Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 368 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock7 616 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock5 360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock5 472 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 064 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock5 520 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock166 728 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 816 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock2 896 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock7 360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock3 248 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock2 704 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock5 184 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock2 608 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock16 188 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 1GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock27 036 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock17 484 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock2 320 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock5 504 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock7 200 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock17 472 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock7 088 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock3 472 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock18 864 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock4 992 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock2 224 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
paquet: 44-VFQFN Exposed Pad, 44-MLF? |
Stock3 120 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
paquet: 44-VFQFN Exposed Pad, 44-MLF? |
Stock7 840 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |