Produits Intel

NG80386DX20

Intel

IC MPU I386 20MHZ 132QFP

• Core Processor: Intel386 DX
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: Math Engine; Intel387 DX
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 85°C (TC)
• Security Features: -
• Package / Case: 132-QFP
• Supplier Device Package: 132-QFP

paquet: 132-QFP

1SX250LU2F50I2LG

Intel

2397-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2500K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

10AS066K3F35I2SG

Intel

IC SOC FPGA 396 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

10AX115R4F40I3SGE2

Intel

IC FPGA 342 I/O 1517FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 342
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

paquet: 1517-BBGA, FCBGA

EP20K300EFC672-1X

Intel

IC FPGA 408 I/O 672FBGA

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: 408
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA

EP1S25F780C6N

Intel

IC FPGA 597 I/O 780FBGA

• Number of LABs/CLBs: 2566
• Number of Logic Elements/Cells: 25660
• Total RAM Bits: 1944576
• Number of I/O: 597
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA
• Supplier Device Package: 780-FBGA (29x29)

paquet: 780-BBGA

EP20K400EFC672-2

Intel

IC FPGA 488 I/O 672FBGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 212992
• Number of I/O: 488
• Number of Gates: 1052000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA

5SGXEA7N2F45I3LN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: 1932-BBGA, FCBGA

EP2S130F1020C3N

Intel

IC FPGA 742 I/O 1020FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 742
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

paquet: 1020-BBGA

5SGXEA4K2F40C3N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 43983872
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: 1517-BBGA, FCBGA

EP3SL150F780I4N

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 5700
• Number of Logic Elements/Cells: 142500
• Total RAM Bits: 6543360
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

paquet: 780-BBGA, FCBGA

10AX048H1F34I1HG

Intel

IC FPGA 492 I/O 1152FCBGA

• Number of LABs/CLBs: 183590
• Number of Logic Elements/Cells: 480000
• Total RAM Bits: 5664768
• Number of I/O: 492
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

10AX057H4F34I3SG

Intel

IC FPGA 492 I/O 1152FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 492
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

paquet: 1152-BBGA, FCBGA

EP2S60F1020C3

Intel

IC FPGA 718 I/O 1020FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 718
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

paquet: 1020-BBGA

10AX027H3F35E2SG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

5AGXFA7H6F35C6N

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA Exposed Pad
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA Exposed Pad

10CL010YU256C8G

Intel

256-PIN UBGA

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 176
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

paquet: 256-LFBGA

EP3C16F484A7N

Intel

IC FPGA 346 I/O 484FBGA

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 346
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BGA

10CL016YE144C6G

Intel

144-PIN EQFP

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 78
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

paquet: 144-LQFP Exposed Pad

EP2C5F256C7N

Intel

IC FPGA 158 I/O 256FBGA

• Number of LABs/CLBs: 288
• Number of Logic Elements/Cells: 4608
• Total RAM Bits: 119808
• Number of I/O: 158
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: 256-LBGA

EPM7160STI100-10N

Intel

IC CPLD 160MC 10NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 10
• Number of Macrocells: 160
• Number of Gates: 3200
• Number of I/O: 84
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

paquet: 100-TQFP

AGFB006R16A2E2VB

Intel

IC FPGA AGILEX-F 1546BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1546-BFBGA Exposed Pad
• Supplier Device Package: 1546-BGA (37.5x34)

paquet: -

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5SGXMA4H3F35C4G

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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AGIB019R31B2I1V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

paquet: -

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1ST165EU2F50I2VG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 206250
• Number of Logic Elements/Cells: 1650000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

paquet: -

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AGFA023R31C2E4X

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

paquet: -

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AGFA023R24C2E2VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

paquet: -

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1SX280HU3F50E3VGS3

Intel

IC FPGA STRATIX 10 2397FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

paquet: -

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