Produits Intel

10AS048H2F34I2SG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 480K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

EPF8452AQC160-3AC

Intel

IC FPGA

• Number of LABs/CLBs: 42
• Number of Logic Elements/Cells: 336
• Total RAM Bits: -
• Number of I/O: 120
• Number of Gates: 4000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

paquet: 160-BQFP

EP20K200QC208-3

Intel

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 144
• Number of Gates: 526000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

paquet: 208-BFQFP

EP20K200EBC356-1

Intel

IC FPGA 271 I/O 356BGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 271
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

paquet: 356-LBGA

5SEEBH40I2L

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 359250
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

paquet: 1517-BBGA, FCBGA

5SGXEB9R3H43C2LN

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

paquet: 1760-BBGA, FCBGA

5SGXMA9N3F45C3N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: 1932-BBGA, FCBGA

5SGXEA4H1F35C1N

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 43983872
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

EP2S130F1020C4

Intel

IC FPGA 742 I/O 1020FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 742
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

paquet: 1020-BBGA

5SGXEA5H2F35I3N

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 53105664
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

5SGXEA7H3F35C3

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

5AGXMA5D4F27C4G

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA, FC (27x27)

paquet: 672-BBGA, FCBGA

EPM7256BTC100-10N

Intel

IC CPLD 256MC 10NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

paquet: 100-TQFP

EPM7064BTC44-7

Intel

IC CPLD 64MC 7.5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

paquet: 44-TQFP

EPM3064ALC44-10

Intel

IC CPLD 64MC 10NS 44PLCC

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

paquet: 44-LCC (J-Lead)

EP4SGX110DF29C4G

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: 4224
• Number of Logic Elements/Cells: 105600
• Total RAM Bits: 9793536
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

paquet: 780-BBGA, FCBGA

NE80546KG0962MM

Intel

LOW VOLTAGE INTEL XEON PROCESSOR

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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5SGSMD3E2H29C2LG

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 89000
• Number of Logic Elements/Cells: 236000
• Total RAM Bits: 13312000
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

paquet: -

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1SX280HU3F50I1VG

Intel

IC FPGA STRATIX 10 2397FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

paquet: -

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5SGXEA7N2F45C3WN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: -

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MD82C288-6

Intel

BUS CONTROLLER, CMOS, CDIP20

• Protocol: -
• Function: Controller
• Interface: Bus
• Standards: -
• Voltage - Supply: 4.75V ~ 5.25V
• Current - Supply: 75mA
• Operating Temperature: 0°C ~ 85°C (TC)
• Package / Case: 20-CDIP
• Supplier Device Package: 20-CERDIP

paquet: -

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NG80960JA25

Intel

RISC MPU, 32-BIT, 25MHZ PQFP132

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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5SGXEA7N1F40I2G

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: -

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5SGSED8N1F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 262400
• Number of Logic Elements/Cells: 695000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: -

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AGFB014R24D2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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AGFD023R31C2I3V

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

paquet: -

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AGFB014R24B1E1V

Intel

IC FPGA AGILEX-F 2486FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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1ST250EU3F50E3VG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 312500
• Number of Logic Elements/Cells: 2500000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

paquet: -

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