Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock103 008 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock1 525 680 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 664 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock127 026 |
|
RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX USB ULPI 13MHZ 24QFN
|
paquet: 24-VQFN Exposed Pad |
Stock43 530 |
|
USB 2.0 | - | Half | 150mV | - | 1.8 V ~ 3.3 V | -45°C ~ 85°C | Surface Mount | 24-VQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 10/100 36VQFN
|
paquet: 36-VFQFN Exposed Pad |
Stock833 940 |
|
MII, RMII | - | Full | - | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 36-VFQFN Exposed Pad | 36-QFN (6x6) |
||
Microchip Technology |
IC TXRX USB FLEXPWR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock98 208 |
|
USB 2.0 | 1/1 | - | 150mV | - | 1.8 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX USB 2.0 FLEXPWR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock435 768 |
|
USB 2.0 | - | - | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock780 444 |
|
RMII | 2/2 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock101 616 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock532 512 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock39 528 |
|
RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock219 708 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX STAND-ALONE 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock81 648 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock28 836 |
|
RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock21 600 |
|
RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock1 055 676 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC PHY 10/100/1000 260-HS-BGA
|
paquet: 260-BGA |
Stock6 768 |
|
Gigabit Ethernet | 4/4 | - | - | - | 3 V ~ 3.6 V | - | Surface Mount | 260-BGA | 260-PBGA |
||
Microchip Technology |
LIN TRX+5V 85MA LDO
|
paquet: - |
Stock2 752 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
LIN SBC WITH 5V REGULATOR
|
paquet: - |
Stock132 000 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
LINTRX+3.3V 85MA LDO
|
paquet: - |
Stock6 336 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
LIN SBC WITH 3.3V REGULATOR
|
paquet: - |
Stock3 088 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
5V REGULATOR
|
paquet: - |
Stock7 264 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
3.3V LDO
|
paquet: - |
Stock5 360 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
LIN SYSTEM BASIS CHIP
|
paquet: - |
Stock7 024 |
|
- | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
CAN PARTIAL NETWORKING TRX
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock6 960 |
|
CAN | 1/1 | Half | 120mV | 5Mbps | 4.55 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock7 056 |
|
CAN | 1/1 | Half | 120mV | 5Mbps | 4.75 V ~ 5.25 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock6 064 |
|
CAN | 1/1 | Half | 120mV | 5Mbps | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |