1, J1, T1
-
1.8V, 3.3V
-
-
-40°C ~ 85°C
Surface Mount
324-FBGA
324-PBGA (23x23)
ZL50111GAG2
Microchip Technology

IC CESOP PROC 1024CH 552BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 552-BGA
  • Supplier Device Package: 552-PBGA (35x35)
paquet: 552-BGA
Stock5 184
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
552-BGA
552-PBGA (35x35)
PM8324-FXI
Microchip Technology

TEMAP 84FDL, LF BUMP

  • Function: Framer
  • Interface: E1, T1
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 816
E1, T1
-
-
-
-
-
-
-
-
PM8321-PI
Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 144
-
-
-
-
-
-
-
-
-
PM5333-FEI
Microchip Technology

ARROW 8XFE PB FREE

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 920
-
-
-
-
-
-
-
-
-
PM5333-FGI
Microchip Technology

8 CHANNEL FAST ETHERNET OVER SON

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 104
-
-
-
-
-
-
-
-
-
PM4390-FEI
Microchip Technology

ARROW M8XFE

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 576
-
-
-
-
-
-
-
-
-
ZL50112GAG2
Microchip Technology

IC CESOP PROCESSOR 552BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 552-BGA
  • Supplier Device Package: 552-PBGA (35x35)
paquet: 552-BGA
Stock3 504
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
552-BGA
552-PBGA (35x35)
PM4390B-FGI
Microchip Technology

8 CHANNEL 10/100 OR 1XGE ETHERNE

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 968
-
-
-
-
-
-
-
-
-
PM8324-FEI
Microchip Technology

TEMAP 84FDL GREEN DUAL PASSIVATI

  • Function: Framer
  • Interface: E1, T1
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 696
E1, T1
-
-
-
-
-
-
-
-
PM8321-PGI
Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 184
-
-
-
-
-
-
-
-
-
PM5334A-FEI
Microchip Technology

SINGLE-CHIP SONET/SDH TRANSPORT

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 944
-
-
-
-
-
-
-
-
-
PM7382-PI
Microchip Technology

TELECOM INTERFACE ICS 32 LINK

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 152
-
-
-
-
-
-
-
-
-
ZL50110GAG2
Microchip Technology

IC CESOP PROC 256CH 552BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 552-BGA
  • Supplier Device Package: 552-PBGA (35x35)
paquet: 552-BGA
Stock5 520
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
552-BGA
552-PBGA (35x35)
MT90869AG2
Microchip Technology

IC DGTL SWITCH F16KDX 272BGA

  • Function: Switch
  • Interface: -
  • Number of Circuits: 1
  • Voltage - Supply: 3V ~ 3.6V
  • Current - Supply: 160mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 272-BGA
  • Supplier Device Package: 272-PBGA (27x27)
paquet: 272-BGA
Stock4 416
-
1
3V ~ 3.6V
160mA
-
-40°C ~ 85°C
Surface Mount
272-BGA
272-PBGA (27x27)
PM4332-PGI
Microchip Technology

32 CHANNEL T1/E1 FRAMER

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 816
-
-
-
-
-
-
-
-
-
PM7382-PGI
Microchip Technology

32 LINK, 256 HDLC CHANNEL FRAME

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 904
-
-
-
-
-
-
-
-
-
ZL50117GAG2
Microchip Technology

IC CESOP PROCESSOR 128CH 324BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-PBGA (23x23)
paquet: 324-BGA
Stock5 760
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
324-BGA
324-PBGA (23x23)
PM8312-PI
Microchip Technology

32CHANNEL T1/E1 FRAMER DEVICE WI

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 040
-
-
-
-
-
-
-
-
-
PM8312-PGI
Microchip Technology

32CHANNEL T1/E1 FRAMER DEVICE WI

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 224
-
-
-
-
-
-
-
-
-
ZL50114GAG2
Microchip Technology

IC CESOP PROCESSOR 128CH 552BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 552-BGA
  • Supplier Device Package: 552-PBGA (35x35)
paquet: 552-BGA
Stock5 296
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
552-BGA
552-PBGA (35x35)
ZL50116GAG2
Microchip Technology

IC CESOP PROCESSOR 64CH 324BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-PBGA (23x23)
paquet: 324-BGA
Stock2 192
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
324-BGA
324-PBGA (23x23)
ZL50232GDG2
Microchip Technology

IC VOICE ECHO CANCELLER 208LBGA

  • Function: Echo Cancellation
  • Interface: -
  • Number of Circuits: 1
  • Voltage - Supply: 1.6V ~ 2V
  • Current - Supply: 10mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 208-LBGA
  • Supplier Device Package: 208-LBGA (17x17)
paquet: 208-LBGA
Stock2 272
-
1
1.6V ~ 2V
10mA
-
-40°C ~ 85°C
Surface Mount
208-LBGA
208-LBGA (17x17)
ZL50118GAG2
Microchip Technology

IC CESOP PROCESSOR 32CH 324BGA

  • Function: Telecom Circuit
  • Interface: TDM
  • Number of Circuits: 1
  • Voltage - Supply: 1.65V ~ 1.95V
  • Current - Supply: 950mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-PBGA (23x23)
paquet: 324-BGA
Stock5 200
TDM
1
1.65V ~ 1.95V
950mA
-
-40°C ~ 85°C
Surface Mount
324-BGA
324-PBGA (23x23)
ZL50064QCG1
Microchip Technology

IC DIGITAL SWITCH 16K CH 256LQFP

  • Function: Switch
  • Interface: -
  • Number of Circuits: 1
  • Voltage - Supply: 1.71V ~ 1.89V
  • Current - Supply: 240mA
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 256-LQFP
  • Supplier Device Package: 256-LQFP (28x28)
paquet: 256-LQFP
Stock7 536
-
1
1.71V ~ 1.89V
240mA
-
-40°C ~ 85°C
Surface Mount
256-LQFP
256-LQFP (28x28)