Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 528 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock6 768 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 008 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 800 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 528 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 504 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 344 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock4 624 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 280 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock4 688 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock7 472 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 432 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock6 624 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 552 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock6 432 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 632 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 960 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock7 584 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock4 480 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 200 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock6 896 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 616 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock4 864 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 600 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 984 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 856 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 064 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock7 936 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |