Produits FTDI, Future Technology Devices International Ltd

UMFT4222EV-B

FTDI, Future Technology Devices International Ltd

MOD USB DEV VERSION B

• Protocol: USB
• Function: Bridge, USB to I2C/SPI
• Interface: I2C, SPI
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 2.5V, 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 24-DIP Module
• Supplier Device Package: -

paquet: 24-DIP Module

RPI-HUB-MODULE

FTDI, Future Technology Devices International Ltd

MOD RASPBERRYPI USB HUB

• Protocol: USB
• Function: Controller
• Interface: FIFO, GPIO, I2C, JTAG, SPI, UART
• Standards: USB 2.0
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: Module
• Supplier Device Package: Module

paquet: Module

FT2232H-56Q MINI MDL

FTDI, Future Technology Devices International Ltd

IC MINI MODULE USB/FIFO 56QFN

• Protocol: USB
• Function: Controller
• Interface: FIFO
• Standards: USB 2.0
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Supplier Device Package: Module

paquet: Module

FT201XQ-T

FTDI, Future Technology Devices International Ltd

IC USB FS I2C 16QFN

• Protocol: USB
• Function: Bridge, USB to I2C
• Interface: I2C
• Standards: USB 2.0
• Voltage - Supply: 3.3 V ~ 5 V
• Current - Supply: 8mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-WQFN Exposed Pad
• Supplier Device Package: 16-QFN (4x4)

paquet: 16-WQFN Exposed Pad

FT221XS-U

FTDI, Future Technology Devices International Ltd

IC USB 8 BIT SPI/FT1248 20SSOP

• Protocol: USB
• Function: Bridge, USB to FT1248
• Interface: USB, SPI, Sync Parallel
• Standards: USB 2.0
• Voltage - Supply: 3.3 V ~ 5 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.154", 3.90mm Width)

FT260S-U

FTDI, Future Technology Devices International Ltd

IC USB TO UART/I2C 28-TSSOP

• Protocol: USB
• Function: Bridge, USB to I2C/UART
• Interface: I2C, UART
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 2.5V, 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

paquet: 28-TSSOP (0.173", 4.40mm Width)

FT311D-32Q1C-R

FTDI, Future Technology Devices International Ltd

IC USB ANDROID HOST CTRL QFN-32

• Protocol: USB
• Function: Controller
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 2.97 V ~ 3.63 V
• Current - Supply: 25mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-QFN-EP (7x7)

paquet: 32-VQFN Exposed Pad

VNC2-32L1C-REEL

FTDI, Future Technology Devices International Ltd

IC USB HOST/DEVICE CTRL 32-LQFP

• Protocol: USB
• Function: Controller
• Interface: SPI, UART
• Standards: USB 2.0
• Voltage - Supply: 1.62 V ~ 1.98 V
• Current - Supply: 25mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP Exposed Pad
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP Exposed Pad

FT221XS-R

FTDI, Future Technology Devices International Ltd

IC USB 8 BIT SPI/FT1248 20SSOP

• Protocol: USB
• Function: Bridge, USB to SPI
• Interface: SPI
• Standards: USB 2.0
• Voltage - Supply: 3.3 V ~ 5 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.154", 3.90mm Width)

FT220XS-U

FTDI, Future Technology Devices International Ltd

IC USB 4 BIT SPI/FT1248 16SSOP

• Protocol: USB
• Function: Bridge, USB to FT1248
• Interface: FT1248
• Standards: USB 2.0
• Voltage - Supply: 3.3 V ~ 5 V
• Current - Supply: 10.5mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-SSOP

paquet: 16-SSOP (0.154", 3.90mm Width)

FT201XQ-R

FTDI, Future Technology Devices International Ltd

IC USB FS I2C 16QFN

• Protocol: USB
• Function: Bridge, USB to I2C
• Interface: I2C
• Standards: USB 2.0
• Voltage - Supply: 3.3 V ~ 5 V
• Current - Supply: 8mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-WQFN Exposed Pad
• Supplier Device Package: 16-QFN (4x4)

paquet: 16-WQFN Exposed Pad

FT600Q-B-T

FTDI, Future Technology Devices International Ltd

IC USB3-16BIT SYNC FIFO 56QFN

• Protocol: USB
• Function: Bridge, USB to FIFO
• Interface: FIFO
• Standards: USB 3.0
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (7x7)

paquet: 56-VFQFN Exposed Pad

FT2232H-56Q-TRAY

FTDI, Future Technology Devices International Ltd

IC DUAL USB TO UART/FIFO 56VQFN

• Protocol: USB
• Function: Bridge, USB to UART,FIFO
• Interface: UART, FIFO
• Standards: USB 2.0
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-VQFN (8x8)

paquet: 56-VFQFN Exposed Pad

VNC2-48L1C-REEL

FTDI, Future Technology Devices International Ltd

IC USB HOST/DEVICE CTRL 48-LQFP

• Protocol: USB
• Function: Controller
• Interface: SPI, UART
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 25mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

FT232HL-REEL

FTDI, Future Technology Devices International Ltd

IC HS USB TO UART/FIFO 48LQFP

• Protocol: USB
• Function: Bridge, USB to UART,FIFO
• Interface: UART, FIFO
• Standards: USB 2.0
• Voltage - Supply: 1.62 V ~ 1.98 V, 2.97 V ~ 3.63 V
• Current - Supply: 24mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

FT907Q-T

FTDI, Future Technology Devices International Ltd

IC MCU 32BIT 256KB FLASH 76VQFN

• Core Processor: FT32
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 320K x 8
• Voltage - Supply (Vcc/Vdd): 2.97 V ~ 3.63 V
• Data Converters: A/D 4x10b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 76-VFQFN Exposed Pad
• Supplier Device Package: 76-QFN (9x9)

paquet: 76-VFQFN Exposed Pad

FT930Q-T

FTDI, Future Technology Devices International Ltd

IC MCU 32BIT 128KB FLASH 68QFN

• Core Processor: FT32
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SD, SPI, UART/USART, USB
• Peripherals: POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.97 V ~ 3.63 V
• Data Converters: A/D 3x10b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-VFQFN Exposed Pad
• Supplier Device Package: 68-QFN (8x8)

paquet: 68-VFQFN Exposed Pad

FT931Q-T

FTDI, Future Technology Devices International Ltd

IC MCU 32BIT 128KB FLASH 56QFN

• Core Processor: FT32
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SD, SPI, UART/USART, USB
• Peripherals: POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.97 V ~ 3.63 V
• Data Converters: A/D 3x10b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

paquet: 56-VFQFN Exposed Pad

FT933Q-T

FTDI, Future Technology Devices International Ltd

IC MCU 32BIT 128KB FLASH 48QFN

• Core Processor: FT32
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SD, SPI, UART/USART, USB
• Peripherals: POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.97 V ~ 3.63 V
• Data Converters: A/D 3x10b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

paquet: 48-VFQFN Exposed Pad

FT51AQ-T

FTDI, Future Technology Devices International Ltd

IC MCU 8BIT 16KB MTP 48QFN

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: Multi-Time Programmable (MTP)
• EEPROM Size: -
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-WFQFN Exposed Pad
• Supplier Device Package: 48-WQFN (7x7)

paquet: 48-WFQFN Exposed Pad

VM800B50A-PL

FTDI, Future Technology Devices International Ltd

BOARD EVAL FT800 5.0 LCD PRL BZL

• Display Type: TFT - Color
• Display Mode: Transmissive
• Touchscreen: Resistive
• Diagonal Screen Size: 5" (127.00mm)
• Viewing Area: 126.70mm W x 82.20mm H
• Backlight: LED - White
• Dot Pixels: 480 x 272
• Interface: SPI, USB
• Graphics Color: Red, Green, Blue (RGB)
• Background Color: -

paquet: -

VM801B50A-BK

FTDI, Future Technology Devices International Ltd

BOARD EVAL FT801 5.0 LCD BLK BZL

• Display Type: TFT - Color
• Display Mode: Transmissive
• Touchscreen: Capacitive
• Diagonal Screen Size: 5" (127.00mm)
• Viewing Area: 126.70mm W x 82.20mm H
• Backlight: LED - White
• Dot Pixels: 480 x 272
• Interface: I2C, SPI, USB
• Graphics Color: Red, Green, Blue (RGB)
• Background Color: -

paquet: -

VM800B43A-BK

FTDI, Future Technology Devices International Ltd

BOARD EVAL FT800 4.3 LCD BLK BZL

• Display Type: TFT - Color
• Display Mode: Transmissive
• Touchscreen: Resistive
• Diagonal Screen Size: 4.3" (109.22mm)
• Viewing Area: 111.50mm W x 73.50mm H
• Backlight: LED - White
• Dot Pixels: 480 x 272
• Interface: SPI, USB
• Graphics Color: Red, Green, Blue (RGB)
• Background Color: -

paquet: -

VI800A-RELAY

FTDI, Future Technology Devices International Ltd

RELAYS OPTO-ISOLATED INPUTS BRID

• Accessory Type: Bridge
• For Use With/Related Products: VM800P Modules

paquet: -

FT-X-GPS

FTDI, Future Technology Devices International Ltd

MOD USB GPS DONGLE

• Function: Receiver
• Modulation or Protocol: GPS
• Frequency: -
• Applications: GPS
• Interface: USB
• Sensitivity: -163dBm
• Power - Output: -
• Data Rate (Max): -
• Features: -

paquet: -

FT232BM-REEL

FTDI, Future Technology Devices International Ltd

IC USB UART DEVICE 32LQFP

• Features: Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: -
• Protocol: RS232, RS422, RS485
• Data Rate (Max): -
• Voltage - Supply: 3 V ~ 5.25 V
• With Auto Flow Control: -
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: -
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

FT2232C-TRAY

FTDI, Future Technology Devices International Ltd

IC USB FS DUAL UART/FIFO 48LQFP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 128 Byte
• Protocol: RS232, RS485
• Data Rate (Max): 1Mbps
• Voltage - Supply: 3 V ~ 5.25 V
• With Auto Flow Control: -
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: -
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

FT602Q-B-R

FTDI, Future Technology Devices International Ltd

IC FIFO 32BIT SYNC UVC 76QFN

• Protocol: USB
• Function: Bridge, USB to FIFO
• Interface: FIFO, I2C, USB
• Standards: USB 3.0, USB 3.1
• Voltage - Supply: 0.9V ~ 1.1V, 1.65V ~ 1.95V, 2.3V ~ 2.7V, 3V ~ 3.6V
• Current - Supply: 185mA
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 76-VFQFN Exposed Pad
• Supplier Device Package: 76-QFN (9x9)

paquet: -

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