Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
PLL | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Divider/Multiplier | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER LVPECL 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock6 560 |
|
Yes | Crystal | LVCMOS, LVDS | 1 | 1:1 | No/Yes | 640MHz | Yes/Yes | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 65MHZ PECL 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock7 328 |
|
No | Crystal | LVPECL | 1 | 1:1 | No/Yes | 65MHz | Yes/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 700MHZ CMOS 16QFN
|
paquet: - |
Stock6 832 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC PLL PROG CLOCK 16QFN
|
paquet: - |
Stock7 040 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK SYNTHESIZER DUAL 44QFN
|
paquet: 44-VFQFN Exposed Pad |
Stock7 856 |
|
Yes with Bypass | LVCMOS, Crystal | HCSL | 1 | 1:8 | No/Yes | 250MHz | No/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Microchip Technology |
IC CLK SYNTHESIZER DUAL 44QFN
|
paquet: 44-VFQFN Exposed Pad |
Stock3 120 |
|
Yes with Bypass | LVCMOS, Crystal | HCSL | 1 | 1:8 | No/Yes | 200MHz | No/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Microchip Technology |
IC CLK SYNTHESIZER DUAL 44QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock7 632 |
|
Yes | Clock, Crystal | HCSL | 1 | 1:4 | No/Yes | 200MHz | No/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock5 392 |
|
Yes with Bypass | Crystal | LVDS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock4 736 |
|
Yes with Bypass | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 800MHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock4 896 |
|
Yes with Bypass | Crystal | LVCMOS | 1 | 1:1 | No/Yes | 800MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 250MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock6 336 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 250MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 25MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock3 936 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 25MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock6 528 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock7 728 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock4 208 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 125MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 156.25MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock5 616 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:1 | No/Yes | 156.25MHz | No/No | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER 200MHZ LVPECL 16TS
|
paquet: - |
Stock2 176 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK SYNTHESIZER DUAL 44QFN
|
paquet: 44-VFQFN Exposed Pad |
Stock7 920 |
|
Yes with Bypass | LVCMOS, Crystal | HCSL | 1 | 2:8 | No/Yes | 250MHz | No/No | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Microchip Technology |
IC CLK BUFFER 200MHZ CMOS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 808 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 200MHz | Yes/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 100MHZ CMOS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 448 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 100MHz | No/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 100MHZ CMOS 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 992 |
|
Yes | Crystal | CMOS | 1 | 1:1 | No/No | 100MHz | No/Yes | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 200MHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock2 752 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 200MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 125MHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 472 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 125MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 100MHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 264 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 100MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 25MHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock4 976 |
|
Yes | HCSL, Crystal | LVCMOS | 1 | 1:2 | No/Yes | 25MHz | No/Yes | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER MULT OUT 6SOT23
|
paquet: SOT-23-6 |
Stock3 168 |
|
No | LVCMOS, Sine Wave, Crystal | LVCMOS | 1 | 1:3 | No/No | 52MHz | No/No | 1.8 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER MULT OUT 6SOT23
|
paquet: SOT-23-6 |
Stock4 816 |
|
No | LVCMOS, Sine Wave, Crystal | LVCMOS | 1 | 1:3 | No/No | 52MHz | No/No | 1.8 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6L |
||
Microchip Technology |
IC CLK BUFFER MULT OUT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 616 |
|
No | LVCMOS, Sine Wave, Crystal | LVCMOS | 1 | 1:3 | No/No | 52MHz | No/No | 1.8 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |