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Produits Xilinx Inc.

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XC17S30XLVO8I
Xilinx Inc.

IC 3V PROM SER 300K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 300kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock6 480
XCZU7EV-3FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock5 664
XCZU6CG-L1FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 208
XCZU4EV-3FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock4 560
XC2V80-5FGG256I
Xilinx Inc.

IC FPGA 120 I/O 256FBGA

  • Number of LABs/CLBs: 128
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 147456
  • Number of I/O: 120
  • Number of Gates: 80000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 016
hot XCV50-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 176
  • Number of Gates: 57906
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock5 056
XCV405E-7FG676I
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 573440
  • Number of I/O: 404
  • Number of Gates: 129600
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 304
XC4020E-2PG223I
Xilinx Inc.

IC FPGA 192 I/O 223CPGA

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 192
  • Number of Gates: 20000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 223-BCPGA
  • Supplier Device Package: 223-CPGA (47.25x47.25)
paquet: 223-BCPGA
Stock2 656
XC4013XL-09HT176C
Xilinx Inc.

IC FPGA 145 I/O 176HTQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 145
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-TQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock4 896
hot XC3030-100PC84C
Xilinx Inc.

IC FPGA 74 I/O 84PLCC

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 22176
  • Number of I/O: 74
  • Number of Gates: 2000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: 84-LCC (J-Lead)
Stock6 096
XQ7VX330T-1RF1761M
Xilinx Inc.

IC FPGA VIRTEX-7 330K 1761BGA

  • Number of LABs/CLBs: 25500
  • Number of Logic Elements/Cells: 326400
  • Total RAM Bits: 27648000
  • Number of I/O: 700
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1761-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 560
XC5VFX200T-1FF1738C
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock5 408
XC5VSX95T-2FF1136C
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 7360
  • Number of Logic Elements/Cells: 94208
  • Total RAM Bits: 8994816
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock7 456
XC6VHX255T-2FFG1155C
Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

  • Number of LABs/CLBs: 19800
  • Number of Logic Elements/Cells: 253440
  • Total RAM Bits: 19021824
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 824
XA7A75T-1FGG484I
Xilinx Inc.

IC FPGA 285 I/O 484BGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock4 944
XQ6SLX75T-DIE0628
Xilinx Inc.

IC FPGA SPARTAN 6 75K DIE

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: 1.2 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock7 648
hot XC3S2000-4FG456C
Xilinx Inc.

IC FPGA 333 I/O 456FBGA

  • Number of LABs/CLBs: 5120
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 737280
  • Number of I/O: 333
  • Number of Gates: 2000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock6 624
hot XC3S1200E-4FG320C
Xilinx Inc.

IC FPGA 250 I/O 320FBGA

  • Number of LABs/CLBs: 2168
  • Number of Logic Elements/Cells: 19512
  • Total RAM Bits: 516096
  • Number of I/O: 250
  • Number of Gates: 1200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock5 120
XC7A50T-2FTG256C
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock3 904
hot XC2S200-6FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 200000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock9 420
hot XC2S150-5FG456I
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 150000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock17 052
hot XC6SLX25-2FTG256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock17 244
hot XC6SLX16-2CSG324I
Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 232
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock4 272
hot XC6SLX16-2CPG196C
Xilinx Inc.

IC FPGA 106 I/O 196CSBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 196-TFBGA, CSBGA
  • Supplier Device Package: 196-CSPBGA (8x8)
paquet: 196-TFBGA, CSBGA
Stock5 728
XCR3512XL-10FT256C
Xilinx Inc.

IC CPLD 512MC 9NS 256BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 12000
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock7 152
XCR3256XL-12PQG208I
Xilinx Inc.

IC CPLD 256MC 10.8NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 10.8ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock3 024
hot XC9536XL-10CS48C
Xilinx Inc.

IC CPLD 36MC 10NS 48CSP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
paquet: 48-FBGA, CSPBGA
Stock17 364
XC7S15-1FTGB196I
Xilinx Inc.

XC7S15-1FTGB196I

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 368640
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 196-LBGA, CSPBGA
  • Supplier Device Package: 196-CSBGA (15x15)
paquet: 196-LBGA, CSPBGA
Stock5 232